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MT41K512M16HA-125IT:A
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제조업체Micron Technology
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제조업체 부품 #MT41K512M16HA-125IT:A
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사양
| 속성 | 가치 |
| EU Ro HS | Compliant |
| ECCN (US) | EAR99 |
| Part Status | Obsolete |
| Automotive | No |
| PPAP | No |
| Process Technology | CMOS |
| Minimum Operating Supply Voltage (V) | 1.283 |
| Typical Operating Supply Voltage (V) | 1.35 |
| Maximum Operating Supply Voltage (V) | 1.45 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 95 |
| Supplier Temperature Grade | Industrial |
| Mounting Type | Surface Mount |
| Package Height | 1.26 - 0.29(Min) |
| Package Width | 9 |
| Package Length | 14 |
| PCB changed | 96 |
| Package / Case | BGA |
| Supplier Device Package | FBGA |
| Pin Count | 96 |
| Lead Shape | Ball |
| Chip Density (bit) | 8G |
| Number of Bits / Word (bit) | 16 |
| Data Bus Width (bit) | 16 |
| Maximum Clock Rate (M Hz) | 1600 |
| DRAM Type | DDR3L SDRAM |
| Organization | 512Mx16 |
| Number of Internal Banks | 8 |
| Number of Words per Bank | 64M |
| Address Bus Width (bit) | 19 |
| Operating Current (m A) | 185 |
| Number of I / O Lines (bit) | 16 |
개요
Description
The chip utilizes aFBGA (Fine Ball Grid Array) packaging for efficient space utilization on PCBs (Printed Circuit Boards), making it suitable for various embedded systems and consumer electronics. It supports various modes such as burst lengths of 8 and 4, which enhances data throughput and efficiency.
With a focus on low power consumption and high reliability, the MT41K512M16HA-125IT:A is ideal for applications in computing, networking, and mobile devices. Its integration helps improve system performance while maintaining energy efficiency.
Equivalent
Features
- Capacity: 512Mb (megabits) or 64MB (megabytes) per die.
- Organization: 16 bits wide (x16) with a configuration of 32Mx16.
- Speed: Operates at a data rate of 1600 MT/s (megatransfers per second).
- Voltage: Core voltage of 1.5V, compatible with DDR3 standards.
- Package: 78-ball, 8mm x 6mm FBGA (Fine Ball Grid Array) package.
- Latency: Supports multiple latency settings (CL=11, CL=10).
- Features: Includes self-refresh, write leveling, and on-die termination (ODT).
- Temperature Range: Commercial grade with a temperature range of 0°C to 95°C.
- Applications: Suitable for various applications including consumer electronics, networking, and industrial devices.
This chip is designed for high-performance applications requiring efficient data handling and lower power consumption.
Pinout
Key functions of the pins include:
1. Data Pins (DQ0-DQ15): 16 bits of data input/output.
2. Address Pins (A0-A12, BA0-BA1): Used for addressing the memory locations.
3. Control Pins: Include CS (Chip Select), RAS (Row Address Strobe), CAS (Column Address Strobe), WE (Write Enable), and other control signals for memory operations.
4. Clock Pins (CK, CK#): Differential clock inputs.
5. Power and Ground Pins: Provide power supply and ground reference for the chip.
This chip is suitable for various applications requiring efficient memory solutions, such as computing and embedded systems.
Manufacturer
Micron is known for its innovation in memory technologies and plays a significant role in the advancement of data storage solutions. The MT41K512M16HA-125IT:A is a DDR4 DRAM memory chip, which is commonly used in a range of applications from personal computers to enterprise servers. Micron emphasizes quality, performance, and efficiency in its products and is committed to sustainability and responsible manufacturing practices. Overall, Micron Technology is a key player in the semiconductor industry with a strong focus on memory and storage products.
Application
Package
Frequently Asked Questions
Q: Is this memory suitable for high-reliability industrial applications?
A: Yes. With an industrial temperature range of -40°C to 95°C, it is designed for harsh environments.
Q: What is the typical voltage requirement for this DDR3L SDRAM?
A: It operates at a low 1.35V (supports down to 1.283V), making it ideal for power-sensitive designs.
Q: What total density and data width does this chip provide?
A: It is organized as 512M x 16, offering an 8 Gigabit density with a 16-bit data bus width.
Q: What is the maximum clock rate for a standard DDR3L-1600 interface?
A: It supports a maximum clock rate of 1600 MHz for high-speed data throughput.
Q: What is the package type and pin count for this component?
A: It comes in a 96-ball FBGA (Fine-Pitch Ball Grid Array) package for surface mounting.
Q: Does this chip meet RoHS environmental compliance standards?
A: Yes, the specifications confirm it is EU RoHS compliant.
Q: What is the typical operating current for this 8Gb memory?
A: The typical operating current is 185 mA at standard operating conditions.