사양
| 속성 | 가치 |
| Package | Tray |
| Series | ECP5 |
| ProductStatus | Active |
| NumberofLABs/CLBs | 11000 |
| NumberofLogicElements/Cells | 44000 |
| TotalRAMBits | 1990656 |
| NumberofI/O | 203 |
| Voltage-Supply | 1.045V ~ 1.155V |
| MountingType | Surface Mount |
| OperatingTemperature | 0°C ~ 85°C (TJ) |
| Package/Case | 381-FBGA |
개요
Description
The LFE5U-45F-8BG381C is a Lattice ECP5 FPGA from the Ultra family, featuring 45K LUTs, designed for high-performance, low-power applications. Key specs:
- Package: 381-ball caBGA (8x8mm, 0.8mm pitch).
- Logic: 45,000 LUTs, 3.6Mb embedded memory, 288 DSP slices.
- I/O: Supports LVDS, LVCMOS, and other standards.
- Performance: Up to 500 MHz core frequency.
- Power: Optimized for low power with 1.0V core voltage.
- Interfaces: PCIe, Gigabit Ethernet, DDR3 support.
Commonly used in embedded vision, communications, and industrial automation due to its balance of density, power efficiency, and cost. Compatible with Lattice’s Diamond and Radiant design tools.
- Package: 381-ball caBGA (8x8mm, 0.8mm pitch).
- Logic: 45,000 LUTs, 3.6Mb embedded memory, 288 DSP slices.
- I/O: Supports LVDS, LVCMOS, and other standards.
- Performance: Up to 500 MHz core frequency.
- Power: Optimized for low power with 1.0V core voltage.
- Interfaces: PCIe, Gigabit Ethernet, DDR3 support.
Commonly used in embedded vision, communications, and industrial automation due to its balance of density, power efficiency, and cost. Compatible with Lattice’s Diamond and Radiant design tools.
Features
The LFE5U-45F-8BG381C is a Lattice ECP5 FPGA with the following key features:
- Family: ECP5 (5th gen low-power FPGA)
- Logic Cells: 45K LUTs
- Package: 381-ball caBGA (8x8mm, 0.8mm pitch)
- Speed Grade: -8 (performance-optimized)
- I/O Pins: 207 user I/Os
- Memory: 3,888 Kbits embedded RAM
- DSP Blocks: 56 (18x18 multipliers)
- SerDes: Up to 3.2 Gbps per lane (supports PCIe, SGMII)
- On-chip PLLs/DLLs: 4 PLLs, 2 DLLs
- Configuration: Supports SPI, JTAG, and dual-boot
- Power: Low-power 1.1V core voltage
Ideal for embedded vision, communications, and industrial applications due to its balance of performance, power efficiency, and cost.
- Family: ECP5 (5th gen low-power FPGA)
- Logic Cells: 45K LUTs
- Package: 381-ball caBGA (8x8mm, 0.8mm pitch)
- Speed Grade: -8 (performance-optimized)
- I/O Pins: 207 user I/Os
- Memory: 3,888 Kbits embedded RAM
- DSP Blocks: 56 (18x18 multipliers)
- SerDes: Up to 3.2 Gbps per lane (supports PCIe, SGMII)
- On-chip PLLs/DLLs: 4 PLLs, 2 DLLs
- Configuration: Supports SPI, JTAG, and dual-boot
- Power: Low-power 1.1V core voltage
Ideal for embedded vision, communications, and industrial applications due to its balance of performance, power efficiency, and cost.
Application
The LFE5U-45F-8BG381C, a Lattice ECP5 FPGA, is used in:
- Communications: High-speed interfaces like PCIe, Ethernet.
- Embedded Systems: Low-power, compact designs.
- Industrial Automation: Motor control, sensor processing.
- Consumer Electronics: Video processing, IoT devices.
- Aerospace/Defense: Rugged, reliable systems.
- Medical Devices: Signal processing, imaging.
Its low power, small footprint, and high performance make it ideal for cost-sensitive, power-efficient applications.
- Communications: High-speed interfaces like PCIe, Ethernet.
- Embedded Systems: Low-power, compact designs.
- Industrial Automation: Motor control, sensor processing.
- Consumer Electronics: Video processing, IoT devices.
- Aerospace/Defense: Rugged, reliable systems.
- Medical Devices: Signal processing, imaging.
Its low power, small footprint, and high performance make it ideal for cost-sensitive, power-efficient applications.
Package
The LFE5U-45F-8BG381C is a Lattice ECP5 FPGA in a 381-ball caBGA (8x8 mm) package. The "8BG381C" suffix indicates:
- 8: 0.8 mm ball pitch
- BG: caBGA (Chip Array Ball Grid Array)
- 381: 381 balls
- C: Lead-free, RoHS compliant
Compact and suitable for high-density designs.
- 8: 0.8 mm ball pitch
- BG: caBGA (Chip Array Ball Grid Array)
- 381: 381 balls
- C: Lead-free, RoHS compliant
Compact and suitable for high-density designs.
