QCC3040

이미지는 참조용입니다.

QCC3040

+BOM

  • 제조업체국태

  • 제조업체 부품 #QCC3040

  • 재고18445

365 1일 품질 보증

7*24 영업 시간 서비스 보증

90-판매 후 1일 보증

정품 보증

사양

속성 가치
Manufacturer Gotop
Package / Case VFBGA-90

개요

Description

The QCC3040 is a Bluetooth audio SoC (System-on-Chip) by Qualcomm, part of its QCC30xx series for wireless earbuds and headsets. Key features:
- Bluetooth 5.2 with support for LE Audio and LC3 codec for improved efficiency and audio quality.
- Hybrid ANC (Active Noise Cancellation) for better noise reduction.
- aptX Adaptive and aptX HD support for high-quality, low-latency audio.
- Low power consumption with extended battery life.
- Integrated DSP for voice assistant support (e.g., Google Assistant, Alexa).
- Dual-mode operation (True Wireless Stereo or single-bud use).
Ideal for TWS earbuds, hearing aids, and gaming headsets, the QCC3040 balances performance, power efficiency, and advanced audio features.

Equivalent

The Qualcomm QCC3040 is a Bluetooth audio SoC. Equivalent alternatives include:
- QCC5144: Higher-end, supports ANC and voice assistants.
- QCC3034: Similar features but older.
- BES2300 (Bestechnic): Competing chip with ANC support.
- Realtek RTL8763B: Budget alternative for TWS earbuds.
- Airoha AB1562: Popular in mid-range TWS products.
These chips offer comparable Bluetooth 5.x connectivity and audio features. Choose based on cost and specific needs.

Manufacturer

The QCC3040 is manufactured by Qualcomm, a leading American multinational semiconductor and telecommunications company.
Qualcomm specializes in wireless technology, producing chipsets for mobile devices, Bluetooth audio (like the QCC3040), and 5G modems. Known for innovation in connectivity and processing, Qualcomm is a key player in smartphones, IoT, and automotive industries. The QCC3040 is part of their Bluetooth audio SoC lineup, designed for true wireless earbuds with features like active noise cancellation and low power consumption.
Headquartered in San Diego, California, Qualcomm is a Fortune 500 company with a strong global presence in tech R&D.

Package

The QCC3040 from Qualcomm is a Bluetooth audio SoC, available in a VFBGA (Very Fine Pitch Ball Grid Array) package. It features a compact size, typically 5.5mm x 5.5mm, with a fine-pitch ball arrangement for high-density PCB integration. The package supports advanced audio features like TrueWireless Stereo and ANC, making it ideal for TWS earbuds and wireless audio devices.