P1011NXE2HFB

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P1011NXE2HFB

+BOM

IC MPU Q OR IQ 800MHZ 689TEBGA

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  • 패키지 PBGA-689

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사양

속성 가치
Package / Case Tray
Series QorIQ P1
Part Status Obsolete
Core Processor PowerPC e500v2
Number of Cores / Bus Width 1 Core, 32-Bit
Speed 800MHz
Co - Processors / DSP Security; SEC 3.3
RAM Controllers DDR2, DDR3
Graphics Acceleration No
Ethernet 10/100/1000Mbps (3)
USB USB 2.0 + PHY (2)
Operating Temperature -40°C ~ 105°C (TA)
Security Features Cryptography, Random Number Generator

개요

Description

The P1011NXE2HFB is a PowerQUICC III processor from NXP Semiconductors, designed for embedded networking and industrial applications. It features a Power Architecture e500 core running at up to 1.2 GHz, delivering high performance for control and data-plane processing.
Key features include:
- Integrated security engine (SEC 3.0) for encryption/decryption
- Dual Gigabit Ethernet controllers
- PCI Express, SATA, and USB 2.0 interfaces
- Low power consumption (optimized for energy efficiency)
Target applications include network routers, switches, industrial automation, and telecom equipment. The P1011NXE2HFB is part of NXP’s QorIQ P1 series, balancing performance and cost for mid-range embedded systems.
For detailed specs, refer to the official NXP datasheet.

Equivalent

The P1011NXE2HFB is a PowerQUICC III processor from NXP. Equivalent or similar products include:
- P1011NSE2HFB (industrial temp range)
- P1021NXE2HFB (higher performance, dual-core)
- P1012NXE2HFB (lower performance variant)
- MPC8536E (older PowerQUICC III alternative)
Check NXP's documentation for exact compatibility, as pinouts and features may vary slightly.

Manufacturer

The P1011NXE2HFB is a PowerQUICC III processor manufactured by NXP Semiconductors. NXP is a global semiconductor company known for producing high-performance mixed-signal and secure connectivity solutions for automotive, industrial, and IoT applications. The P1011 is part of NXP's QorIQ series, designed for embedded networking and communications. NXP, formerly part of Philips, is headquartered in the Netherlands and is a leader in secure, power-efficient semiconductor technologies.

Package

The P1011NXE2HFB is a PowerQUICC III processor from NXP, packaged in a 783-pin FC-PBGA (Flip Chip Plastic Ball Grid Array). This package type is designed for high-performance applications, offering excellent thermal and electrical performance with a flip-chip interconnect for reduced inductance and improved signal integrity.

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