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K4B4G1646E-BCNB
+BOM4Gbit 1.425V~1.575V 1.066GHz DDR3 SDRAM FBGA-96 Memory (ICs) RoHS
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제조업체삼성
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제조업체 부품 #K4B4G1646E-BCNB
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재고4410
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사양
| 속성 | 가치 |
| Packaging | FBGA-96 |
| Clock Frequency | 1.066GHz |
| Current - Supply | 120mA |
| Memory Format | DDR3 SDRAM |
| Memory Size | 4Gbit |
| Operating temperature | 0℃~+95℃ |
| Refresh Current | 2mA |
| Voltage - Supply | 1.425V~1.575V |
개요
Description
This DRAM module is often used in computers and servers to enhance system performance by allowing for the rapid access and temporary storage of data that the CPU frequently uses. As a DDR4 module, it offers benefits like reduced power consumption compared to older generations due to its lower operating voltage, which can be crucial for energy efficiency in large-scale data centers or high-performance computing environments. Moreover, its architecture supports increased bandwidth, making it suitable for applications requiring fast data processing and multitasking capabilities.
Equivalent
1. Hynix H5TQ4G63AFR-PBC
2. Micron MT41J256M16HA-125
3. Kingston KVR16N11/4
4. Nanya NT5CB256M16BP-DI
These equivalents must match key specifications such as capacity, speed, and form factor to be considered suitable replacements.
Features
Pinout
The functions of the pins include:
- Power and Ground Pins: VDD, VDDQ, VSS, and VSSQ for power supply and grounding.
- Command and Address Pins: These include pins like A[0:13] for address input, BA[0:2] for bank address, and control pins such as RAS#, CAS#, and WE# for command inputs.
- Data Pins: DQ[0:15] for bi-directional data input/output.
- Data Strobe Pins: DQS[0:1] and DQS#[0:1] for data strobe signals, both true and complementary.
- Clock Pins: CK and CK# for differential clock inputs.
- Other Control Pins: Such as CKE (Clock Enable), ODT (On-Die Termination), and CS# (Chip Select).
The K4B4G1646E-BCNB is used in applications requiring high-speed data processing and is commonly found in computers, servers, and other electronic devices requiring dynamic memory.
Manufacturer
As a leading company in the semiconductor industry, Samsung Electronics develops and manufactures various types of memory products, including DRAM, NAND flash, and solid-state drives (SSDs). The company is renowned for its innovation, extensive research and development, and significant contributions to the advancement of electronic and digital technologies. Samsung's products are widely used in a range of applications, from consumer electronics such as smartphones and tablets to industrial and enterprise-level computing systems.
Application
1. Computing Devices: Used in PCs, laptops, and servers to provide high-speed data access and multitasking capabilities.
2. Consumer Electronics: Integrated into gaming consoles, smart TVs, and digital cameras for enhanced performance.
3. Networking Equipment: Utilized in routers and switches for improved data processing and network efficiency.
4. Embedded Systems: Employed in industrial automation and automotive systems requiring robust memory solutions.
5. Mobile Devices: Found in smartphones and tablets where power efficiency and performance are critical.
Package
Frequently Asked Questions
Q: What is the memory density and configuration of K4B4G1646E-BCNB?
A: It is a 4Gbit DDR3 SDRAM organized as 256M x16, via FBGA-96 package.
Q: Can this IC operate at 1.066GHz clock frequency without stability issues?
A: Yes, it supports 1.066GHz (DDR3-2133) data rate; ensure proper power decoupling and layout for stable operation.
Q: What is the recommended VDD and VDDQ supply voltage range?
A: It requires 1.425V to 1.575V, typically 1.5V, compatible with standard DDR3 power rails.
Q: Does this part support commercial or industrial temperature ranges?
A: It supports 0℃ to +95℃ operating temperature, suitable for commercial and some extended temperature applications.
Q: What is the typical active current consumption?
A: Typical supply current is 120mA per device; refresh current is 2mA, ensuring low power during self-refresh.
Q: Is K4B4G1646E-BCNB compatible with standard DDR3 memory controllers?
A: Yes, it complies with DDR3 SDRAM standard, fully compatible with JEDEC DDR3-2133 controllers.
Q: What package type does this component use?
A: It is supplied in FBGA-96 (Fine-pitch Ball Grid Array) package, suitable for high-density PCB assembly.