사양
| 속성 | 가치 |
| Package / Case | Tray |
| Part Status | Obsolete |
| Memory Type | Non-Volatile |
| Memory Format | FLASH |
| Technology | FLASH - NAND |
| Memory Size | 64Gb (8G x 8) |
| Memory Interface | Parallel |
| Clock Frequency | 167 MHz |
| Voltage - Supply | 2.7V ~ 3.6V |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount |
개요
Description
MT29F64G08CBCDBJ4-6ITR:D is Micron’s 64‑Gbit NAND flash device (approximately 8 GBytes). It’s an ONFi-compatible parallel NAND (x8) with multi‑plane capability to boost throughput. Typical organization uses 4 KB user pages with a small spare area (OOB), arranged in blocks, and supports features like multi‑plane programming, cache/accelerated operations, and program/erase suspend via controller support. It is usually MLC NAND, requiring external ECC and wear‑leveling from the host/controller. Endurance is in the low thousands of program/erase cycles; data retention and operating temperature ranges vary by grade (industrial parts often specified down to -40 °C and up to 85 °C). Exact timing, page/spare sizes, block size, ECC requirements, and packaging depend on the specific revision (D) and lot; consult the MT29F64G08CBCDBJ4-6ITR:D datasheet and packaging spec for precise parameters.
Features
MT29F64G08CBCDBJ4-6ITR:D is Micron’s 64 Gbit (8 GByte) 2D NAND Flash device. Key features:
- 2D planar MLC NAND, density 64 Gbit
- Industrial temperature grade (-40°C to 85°C) indicated by the -D suffix
- ONFi-compatible x8 I/O interface
- Page size ≈ 2 KB main area with a spare area (typical); blocks organized for multi-plane access
- Multi-plane operation (e.g., 2-plane) with internal cache for higher throughput
- Built-in ECC (BCH), bad-block management, wear leveling, and data-retention support
- Robust data reliability features including read-disturb management
- Widely supported by standard NAND controllers; optimized for consumer/embedded embedded storage applications
Note: Exact page/spare sizes, block structure, ECC strength, and I/O voltage ranges vary by revision. Refer to the official datasheet for precise electrical specs and timing.
- 2D planar MLC NAND, density 64 Gbit
- Industrial temperature grade (-40°C to 85°C) indicated by the -D suffix
- ONFi-compatible x8 I/O interface
- Page size ≈ 2 KB main area with a spare area (typical); blocks organized for multi-plane access
- Multi-plane operation (e.g., 2-plane) with internal cache for higher throughput
- Built-in ECC (BCH), bad-block management, wear leveling, and data-retention support
- Robust data reliability features including read-disturb management
- Widely supported by standard NAND controllers; optimized for consumer/embedded embedded storage applications
Note: Exact page/spare sizes, block structure, ECC strength, and I/O voltage ranges vary by revision. Refer to the official datasheet for precise electrical specs and timing.
Pinout
- Pin count: 60 pins (FBGA60 package)
- Function: Micron MT29F64G08CBCDBJ4-6ITR:D is a 64‑Gbit NAND Flash memory (MLC) with an 8‑bit data bus (ONFI‑compliant) used for non-volatile storage.
- Function: Micron MT29F64G08CBCDBJ4-6ITR:D is a 64‑Gbit NAND Flash memory (MLC) with an 8‑bit data bus (ONFI‑compliant) used for non-volatile storage.
Manufacturer
- Manufacturer: Micron Technology, Inc.
- What kind of company: An American multinational semiconductor company that designs and manufactures memory and storage technologies (DRAM, NAND/NOR flash, SSDs) for OEMs and consumers.
- What kind of company: An American multinational semiconductor company that designs and manufactures memory and storage technologies (DRAM, NAND/NOR flash, SSDs) for OEMs and consumers.
Application
MT29F64G08CBCDBJ4-6ITR:D is a high-density NAND flash. Common application areas include:
- Embedded storage in smartphones, tablets, digital cameras, camcorders
- Solid-state drives (SATA/PCIe) and embedded SSDs
- USB flash drives and memory cards (SD/microSD)
- Set-top boxes, smart TVs, gaming consoles
- Automotive infotainment and data-logging systems
- Industrial and embedded equipment requiring durable nonvolatile memory
- Embedded storage in smartphones, tablets, digital cameras, camcorders
- Solid-state drives (SATA/PCIe) and embedded SSDs
- USB flash drives and memory cards (SD/microSD)
- Set-top boxes, smart TVs, gaming consoles
- Automotive infotainment and data-logging systems
- Industrial and embedded equipment requiring durable nonvolatile memory
Package
FBGA (Flip-Chip Ball Grid Array) package.
