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NT5TU32M16FG-ACI
+BOM-
제조업체남아시아 과학기술
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제조업체 부품 #NT5TU32M16FG-ACI
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재고6748
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사양
| 속성 | 가치 |
| EU Ro HS | Compliant |
| ECCN (US) | EAR99 |
| Part Status | Active |
| HTS | 8542.32.00.28 |
| Automotive | No |
| PPAP | No |
| Process Technology | CMOS |
| Minimum Operating Supply Voltage (V) | 1.7 |
| Typical Operating Supply Voltage (V) | 1.8 |
| Maximum Operating Supply Voltage (V) | 1.9 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 95 |
| Supplier Temperature Grade | Industrial |
| Mounting Type | Surface Mount |
| Package Height | 0.8(Max) |
| Package Width | 7.5 |
| Package Length | 12.2 |
| PCB changed | 84 |
| Package / Case | BGA |
| Supplier Device Package | VFBGA |
| Pin Count | 84 |
| Chip Density (bit) | 512M |
| Number of Bits / Word (bit) | 16 |
| Data Bus Width (bit) | 16 |
| Maximum Clock Rate (M Hz) | 800 |
| DRAM Type | DDR2 SDRAM |
| Organization | 32Mx16 |
| Number of Internal Banks | 4 |
| Number of Words per Bank | 8M |
| Address Bus Width (bit) | 15 |
| Operating Current (m A) | 111 |
| Number of I / O Lines (bit) | 16 |
| Maximum Access Time (ns) | 0.4 |
| Interface Type | SSTL_18 |
개요
Description
The device is packaged in a standard FBGA (Fine Ball Grid Array) format, ensuring a compact design for easy integration into circuit boards. It also includes built-in self-refresh and other power-saving features, making it suitable for mobile and energy-efficient devices. Overall, the NT5TU32M16FG-ACI offers a reliable solution for enhancing system memory performance in a wide range of electronic devices.
Equivalent
1. Hynix H5TQ2G83BFR
2. Micron MT8JSF12864HZ-1G6D1
3. Samsung K4B4G1646C
4. Kingston KVR16S11/2
Always verify compatibility with your specific application and motherboard specifications.
Features
Key features include:
- Density: 2GB
- Technology: DDR3 SDRAM
- Data Rate: Up to 1600 MT/s
- Voltage: 1.5V
- Organization: x16
- Package Type: Typically available in a SO-DIMM or DIMM format
This component is ideal for enhancing system memory in computing applications, delivering improved speed and efficiency for multitasking and demanding software.
Pinout
Key pin functions include:
1. Address Pins (A0-A12): Used to select memory locations.
2. Data Pins (DQ0-DQ15): Used for bidirectional data transfer.
3. Control Pins (CLK, CLK#, CS#, RAS#, CAS#, WE#, CKE): Used for timing and control of memory operations.
4. Power Pins (VDD, VSS): Provide power supply and ground connections.
5. DQM Pins (DQM0, DQM1): Used to mask data during read and write operations.
This configuration allows the NT5TU32M16FG-ACI to effectively manage and operate within various memory-intensive applications.
Manufacturer
As a key player in the semiconductor industry, Nanya is known for its innovative memory technologies and aims to deliver high-performance memory solutions. The company operates in a highly competitive environment, collaborating with various technology firms and adhering to international standards to ensure quality and reliability in its products. Nanya is publicly traded on the Taiwan Stock Exchange and has established itself as one of the major DRAM manufacturers globally, contributing to advancements in memory technology and catering to the demand for high-capacity storage solutions.
Application
Package
Frequently Asked Questions
Q: Is this DDR2 SDRAM suitable for industrial temperature applications?
A: Yes, it supports an industrial temperature range from -40°C to +95°C, making it ideal for harsh environments.
Q: What is the maximum clock rate and data rate of this memory?
A: It operates at a maximum clock rate of 800 MHz, corresponding to a DDR2-800 (PC2-6400) effective data rate.
Q: Does this component support a 32Mx16 organization with 512Mb density?
A: Yes, it is organized as 32Mx16 bits, providing a total chip density of 512Mb with a 16-bit data bus.
Q: What is the operating voltage range for this Nanya DDR2 SDRAM?
A: It requires a 1.8V nominal supply, operating between 1.7V and 1.9V for reliable performance.
Q: How many internal banks does this DRAM have, and why does that matter?
A: It contains 4 internal banks, allowing for concurrent access and improved memory bandwidth in multi-bank operations.
Q: What is the typical access time and interface type for this component?
A: Maximum access time is 0.4 ns, and it uses an SSTL_18 interface standard for high-speed DDR2 signaling.
Q: Is this part Pb-free and RoHS compliant for global shipping?
A: Yes, it is EU RoHS Compliant, ensuring environmental safety for worldwide distribution and lead-free assembly processes.