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MT29F2G08ABBEAH4:E
+BOMIC FLASH 2GBIT PARALLEL 63VFBGA
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제조업체 부품 #MT29F2G08ABBEAH4:E
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사양
| 속성 | 가치 |
| Part Status | Obsolete |
| DigiKey Programmable | Not Verified |
| Memory Type | Non-Volatile |
| Memory Format | FLASH |
| Technology | FLASH - NAND |
| Memory Size | 2Gbit |
| Memory Organization | 256M x 8 |
| Memory Interface | Parallel |
| Voltage - Supply | 1.7V ~ 1.95V |
| Operating Temperature | 0°C ~ 70°C (TA) |
| Mounting Type | Surface Mount |
| Package / Case | 63-VFBGA |
| Supplier Device Package | 63-VFBGA (9x11) |
| Base Product Number | MT29F2G08 |
개요
Description
This NAND Flash memory uses a Serial Peripheral Interface (SPI) for communication, ensuring compatibility with a wide range of microcontrollers and processors. It supports various erase and programming operations, contributing to its flexibility in system design. The MT29F2G08ABBEAH4:E is also designed with features that enhance data integrity and wear leveling, extending the device's lifespan. Additionally, it adheres to industry standards for quality and reliability, making it a popular choice for developers seeking efficient storage solutions.
Equivalent
Features
1. Capacity: 2 Gb (Gigabits) of storage, suitable for various applications such as mobile devices, tablets, and embedded systems.
2. Interface: It uses a parallel NAND interface, allowing for high-speed data transfers.
3. Architecture: Designed with a multi-level cell (MLC) architecture, which enables storage of more than one bit per cell, enhancing density.
4. Voltage: Operates typically at a supply voltage of 2.7V to 3.6V.
5. Page Size: Supports a page size of 2048 bytes, with an additional 64 bytes for spare area.
6. Durability: Offers robust performance with high endurance, suitable for applications requiring reliable data retention.
7. Temperature Range: Designed to operate in a wide temperature range, making it versatile for various environments.
This chip is ideal for applications needing reliable, high-density memory solutions.
Pinout
1. Data Pins (DQ0-DQ7): These are the bi-directional data lines used for data input and output.
2. Address Pins (A0-A21): These pins are used to address memory locations within the chip.
3. Control Pins:
- WE (Write Enable): Enables write operations.
- RE (Read Enable): Enables read operations.
- CE (Chip Enable): Activates the chip for communication.
- OE (Output Enable): Allows data output.
4. VCC and VSS: Power supply and ground pins.
5. R/B (Ready/Busy): Indicates the status of the chip, whether it is busy or ready for the next operation.
This chip typically operates in a range of configurations, suitable for various applications in consumer and industrial electronics.
Manufacturer
Micron serves a wide range of markets, including consumer electronics, enterprise storage, and data center solutions. The company focuses on innovation and research and development to push the boundaries of memory technology, aiming to provide high-performance and reliable memory solutions for both individual consumers and large-scale enterprises. Micron is one of the world’s largest suppliers of memory and storage products, and it plays a significant role in the global semiconductor industry.