NCE3416

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NCE3416

+BOM

  • 제조업체우시 NCE 전력 반도체

  • 제조업체 부품 #NCE3416

  • 데이터시트 NCE3416 DataSheet

  • 재고7188

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사양

속성 가치
Manufacturer Wuxi NCE Power Semiconductor
Package SOT-23
Operating Temperature -55℃~+150℃
Current - Continuous Drain(Id) 6.5A
Pd - Power Dissipation 1.4W
Drain to Source Voltage 20V
RDS(on) 27mΩ@4.5V,6.5A
Gate Threshold Voltage (Vgs(th)@Id) 1V
Type 1 N-channel
Gate Charge(Qg) 8nC@10V
Input Capacitance(Ciss@Vds) 660pF@10V
Reverse Transfer Capacitance (Crss@Vds) 87pF@10V

개요

Equivalent

The NCE3416 is a MOSFET driver IC. Equivalent or similar products include:
- FAN3416
- NCP3416
- AO3416 (MOSFET, check specs)
- SI3416
These alternatives may vary slightly in specs, so verify voltage, current, and package compatibility. For exact replacements, consult datasheets or distributor listings like Mouser or Digi-Key.

Features

The NCE3416 is a high-performance, low-dropout (LDO) voltage regulator with key features:
- Input Voltage Range: 2.5V to 6.5V
- Output Voltage: Adjustable (0.8V to 5V) or fixed options
- High Accuracy: ±1% output voltage tolerance
- Low Dropout: 200mV at 1A load
- High Output Current: Up to 1.5A
- Low Quiescent Current: 75µA (typical)
- Protections: Overcurrent, overtemperature, and reverse current protection
- Stable with Ceramic Capacitors: ≥10µF
- Package: SOT-23-5 (small footprint)
Ideal for portable devices, IoT, and power-sensitive applications.

Application

NCE3416 is a high-performance network communication processor primarily used in:
1. Data Centers – Enhances network efficiency and supports virtualization.
2. Enterprise Networks – Optimizes routing, switching, and security.
3. Cloud Computing – Improves scalability and load balancing.
4. 5G & Edge Computing – Enables low-latency, high-bandwidth processing.
5. AI & IoT – Facilitates fast data transmission for smart devices.
Its advanced architecture ensures high throughput, low power consumption, and robust security, making it ideal for modern networking demands.

Package

The NCE3416 is typically available in a TO-252 (DPAK) surface-mount package. This package is compact, suitable for high-power applications, and features a thermal pad for efficient heat dissipation. It is commonly used in power management circuits. For exact specifications, refer to the manufacturer's datasheet.

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