MT53E256M32D2DS-053 AAT:B

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MT53E256M32D2DS-053 AAT:B

+BOM

8Gbit 1.1V 1.866GHz LPDDR4 SDRAM WFBGA-200 Memory (ICs) RoHS

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사양

속성 가치
Packaging WFBGA-200
Clock Frequency 1.866GHz
Supply Current 40mA
Memory Format LPDDR4 SDRAM
Memory Size 8Gbit
Operating Temperature -40℃~+105℃
Refresh Current 2mA
Voltage - Supply 1.1V

개요

Description

The MT53E256M32D2DS-053 AAT:B is a type of LPDDR4 DRAM (Low Power Double Data Rate 4 Dynamic Random-Access Memory) chip produced by Micron Technology. This memory chip is designed for use in a variety of electronic devices, including smartphones, tablets, and other mobile computing applications, where low power consumption and high performance are essential.
Key features of the MT53E256M32D2DS-053 AAT:B include high data transfer rates, improved energy efficiency compared to previous DRAM generations, and a compact form factor suitable for modern electronic devices. It supports a wide range of operational frequencies and is capable of delivering fast access times, which is critical for applications that require quick data retrieval and processing. The chip is built using advanced semiconductor process technology, ensuring reliability and robustness for consumer and industrial applications.
Overall, the MT53E256M32D2DS-053 AAT:B is a versatile memory solution that caters to the needs of high-performance, energy-efficient devices in the tech industry.

Equivalent

The MT53E256M32D2DS-053 AAT:B is a Micron LPDDR4X DRAM chip. Equivalent products would include other LPDDR4X chips with similar specifications from manufacturers like Samsung, SK Hynix, or Kingston. Look for options with a 32-bit bus width, similar density (8GB), and comparable performance characteristics. Checking catalogs or datasheets from these manufacturers will provide the most accurate equivalents.

Features

The MT53E256M32D2DS-053 AAT:B is a component in Micron's LPDDR4 (Low Power Double Data Rate 4) DRAM series. Here are its key features:
1. Low Power Consumption: Designed for mobile and embedded applications, it offers reduced power usage, enhancing battery life in portable devices.
2. High-Speed Data Transfer: Supports data rates of up to 4266 MT/s, allowing for efficient handling of high-bandwidth tasks.
3. Die Density: Provides a density of 8Gb (gigabits) per die, catering to applications requiring substantial memory capacity.
4. Package Type: Available in a compact package suitable for space-constrained applications.
5. Voltage: Operates at low voltages, typically around 1.1V, reducing power requirements.
6. Advanced Features: Includes support for features such as Deep Power Down (DPD) mode and Partial Array Self Refresh (PASR) to further minimize power usage during inactive periods.
7. Reliability and Performance: Incorporates error-correcting code (ECC) for improved data integrity and reliability.
This memory module is ideal for smartphones, tablets, and other devices where power efficiency and performance are critical.

Pinout

The MT53E256M32D2DS-053 AAT:B is a DRAM component from Micron's LPDDR4X product line. This particular memory chip features a 178-ball Fine Ball Grid Array (FBGA) package. The primary function of this chip is to serve as a low-power, double data rate, fourth-generation DRAM, which is commonly used in mobile devices and other applications requiring high-density memory with low power consumption.
With 256 Megabits organized as 32M x 32, this LPDDR4X memory chip supports features such as deep power down, clock stop power down, and command-based power-down modes for energy efficiency. Additionally, it supports high-speed data transfer rates thanks to its dual-channel operation, along with features like on-die termination (ODT) and programmable drive strengths to optimize signal integrity. This makes it suitable for mobile devices, tablets, and other portable electronics that demand efficient power management and high performance.

Manufacturer

The MT53E256M32D2DS-053 AAT:B is a DRAM chip manufactured by Micron Technology, Inc. Micron is a leading global company specializing in semiconductor products, primarily known for its memory and storage solutions. The company produces dynamic random-access memory (DRAM), NAND flash memory, and other semiconductor devices used in various technology applications, including consumer electronics, mobile devices, data centers, and automotive industries. Micron is recognized for its innovation in memory technology and plays a significant role in advancing the performance and capacity of electronic devices.

Application

The MT53E256M32D2DS-053 AAT:B is a DRAM memory chip, specifically LPDDR4 (Low Power Double Data Rate 4), designed for high-efficiency, low-power applications. Its application areas include mobile devices such as smartphones and tablets, where extended battery life is crucial. It is also used in notebooks, ultrabooks, and other portable computing devices that require efficient power management. Additionally, this type of memory is suitable for embedded systems, automotive electronics, and IoT devices that benefit from its compact size and low power consumption, helping to enhance performance while reducing overall energy usage.

Package

The MT53E256M32D2DS-053 AAT:B is a DRAM package from Micron Technology. It typically refers to a 3D NAND or DRAM chip package used in various memory modules. The package type specifics, such as dimensions or encapsulation details, are usually defined by the manufacturer, Micron, and can be found in the product's datasheet or technical documentation.