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LTM4633MPY#PBF
+BOMDC DC CNVRTR 2X0.8-1.8V 0.8-5.5V
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제조업체 부품 #LTM4633MPY#PBF
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사양
| 속성 | 가치 |
| Series | µModule® |
| Part Status | Active |
| Base Product Number | LTM4633 |
| Type | Non-Isolated PoL Module |
| Number of Outputs | 3 |
| Voltage - Input (Min) | 4.7V |
| Voltage - Input (Max) | 16V |
| Voltage - Output 1 | 0.8 ~ 1.8V |
| Voltage - Output 2 | 0.8 ~ 1.8V |
| Voltage - Output 3 | 0.8 ~ 5.5V |
| Current - Output (Max) | 10A, 10A, 10A |
| Applications | ITE (Commercial) |
| Features | OCP, OVP |
| Operating Temperature | -55°C ~ 125°C |
| Mounting Type | Surface Mount |
| Package | 144-BBGA Module |
| Size / Dimension | 0.59" L x 0.59" W x 0.20" H (15.0mm x 15.0mm x 5.0mm) |
| Supplier Device Package | 144-BGA (15x15) |
| Packaging | Tray |
개요
Description
The LTM4633MPY#PBF is a triple-output μModule DC-DC regulator from Analog Devices (Linear Technology lineage). It integrates three buck regulators, their drivers, MOSFETs, control logic, and an inductor into a single compact module, supplying multiple low-voltage rails from one input source. Key features include high efficiency, fast transient response, programmable output voltages, remote sensing, sequencing, and protections (overcurrent/overtemperature/short-circuit). The MPY suffix denotes the package variant, and PBF indicates Pb-free/RoHS-compliant fabrication. Typical applications are multi-rail power delivery for CPUs/GPUs/FPGA boards, ASICs, and other dense electronic systems where space is at a premium. For exact electrical specs (input range, output voltages, current capability), pinout, and application notes, refer to the LTM4633 data sheet and reference designs.
Manufacturer
Manufacturer: Linear Technology Corporation (product line now part of Analog Devices, Inc.).
What kind of company: a U.S.-based semiconductor company that designs and manufactures analog and mixed‑signal integrated circuits, including power‑management ICs and µModule (power module) products.
What kind of company: a U.S.-based semiconductor company that designs and manufactures analog and mixed‑signal integrated circuits, including power‑management ICs and µModule (power module) products.
Application
Application areas:
- High‑density point‑of‑load VRMs for CPUs/GPUs in servers, workstations, and HPC.
- Power rails for FPGAs/ASICs in data centers and telecom equipment.
- Multi‑rail supplies in network switches, storage controllers, and edge devices.
- Telecom/datacom and industrial automation gear needing compact, efficient PMBus‑controlled DC‑DC with sequencing and telemetry.
- High‑density point‑of‑load VRMs for CPUs/GPUs in servers, workstations, and HPC.
- Power rails for FPGAs/ASICs in data centers and telecom equipment.
- Multi‑rail supplies in network switches, storage controllers, and edge devices.
- Telecom/datacom and industrial automation gear needing compact, efficient PMBus‑controlled DC‑DC with sequencing and telemetry.
Package
It’s a μModule (power module) in a land‑grid‑array (LGA) package; Pb-free variant (PBF).
