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MT40A1G16RC-062E:B
+BOMIC DRAM 16GBIT PARALLEL 96FBGA
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제조업체미광과학기술주식유한회사.
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제조업체 부품 #MT40A1G16RC-062E:B
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사양
| 속성 | 가치 |
| PartStatus | Obsolete |
| BaseProductNumber | MT40A1G16 |
| DigiKeyProgrammable | Not Verified |
| MemoryType | Volatile |
| MemoryFormat | DRAM |
| Technology | SDRAM - DDR4 |
| MemorySize | 16Gbit |
| MemoryOrganization | 1G x 16 |
| MemoryInterface | Parallel |
| ClockFrequency | 1.6 GHz |
| WriteCycleTime-Word,Page | 15ns |
| Voltage-Supply | 1.14V ~ 1.26V |
| OperatingTemperature | 0°C ~ 95°C (TC) |
| MountingType | Surface Mount |
| Package | 96-TFBGA |
| SupplierDevicePackage | 96-FBGA (10x13) |
| Packaging | Tray |
| AccessTime | 19 ns |
개요
Description
Key features include a data transfer rate that aligns with DDR4's improved performance specifications, operating at a high frequency, typically around 3200 MT/s (Megatransfers per second). It operates at a standard voltage of 1.2V, which is lower than previous generations, aiding in power efficiency and reducing heat output. The "-062E:B" likely specifies particular binning or speed grade characteristics unique to this model, possibly indicating variations in speed or other performance metrics tailored for specific applications. This memory module supports features like ECC (Error-Correcting Code) for enhanced data integrity and reliability, making it ideal for critical applications.
Equivalent
1. Samsung K4A8G165WB-BCRC: Similar density and speed for DDR4 applications.
2. Hynix H5AN8G6NAFR-UHC: Comparable DDR4 memory chip in terms of capacity and performance.
3. Kingston D4NG8G0830N: Another DDR4 memory option with matching specifications.
These alternatives are suitable for applications needing similar capacity and performance characteristics. Always verify the specific requirements and compatibility for your use case.
Features
1. Capacity: 16 Gb (Gigabits).
2. Speed: Operates at a data rate of 3200 MT/s (million transfers per second).
3. Voltage: Standard operation at 1.2V, which contributes to energy efficiency.
4. Organization: Configured in a x16 organization (1G x 16).
5. Package: Available in a 96-ball FBGA (Fine-pitch Ball Grid Array) package, which is designed for compact and high-density applications.
6. Temperature Range: Typically supports standard operating temperature ranges suitable for commercial applications.
7. Row Cycle Time (tRC): Efficient row cycle timing for balanced performance.
8. On-Die Termination (ODT): Includes features for improved signal integrity.
9. Low Power Consumption: Features designed for reduced power usage without compromising performance.
10. Reliability: Incorporates features for enhanced reliability and data integrity.
These features make the MT40A1G16RC-062E:B suitable for a wide range of computing applications, from consumer electronics to enterprise systems.
Pinout
Pin Count:
- It features 96 pins in the form of solder balls on the underside of the package.
Function:
- This memory chip is designed for use in a variety of applications, including computing and networking equipment. It supports high-speed data transfer rates with DDR4 technology and is used for system memory in computers and servers.
- The chip supports features like on-die termination (ODT), dynamic random access memory (DRAM) power-saving modes, and various refresh capabilities.
For detailed specifications and configurations such as pin assignments, electrical characteristics, and operational details, consulting the official datasheet from Micron is recommended.
Manufacturer
Application
1. Servers and Data Centers: Enhances performance and efficiency in high-density environments.
2. Networking Equipment: Supports high-speed data processing and transmission.
3. High-Performance Computing: Used in workstations and gaming systems for improved performance.
4. Embedded Systems: Incorporated in advanced embedded applications needing fast data access.
5. Telecommunications: Assists in managing large data volumes for communication systems.
6. Consumer Electronics: Used in smart TVs and gaming consoles for better performance.
These applications benefit from its high speed, capacity, and energy efficiency.
Package
Frequently Asked Questions
Q: What is the memory capacity and organization of the MT40A1G16RC-062E:B?
A: It has a 16Gbit capacity organized as 1G x 16, providing high-density volatile storage for parallel data processing.
Q: What is the maximum clock frequency and access time?
A: The clock frequency is 1.6 GHz, with a typical access time of 19 ns, ensuring fast data read and write operations.
Q: What voltage supply range does this DDR4 SDRAM require?
A: It operates within a supply voltage range of 1.14V to 1.26V, compliant with standard DDR4 power specifications.
Q: Is this component suitable for high-temperature applications?
A: Yes, its operating temperature range is 0°C to 95°C (TC), making it ideal for thermally demanding environments.
Q: What package type and mounting style does it use?
A: It comes in a 96-TFBGA package (10x13mm) for surface mount technology, enabling compact PCB layouts.
Q: Can this memory be used in high-speed server or networking systems?
A: Yes, with 1.6 GHz clock speed and parallel interface, it is optimized for high-bandwidth applications like servers and network switches.
Q: What is the write cycle time for word and page operations?
A: The write cycle time is 15 ns, ensuring efficient page and word-level data updates.
Q: Is the MT40A1G16RC-062E:B part currently in production?
A: No, its part status is listed as Obsolete, so it may be suitable for legacy or replacement designs.