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PC28F256P30TFE

Name: PC28F256P30TFE
Rating: 4.8 (15 reviews)

+BOM

IC FLASH 256MBIT CFI 64EASYBGA

제조업체Alliance Memory, 주식회사.
제조업체 부품 #PC28F256P30TFE
재고17464

365 1일 품질 보증

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사양

속성	가치
Series	StrataFlash™
Part Status	Obsolete
Base Product Number	PC28F256
DigiKey Programmable	Not Verified
Memory Type	Non-Volatile
Memory Format	FLASH
Technology	FLASH - NOR (MLC)
Memory Size	256Mbit
Memory Organization	16M x 16
Memory Interface	CFI
Clock Frequency	52 MHz
Voltage - Supply	1.7V ~ 2V
Operating Temperature	-40°C ~ 85°C (TA)
Mounting Type	Surface Mount
Package	64-TBGA
Supplier Device Package	64-EasyBGA (10x13)
Packaging	Tray
Access Time	100 ns

개요

Description

The PC28F256P30TFE is a 256 Mb (megabit) flash memory device from Intel's StrataFlash® Embedded Memory line. It's designed for use in high-performance embedded applications that require reliable and efficient data storage. This flash memory technology offers high-density storage capabilities, enabling faster access times and improved performance compared to traditional memory solutions.
Key features include a multi-level cell (MLC) architecture that allows each cell to store more than one bit of data, effectively doubling the storage capacity without increasing the physical size of the chip. It supports fast read and write operations, provides robust data integrity, and includes advanced security features to protect stored data.
The PC28F256P30TFE is suitable for a wide range of applications, including industrial automation, automotive systems, and consumer electronics, where high-speed and reliable data storage is crucial. It is designed to operate over a wide temperature range, making it versatile for use in various environmental conditions.

Equivalent

The Intel PC28F256P30TFE is a 256Mb NOR Flash memory chip. Equivalent products are generally NOR flash memory chips with similar capacities and specifications. Some alternatives might include:
1. Micron MT28F256P30B3
2. Spansion (Cypress) S29GL256P
3. Macronix MX29GL256F
These chips offer similar functionality in terms of storage capacity and are used in embedded systems and applications requiring non-volatile memory. Always verify pin compatibility and electrical specifications before replacing.

Features

The PC28F256P30TFE is a NOR Flash memory component from Intel's Advanced+ Boot Block series. It offers a storage capacity of 256 megabits (32 megabytes) and is designed for code and data storage in embedded applications. Key features include:
1. Interface: Operates on a parallel NOR interface, enabling fast access times.
2. Performance: Features a fast read access time, typically around 65 nanoseconds, which enhances application performance by allowing quick data retrieval.
3. Architecture: Organized into 128-kilobyte blocks, allowing efficient block erasure and flexible code and data storage.
4. Endurance: Supports up to 100,000 program/erase cycles per block, ensuring reliable performance over time.
5. Power Efficiency: Includes power-efficient features like deep power-down mode and low-power read, reducing overall energy consumption.
6. Data Integrity: Equipped with error-correction code (ECC) support to maintain data integrity.
7. Temperature Range: Suitable for industrial applications, with an operational temperature range typically from -40°C to +85°C.
These features make the PC28F256P30TFE suitable for various applications, including automotive, industrial, and consumer electronics, where reliable and efficient memory storage is critical.

Pinout

The PC28F256P30TFE is a 256 Mb (megabit) NOR Flash memory device from Intel's StrataFlash® Embedded Memory P30 product line.
Pin Count:
- The device typically comes in a 56-pin TSOP (Thin Small Outline Package) or a 64-ball BGA (Ball Grid Array) package, depending on the specific variant.
Functions:
- Memory Storage: Provides non-volatile storage for code and data, retaining information without power.
- Read/Write Operations: Supports fast read and write operations, enabling efficient program execution and data handling.
- Erase Capability: Includes block erase functionality, allowing selective erasure of memory blocks.
- Compatibility: Complies with Common Flash Memory Interface (CFI) standards, ensuring compatibility with various systems.
- Protection Features: Offers security features such as block locking and protection against erroneous writes.
- Performance: Designed for high-speed performance with low power consumption, suitable for embedded applications.
This memory is typically used in embedded systems that require reliable, high-speed flash memory.

Manufacturer

The PC28F256P30TFE is a flash memory chip manufactured by Intel Corporation. Intel is a multinational corporation and technology company headquartered in Santa Clara, California. It is widely recognized as one of the largest and most influential companies in the semiconductor industry. Intel is known for designing and manufacturing microprocessors, integrated circuits, and various other hardware components used in computers and other electronic devices. The company plays a significant role in advancing technology and innovation, contributing to the development of processors and memory products that are integral to modern computing.

Application

The PC28F256P30TFE is a high-density, high-performance flash memory device suitable for a variety of applications. It is commonly used in embedded systems, telecommunications, and consumer electronics due to its fast read/write capabilities and reliable data storage. Applications include mobile devices, digital cameras, set-top boxes, and networking equipment. Its robust performance makes it ideal for systems requiring quick data access and frequent updates. Additionally, it supports code and data storage, offering flexibility for developers in designing efficient, high-speed applications.

Package

The PC28F256P30TFE is a memory chip, specifically a 256Mb (megabit) NOR Flash memory. It typically comes in a TSOP (Thin Small Outline Package) type, which is used for its compact size and efficient heat dissipation.

Frequently Asked Questions

Q: What is the memory density and organization of the PC28F256P30TFE?
A: It has a density of 256Mbit, organized as 16M x 16 bits, suitable for high-density code or data storage.

Q: Does this component support synchronous operation?
A: No, it uses a CFI (Common Flash Interface) interface with a maximum clock frequency of 52 MHz, operating asynchronously with a 100 ns access time.

Q: What is the operating voltage range for this NOR Flash memory?
A: It operates at 1.7V to 2V, making it ideal for low-power embedded applications requiring a single power supply.

Q: Is this Flash memory suitable for industrial temperature environments?
A: Yes, its operating temperature range is -40°C to 85°C (TA), supporting harsh industrial or automotive-grade designs.

Q: What package options are available for this device?
A: It is supplied in a 64-TBGA package, specifically a 64-EasyBGA (10x13 mm) surface-mount format, suitable for compact PCB layouts.

Q: Is the PC28F256P30TFE programmable via standard Flash tools?
A: Yes, it uses CFI interface, compatible with standard Flash programmers and complies with NOR MLC programming algorithms.

Q: What is the typical access time for read operations?
A: The access time is 100 ns, ensuring fast random read performance for code execution (XiP) applications.