MPC8555EVTAPF

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MPC8555EVTAPF

+BOM

IC MPU MPC85XX 833MHZ 783FCBGA

365 1일 품질 보증

7*24 영업 시간 서비스 보증

90-판매 후 1일 보증

정품 보증

사양

속성 가치
Supplier Flip Electronics,NXP USA Inc.
Package / Case Bulk,Tray
Series MPC85xx
Part Status Obsolete
Core Processor PowerPC e500
Number of Cores / Bus Width 1 Core, 32-Bit
Speed 833MHz
Co - Processors / DSP Communications; CPM, Security; SEC
RAM Controllers DDR, SDRAM
Graphics Acceleration No
Ethernet 10/100/1000Mbps (2)
USB USB 2.0 (1)
Voltage - I / O 2.5V, 3.3V
Operating Temperature 0°C ~ 105°C (TA)
Security Features Cryptography, Random Number Generator

개요

Description

The MPC8555EVTAPF is Freescale/NXP’s evaluation board for the MPC8555E PowerQUICC II Pro embedded processor. It’s designed to help developers prototype and validate software and hardware for PowerPC-based networking applications.
Key points:
- CPU/memory: MPC8555E core with onboard flash and DRAM options.
- I/O: typical PowerQUICC II Pro interfaces (Ethernet, PCI/PCI-X, USB, serial/JTAG) and expansion headers.
- Boot and debug: onboard boot ROM/Flash options, JTAG and serial console for debugging.
- Software: vendor BSPs for Linux and RTOSs (e.g., VxWorks, QNX).
Typical use: evaluation of networked embedded systems such as appliances and gateways, requiring multiple interfaces and real-time performance.
Note: exact features vary by revision; consult the MPC8555EVTAPF user guide for precise specs and pinouts.

Equivalent

Direct equivalents aren’t available outside the MPC85xx family. The closest pin/feature-compatible options are other MPC85xx PowerQUICC II Pro devices, e.g., MPC8555, MPC8554E, and MPC8560. For exact compatibility (pinout, peripherals, memory map), use the Freescale/NXP Product Selector to compare parts.

Features

Here are the typical features of the MPC8555EVTAPF evaluation board (MPC8555 PowerQUICC III Pro):
- CPU: Freescale/NXP MPC8555 PowerPC 32-bit core (PowerQUICC III Pro family).
- Clock: On-board clocking for CPU up to about 1 GHz (board specific).
- Memory: On-board DDR2 SDRAM with flash memory; expansion options available.
- High-speed interfaces: PCI-X and PCI expansion options; integrated Ethernet MACs for network connectivity.
- Ethernet: Support for standard Ethernet connectivity (10/100/1000 Mbps as implemented on the board).
- USB: USB 2.0 host/device functionality.
- Serial/IO: Multiple UARTs, I2C, SPI for peripheral communication; GPIO for general I/O.
- DMA and peripherals: DMA engine, timers, watchdog, and other common PPC peripherals.
- Debug/Development: JTAG (IEEE 1149.1) for in-circuit debugging; serial console.
- Boot/OS support: Linux, VxWorks, and other PPC RTOS support on supported toolchains.
- Expansion and ruggedness: On-board expansion headers, carrier/slot interfaces; industrial temperature range.
Note: Exact counts and speeds may vary by board revision.

Pinout

Pin count: Depends on the package; MPC8555EVTAPF is the EVT (evaluation) high-pin-count BGA variant, so exact pin count must be taken from the datasheet for the EVTAPF package.
Function: MPC8555E is a PowerQUICC III embedded communications processor (PowerPC core) with integrated peripherals (Ethernet MACs, PCI/PCIe, memory controllers, etc.). For the exact pin count, refer to the MPC8555E EVTAPF package documentation.

Manufacturer

- Manufacturer: Freescale Semiconductor, Inc. (now part of NXP Semiconductors).
- What kind of company: A global semiconductor company that designs and manufactures embedded processors, microcontrollers, and other integrated circuits for automotive, networking, industrial, and consumer markets.

Application

Typical application areas for MPC8555EVTAPF (PowerQUICC II Pro-based) include:
- Embedded networking/telecom platforms: edge routers, switches, VPN/firewall gateways
- Carrier-grade gateways and multiservice service nodes
- Security appliances with hardware acceleration (VPN, firewall, IDS/IPS)
- Storage networking controllers and data-center accelerators
- Industrial automation and control systems
- Embedded multimedia and video surveillance devices
These boards are designed for high-performance, feature-rich embedded networking and communications solutions.

Package

PBGA (Plastic Ball Grid Array) package.

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