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DRAM DDR2 2G 128MX16 FBGA
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제조업체마이크로미터
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제조업체 부품 #MT47H128M16RT-25E AAT:C
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재고7882
365 1일 품질 보증
7*24 영업 시간 서비스 보증
90-판매 후 1일 보증
정품 보증
사양
| 속성 | 가치 |
| Packaging | Tray |
| Standard Pack Qty | 1260 |
개요
Description
The "25E" in its name indicates a specific speed grade and timing parameter, with CL (CAS Latency) specifications tailored for optimal performance. The "AAT:C" denotes certain attributes related to temperature range and testing conditions. This chip is often used in computing environments requiring reliable and efficient memory solutions, such as desktops, laptops, networking equipment, and consumer electronics. It supports features like auto-refresh and self-refresh to maintain data integrity and offers compatibility with JEDEC standards, ensuring interoperability with other components.
Equivalent
Features
1. Density and Configuration: It has a 2Gb density with a configuration of 128M x 16 bits.
2. Speed and Performance: Operates at a frequency of 400 MHz, providing a data rate of DDR2-800.
3. Latency: CAS latency options are available to suit performance needs, typically ranging from CL3 up to CL6.
4. Voltage: It operates at a standard voltage of 1.8V, which helps in power efficiency.
5. Packaging: Comes in a 84-ball FBGA package, suitable for compact designs.
6. Temperature Range: Capable of operating across a wide temperature range, making it suitable for various applications.
7. Error Correction: Supports error correction features to enhance data integrity.
8. Compatibility: Compatible with a range of processors and controllers, making it versatile for use in different systems.
These features make it suitable for applications in computing, networking, and other sectors requiring reliable and efficient memory solutions.
Pinout
Key functions include:
1. Data Storage and Retrieval: The DRAM stores data in a matrix of memory cells and provides high-speed data retrieval.
2. Double Data Rate (DDR): Data is transferred on both the rising and falling edges of the clock signal, effectively doubling the data rate without increasing the clock frequency.
3. Burst Mode Operation: Supports burst lengths of 4 or 8, allowing efficient data transfer.
4. CAS Latency Support: Provides multiple CAS latency options for compatibility with various system designs.
This component is typically used in applications requiring high-speed and high-density memory, such as computing and networking devices.
Manufacturer
Application
1. Computing Devices: Desktops, laptops, and servers for efficient data processing and multitasking capabilities.
2. Networking Equipment: Routers, switches, and other networking devices requiring fast data access.
3. Consumer Electronics: Devices like set-top boxes, gaming consoles, and smart TVs for improved performance and speed.
4. Embedded Systems: Utilized in industrial automation, automotive systems, and IoT devices for reliable and quick data handling.
5. Telecommunications: In mobile base stations and other communication infrastructure for enhanced data throughput.
These applications benefit from its high bandwidth and low power consumption characteristics.