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LSM303AGR
+BOMIMUs - Inertial Measurement Units e-Compass with 3D digital linear acceleration sensor, 3D digital magnetic sensor
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제조업체ST마이크로일렉트로닉스(주)
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제조업체 부품 #LSM303AGR
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데이터시트 LSM303AGR DataSheet
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재고26872
365 1일 품질 보증
7*24 영업 시간 서비스 보증
90-판매 후 1일 보증
정품 보증
사양
| 속성 | 가치 |
개요
Description
The accelerometer component is capable of measuring acceleration in three dimensions (X, Y, and Z axes) and can detect orientation, movement, and vibration. The magnetometer, on the other hand, measures the Earth's magnetic field to provide compass heading information, making it useful for navigation and orientation purposes.
The LSM303AGR features low power consumption and supports multiple operating modes to optimize performance for different applications. It communicates via an I2C or SPI interface, allowing for easy integration with microcontrollers. Additionally, the sensor provides high-resolution data, making it suitable for precision applications. Its small form factor and versatility make the LSM303AGR a popular choice in embedded systems.
Equivalent
1. Bosch BMM150 - A digital geomagnetic sensor.
2. TDK InvenSense MPU-9250 - A 9-axis motion tracking device.
3. Honeywell HMC5883L - A 3-axis digital compass IC.
4. Murata SCL3300 - A MEMS inclinometer and accelerometer.
5. NXP FXOS8700CQ - A 6-axis sensor combining accelerometer and magnetometer.
These sensors offer similar functionalities for motion and orientation sensing applications.
Features
1. 3-Axis Accelerometer and Magnetometer: Provides both acceleration and magnetic field measurements for precise orientation and motion detection.
2. High Resolution: The accelerometer can operate at up to ±2g/±4g/±8g/±16g full scales, while the magnetometer offers a full-scale range of ±50 gauss.
3. Low Power Consumption: Designed for energy efficiency, suitable for battery-operated devices.
4. I2C/SPI Interface: Supports both I2C and SPI communication protocols for easy integration with microcontrollers.
5. Embedded Temperature Sensor: Offers additional environmental data for compensation and calibration purposes.
6. Compact Package: Available in a small 2x2 mm LGA package, ideal for space-constrained applications.
7. Embedded Self-Test: Allows for in-field verification of the sensor functionality.
These features make the LSM303AGR suitable for a wide range of applications, including smartphones, wearables, navigation systems, and industrial equipment.
Pinout
1. VDD: Supply voltage for the sensor.
2. VDD_IO: Supply voltage for the I/O pins.
3. GND: Ground connection.
4. SCL: I²C serial clock line. Used for communication in I²C mode.
5. SDA: I²C serial data line. Used for data transmission in I²C mode.
6. CS_A: Chip select for the accelerometer (active low for SPI mode).
7. CS_M: Chip select for the magnetometer (active low for SPI mode).
8. INT1_A: Interrupt pin 1 for the accelerometer.
9. INT2_A: Interrupt pin 2 for the accelerometer.
10. DRDY_M: Data ready signal for the magnetometer.
11. SA0_A: Used to set the least significant bit (LSB) of the accelerometer's I²C slave address.
12. SA1_M: Used to set the LSB of the magnetometer's I²C slave address.
These pins facilitate the LSM303AGR's function as an accelerometer and magnetometer for various applications, such as electronic compasses, tilt-compensated compasses, and other sensor-related tasks.
Manufacturer
Application
1. Consumer Electronics: In smartphones and wearables for orientation detection and screen rotation.
2. Gaming: Motion tracking in gaming controllers for enhanced user experience.
3. Navigation Systems: Used in GPS devices for electronic compasses and dead-reckoning.
4. Drones and Robotics: For stability control, orientation, and navigation.
5. Industrial Applications: In machinery for tilt sensing and vibration analysis.
6. Healthcare Devices: In activity trackers for monitoring movement and posture.
Its compact design and low power consumption make it ideal for portable and battery-operated devices.