사양
| 속성 | 가치 |
| Supplier | Lattice Semiconductor Corporation |
| Package / Case | Tray |
| Series | ECP5 |
| Part Status | Active |
| Number of LABs/CLBs | 21000 |
| Number of Logic Elements/Cells | 84000 |
| Total RAM Bits | 3833856 |
| Number of I/O | 205 |
| Voltage - Supply | 1.045V ~ 1.155V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
개요
Description
The LFE5U-85F-8BG381I is an FPGA from Lattice Semiconductor’s LFE5U (ECP5-based) family. It packs about 85k logic elements into a compact 381-ball BGA package (industrial-grade, I), with multiple IO banks, block RAM, DSP resources, and high‑speed transceivers. Designed for low power and high density, it suits mid‑ to high‑end applications such as networking, video/image processing, data path, and embedded control. It’s programmed with Lattice’s design tools (Diamond or Radiant) and supports a broad IP library for rapid implementation. In short, a versatile, power-efficient FPGA for dense, feature-rich designs. If you want, I can cover pinout, memory options, or toolchain steps.
Features
Here are the key features of LFE5U-85F-8BG381I (Lattice LFE5U family):
- 85K Logic Elements (LE)
- 381-ball BGA package (BG381I)
- Embedded memory: M20K RAM blocks and distributed RAM
- DSP blocks for MAC/FP arithmetic
- High-speed I/O with multiple voltage/standards (LVCMOS, LVDS, etc.)
- Multi-PLL/clock management tiles for versatile clocking
- Partial reconfiguration capability
- Low-power operation (suitable for mixed-signal/applications)
- JTAG and in-system programmable options (config interface)
- Rich I/O bank/channel count with flexible I/O topology
Note: Exact RAM block counts, DSP block counts, and transceiver specs vary by device revision; refer to the datasheet for precise numbers.
- 85K Logic Elements (LE)
- 381-ball BGA package (BG381I)
- Embedded memory: M20K RAM blocks and distributed RAM
- DSP blocks for MAC/FP arithmetic
- High-speed I/O with multiple voltage/standards (LVCMOS, LVDS, etc.)
- Multi-PLL/clock management tiles for versatile clocking
- Partial reconfiguration capability
- Low-power operation (suitable for mixed-signal/applications)
- JTAG and in-system programmable options (config interface)
- Rich I/O bank/channel count with flexible I/O topology
Note: Exact RAM block counts, DSP block counts, and transceiver specs vary by device revision; refer to the datasheet for precise numbers.
Pinout
- Pin count: 381 pins (BG381 ball grid array, BG381I package)
- Function: Lattice ECP5 family FPGA (LFE5U-85F), about 85K logic elements, a programmable logic device for high-density digital designs with SERDES/high-speed interfaces.
- Function: Lattice ECP5 family FPGA (LFE5U-85F), about 85K logic elements, a programmable logic device for high-density digital designs with SERDES/high-speed interfaces.
Manufacturer
- Manufacturer: Lattice Semiconductor Corporation (Lattice Semiconductor).
- What kind of company: A fabless semiconductor company that designs and markets programmable logic devices (FPGAs and CPLDs) and outsources wafer fabrication to external foundries.
- What kind of company: A fabless semiconductor company that designs and markets programmable logic devices (FPGAs and CPLDs) and outsources wafer fabrication to external foundries.
Application
Application areas for LFE5U-85F-8BG381I include:
- Industrial automation and control (real-time I/O, signal processing)
- Automotive electronics (sensor processing, cockpit/display interfaces)
- Communications and data-path devices (high-speed SerDes, data routing)
- Video, imaging and edge ML acceleration
- Prototyping and custom DSP/compute accelerators
- Embedded/IoT solutions requiring low power and small footprint FPGAs
- Industrial automation and control (real-time I/O, signal processing)
- Automotive electronics (sensor processing, cockpit/display interfaces)
- Communications and data-path devices (high-speed SerDes, data routing)
- Video, imaging and edge ML acceleration
- Prototyping and custom DSP/compute accelerators
- Embedded/IoT solutions requiring low power and small footprint FPGAs
Package
Package type: 381-ball BGA (BG381) package, 0.8 mm pitch; Industrial temperature range (-40°C to 85°C).
