LPC1114FHN33/303

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LPC1114FHN33/303

+BOM

IC MCU 32BIT 32KB FLASH 32HVQFN

365 1일 품질 보증

7*24 영업 시간 서비스 보증

90-판매 후 1일 보증

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사양

속성 가치
Package / Case Bulk
Series LPC1100XL
Part Status Active
Core Processor ARM® Cortex®-M0
Core Size 32-Bit Single-Core
Speed 50MHz
Connectivity I²C, SPI, UART/USART
Peripherals Brown-out Detect/Reset, POR, WDT
Number of I/O 28
Program Memory Size 32KB (32K x 8)
Program Memory Type FLASH
RAM Size 8K x 8
Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V
Data Converters A/D 8x10b
Oscillator Type Internal
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount

개요

Description

The LPC1114FHN33/303 is a microcontroller from NXP Semiconductors, part of the LPC1100 series based on the ARM Cortex-M0 processor. Designed for cost-sensitive and power-efficient applications, it is ideal for embedded systems requiring low power consumption and high performance.
Key features include:
- Processor: 32-bit ARM Cortex-M0, operating at up to 50 MHz.
- Memory: 32 KB of Flash memory and 4 KB of SRAM.
- I/O Options: Up to 42 GPIO pins, supporting various protocols like UART, I2C, and SPI.
- Timers: Includes multiple 16-bit and 32-bit timers, a PWM block, and watchdog timer.
- Analog Peripherals: Includes a 10-bit ADC with multiple input channels.
With a compact LQFP33 package, it is suitable for space-constrained designs. The LPC1114FHN33/303 provides a robust platform for applications in consumer electronics, automotive, industrial control, and more, offering developers a blend of flexibility and efficiency.

Equivalent

Equivalent products to the LPC1114FHN33/303 microcontroller, which is based on the ARM Cortex-M0, include the STM32F0 series from STMicroelectronics, the ATSAMD20 series from Microchip, and the NXP Kinetis KL03 series. These alternatives offer similar performance and features, such as low power consumption, compact packaging, and essential peripheral interfaces. However, always verify specific requirements and compatibility for your application before selecting a substitute.

Features

The LPC1114FHN33/303 is a microcontroller from NXP Semiconductors, designed for embedded applications. It is part of the LPC1100 series and features an ARM Cortex-M0 processor core, operating at speeds up to 50 MHz. It includes 32 KB of flash memory and 4 KB of SRAM for program and data storage.
The microcontroller offers a variety of peripherals including up to 42 GPIO pins, UART, SPI, I2C interfaces for serial communication, and a 10-bit ADC with eight channels for analog input. It also supports timers and pulse-width modulation (PWM) for precise control of external devices.
The device operates at low power, making it suitable for battery-powered applications, with power-saving modes such as Sleep and Deep-sleep. It is available in a 33-pin HVQFN package, which is compact for space-constrained designs. The LPC1114FHN33/303 provides a cost-effective solution with a balance of performance and efficiency for various applications like consumer electronics, industrial control, and handheld devices.

Pinout

The LPC1114FHN33/303 is a microcontroller from NXP's LPC1100 series, which is based on the ARM Cortex-M0 processor. It comes in an HVQFN33 package, which has a pin count of 33.
Key functions and features include:
- A 32-bit ARM Cortex-M0 CPU, which provides efficient performance for embedded applications.
- Up to 32 kB of Flash memory and 8 kB of SRAM for program and data storage.
- Multiple I/O pins that can be used for various functions like GPIO, ADC, UART, I2C, and SPI interfaces, enhancing communication capability with other devices.
- A 10-bit ADC for analog-to-digital conversions, which is useful in sensor interfacing and signal processing applications.
- Power management features, including multiple low-power modes to optimize energy consumption in battery-powered applications.
- A system tick timer and various general-purpose timers to support time-based functions and event management in embedded systems.
This combination of features makes the LPC1114FHN33/303 suitable for cost-sensitive, low-power applications requiring moderate performance.

Manufacturer

The LPC1114FHN33/303 is manufactured by NXP Semiconductors. NXP is a global semiconductor company that specializes in providing technology solutions and products for various industries. The company focuses on high-performance mixed-signal electronics, and its offerings are used in a range of applications including automotive, industrial, mobile, and communication infrastructure.
NXP is known for its innovations in the fields of secure connectivity and processing solutions. It offers a broad portfolio of products, including microcontrollers, microprocessors, sensors, RF technologies, and power management solutions. NXP's emphasis is particularly strong in automotive electronics, secure identification, and Internet of Things (IoT) applications.
The company operates worldwide and serves a diverse customer base, including original equipment manufacturers (OEMs) and other technology companies. NXP is recognized for its contributions to automotive safety, advanced driver-assistance systems (ADAS), and secure mobile transactions, among other areas. Headquartered in Eindhoven, Netherlands, NXP continues to be a significant player in the semiconductor industry, driving innovation and supporting the advancement of technology across multiple sectors.

Application

The LPC1114FHN33/303 is a low-power ARM Cortex-M0 microcontroller suitable for a range of embedded applications. Key application areas include consumer electronics, industrial automation, and portable devices. It is ideal for motor control, sensor data processing, and low-power IoT devices due to its efficient performance and low energy consumption. Additionally, its small form factor makes it suitable for space-constrained applications such as wearables and compact electronic gadgets. The integrated peripherals and ease of programming make it a popular choice for rapid prototyping and educational purposes.

Package

The LPC1114FHN33/303 is housed in a HVQFN33 (HVQFN - Heat sink Very thin Quad Flat No-lead) package. It is a 33-lead package known for its compact and efficient design, providing good thermal performance and electrical characteristics.

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