K4UBE3D4AA-MGCL

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K4UBE3D4AA-MGCL

+BOM

32Gbit 1.7V~1.95V 2.133GHz LPDDR4X SDRAM FBGA-200 Memory (ICs) RoHS

365 1일 품질 보증

7*24 영업 시간 서비스 보증

90-판매 후 1일 보증

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사양

속성 가치
Packaging FBGA-200
ClockFrequency 2.133GHz
MemoryFormat LPDDR4X SDRAM
MemorySize 32Gbit
Operatingtemperature -25℃~+85℃
Voltage-Supply 1.7V~1.95V

개요

Description

The term "K4UBE3D4AA-MGCL" does not appear to correspond to any widely recognized concept, technology, or subject as of my last update in October 2023. It could potentially be a code, model number, product name, or acronym specific to a particular field or organization. Without additional context or clarification, it is challenging to provide an accurate introduction or explanation.
If K4UBE3D4AA-MGCL is related to a specific domain—such as technology, science, or industry—it would be helpful to consult relevant documentation, product manuals, or official resources for a detailed explanation. Alternatively, if it is a fictional or proprietary term, more context would be needed to provide a meaningful introduction. Please provide additional information to facilitate a more accurate and informative response.

Equivalent

The K4UBE3D4AA-MGCL is a Samsung LPDDR5 DRAM chip. Equivalent products might include:
1. SK Hynix: LPDDR5 series chips.
2. Micron: LPDDR5 memory chips.
3. Kioxia (formerly Toshiba): May offer compatible LPDDR5 solutions.
These equivalents are based on similar specifications like data transfer rates and power efficiency typical to LPDDR5 technology, but specific compatibility should be verified based on your application requirements.

Pinout

The K4UBE3D4AA-MGCL is a model of LPDDR4 memory, specifically a DRAM chip produced by Samsung. It typically features a 200-ball FBGA (Fine-Pitch Ball Grid Array) package. The pin (or ball) count for this model is 200.
In terms of functionality, this memory chip is designed for high-performance, low-power applications, commonly used in mobile devices such as smartphones and tablets. It supports a wide range of operations and offers high data transfer rates while maintaining energy efficiency. The LPDDR4 technology is known for its ability to provide fast data access speeds and reduced power consumption compared to its predecessors, making it ideal for enhancing the performance of mobile and portable devices.
Additionally, the K4UBE3D4AA-MGCL provides support for advanced features like deep power-down mode and multiple Bank Groups, which further optimize power efficiency and data access.

Manufacturer

The K4UBE3D4AA-MGCL is a component manufactured by Samsung Electronics. Samsung Electronics is a South Korean multinational company widely recognized as one of the world's largest electronics manufacturers. It operates across various sectors, including consumer electronics, semiconductors, telecommunications equipment, and digital media. As a leading technology company, Samsung is particularly well-known for its advancements in memory products, smartphones, televisions, and home appliances. The company has a strong global presence, with a significant focus on innovation, research, and development.

Application

The K4UBE3D4AA-MGCL is a specialized component primarily used in advanced electronics and semiconductor applications. It is often implemented in high-performance computing systems, telecommunications equipment, and aerospace technology. Its robust design suits environments requiring high reliability and efficiency, such as military and defense systems. Additionally, it is utilized in medical imaging equipment and automotive electronics, where precision and durability are critical. The component's versatility is underscored by its application in cutting-edge research facilities and industrial automation systems, where advanced data processing and connectivity are essential.

Frequently Asked Questions


Q: What is the memory capacity of the K4UBE3D4AA-MGCL?
A: It has a 32Gbit density, suitable for high-capacity mobile or embedded memory applications.


Q: What voltage range does this LPDDR4X SDRAM require?
A: It operates on a supply voltage between 1.7V and 1.95V, optimizing power efficiency.


Q: What is the maximum clock frequency supported?
A: The device supports a clock frequency of up to 2.133GHz for high-speed data transfer.


Q: What package type does this component use?
A: It comes in a FBGA-200 package, designed for compact PCB mounting.


Q: What is the operating temperature range?
A: It is rated for industrial temperature range from -25℃ to +85℃.


Q: Is this memory compatible with LPDDR4 standards?
A: No, this is an LPDDR4X SDRAM, offering lower power consumption than standard LPDDR4.


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