NT5CC256M16DP-DII

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NT5CC256M16DP-DII

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  • 제조업체남아시아 과학기술

  • 제조업체 부품 #NT5CC256M16DP-DII

  • 재고15651

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90-판매 후 1일 보증

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사양

속성 가치
Manufacturer Nanya Tech
Package BGA96

개요

Description

The NT5CC256M16DP-DII is a 256Mb (16M x 16) DDR3 SDRAM chip from Nanya Technology. It operates at 1.5V with speeds up to 1600 Mbps/pin, making it suitable for high-performance computing, networking, and embedded applications.
Key features:
- 16-bit data bus
- CAS Latency (CL): 11, 9, or 7
- Auto-refresh & self-refresh modes
- On-Die Termination (ODT) for signal integrity
- RoHS-compliant, 96-ball FBGA package
It supports burst lengths of 8 and has a prefetch architecture for efficient data transfer. Typical applications include servers, workstations, and industrial systems.
For detailed specs, refer to Nanya’s datasheet.

Equivalent

Equivalent products to the NT5CC256M16DP-DII (4Gb DDR3L SDRAM) include:
- MT41K256M16TW-107:P (Micron)
- K4B4G1646E-BCMA (Samsung)
- H5TC4G63CFR-PBA (SK Hynix)
These are 4Gb (256Mx16) DDR3L chips with similar speed grades (e.g., 1866/1600 Mbps) and voltage (1.35V/1.5V). Verify pin compatibility and timing specs for exact replacements.

Manufacturer

The NT5CC256M16DP-DII is a DDR3 SDRAM module manufactured by Nanya Technology Corporation, a Taiwanese company specializing in memory products.
Nanya Technology is a leading DRAM (Dynamic Random-Access Memory) producer, focusing on the design, development, and manufacturing of memory solutions. It is one of the key players in the global semiconductor industry, competing with companies like Samsung, SK Hynix, and Micron.
The company is known for its cost-effective and reliable memory products, serving applications in consumer electronics, computing, and networking. Founded in 1995, Nanya operates as a subsidiary of Formosa Plastics Group, a major Taiwanese conglomerate.
The NT5CC256M16DP-DII is a 4Gb (256Mx16) DDR3 chip, commonly used in PCs, servers, and embedded systems.

Package

The NT5CC256M16DP-DII is a DDR3 SDRAM chip in a 96-ball FBGA (Fine-pitch Ball Grid Array) package. It has a x16 configuration, operates at 1.5V, and offers 256M x 16 (4Gb) density. The package dimensions are 14mm x 10mm, suitable for high-speed, compact applications like embedded systems and networking devices.

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