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MX30LF1G18AC-XKI
+BOMIC FLASH 1GBIT PARALLEL 63VFBGA
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제조업체왕홍
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제조업체 부품 #MX30LF1G18AC-XKI
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재고4929
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사양
| 속성 | 가치 |
| Series | MX30LF |
| Part Status | Not For New Designs |
| Base Product Number | MX30LF1 |
| DigiKey Programmable | Not Verified |
| Memory Type | Non-Volatile |
| Memory Format | FLASH |
| Technology | FLASH - NAND |
| Memory Size | 1Gbit |
| Memory Organization | 128M x 8 |
| Memory Interface | Parallel |
| Write Cycle Time - Word, Page | 20ns |
| Voltage - Supply | 2.7V ~ 3.6V |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount |
| Package | 63-VFBGA |
| Supplier Device Package | 63-VFBGA (9x11) |
| Packaging | Tray |
| Access Time | 20 ns |
개요
Description
The MX30LF1G18AC-XKI operates on a 3.3V power supply and supports standard NAND interface protocols, making integration into existing systems straightforward. Its reliability and performance are enhanced by built-in error correction capabilities and wear leveling, which help extend the lifespan of the memory by evenly distributing write and erase cycles. The device is packaged in a compact TSOP (Thin Small Outline Package), allowing for efficient use of space in embedded systems, consumer electronics, and industrial applications. Overall, the MX30LF1G18AC-XKI is a robust solution for devices requiring dependable and efficient NAND Flash storage.
Equivalent
1. K9F1G08U0D from Samsung
2. MT29F1G08ABADA from Micron
3. TC58NVG0S3HTA00 from Toshiba
4. W29N01GVSIAA from Winbond
These products might differ slightly in terms of operating voltage or performance specifications, so it's important to check datasheets for compatibility.
Features
- Density: 1Gb (Gigabit).
- Architecture: 128Mb x 8 bits, organized in 128K pages of 2112 bytes each.
- Page Size: 2048 bytes of data plus 64 bytes of spare area.
- Block Size: 64 pages per block.
- Interface: Supports standard NAND Flash interface protocols.
- Voltage Range: Operates at 3.3V power supply.
- Performance: Fast read access with a typical random read time of 25µs and a sequential read of 25ns per byte.
- Endurance: Offers a typical endurance of 100,000 program/erase cycles.
- Data Retention: 10 years.
- Package Type: Available in a 48-pin TSOP (Thin Small Outline Package) package.
- Error Management: Supports ECC (Error Correction Code) features to ensure data integrity.
- Operating Temperature: Extended industrial temperature range from -40°C to 85°C.
These features make it suitable for applications requiring reliable, large-capacity storage like embedded systems and consumer electronics.
Pinout
Key functions and pin assignments include:
1. Power Supply Pins: Vcc and Vss for the power supply.
2. Data Interface: I/O pins for data input/output operations.
3. Command Latch Enable (CLE): Used to input commands to the device.
4. Address Latch Enable (ALE): Used to input address information.
5. Chip Enable (CE#): Activates the memory chip.
6. Write Enable (WE#): Controls the writing operations.
7. Read Enable (RE#): Controls the reading operations.
8. Ready/Busy (R/B#): Indicates the operational status of the device.
9. Write Protect (WP#): Protects the device from inadvertent programming or erasing.
These functions allow the chip to perform read, write, and erase operations essential for storing and retrieving data. Always refer to the official datasheet for detailed specifications and pin configurations.
Manufacturer
Application
Package
Frequently Asked Questions
Q: Is the MX30LF1G18AC-XKI suitable for new designs?
A: No, the part status is "Not For New Designs," indicating it is not recommended for new projects but may be used for legacy product support.
Q: What is the memory capacity and organization of this NAND Flash?
A: It offers 1Gbit (128M x 8) of non-volatile memory, organized as 128 million 8-bit words, ideal for code and data storage.
Q: What voltage supply range does this component require?
A: It operates within a standard 2.7V to 3.6V supply range, making it compatible with most 3.3V logic systems.
Q: What is the typical access time for read operations?
A: The access time is 20 ns, ensuring fast random read performance suitable for high-speed embedded applications.
Q: Can this device operate in harsh temperature environments?
A: Yes, the operating temperature range is -40°C to 85°C (TA), supporting industrial-grade applications.
Q: Is the memory interface parallel or serial?
A: It uses a Parallel memory interface (standard NAND type), requiring multiple I/O pins for data transfer.
Q: What is the package form factor and mounting type?
A: It comes in a 63-VFBGA (9x11mm) package with Surface Mount mounting, suitable for compact PCB designs.