R7F702301BFABG-C#BC8

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R7F702301BFABG-C#BC8

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IC MCU 32BIT 8MB FLASH 292BGA

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사양

속성 가치
Series RH850/U2A
Part Status Active
Core Processor RH850G4MH
Core Size 32-Bit Quad-Core
Speed 400MHz
Connectivity CANbus, CSI, Ethernet, FlexRay, I2C, LINbus, PSI5S, SCI, SENT, SPI, UART/USART
Peripherals DMA, POR, PWM, Temp Sensor, WDT
Number of I/O 165
Program Memory Size 8MB (8M x 8)
Program Memory Type FLASH
EEPROM Size 320K x 8
RAM Size 1.75M x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V
Data Converters A/D 79x12b SAR
Oscillator Type Internal
Operating Temperature -40°C ~ 160°C (TJ)
Mounting Type Surface Mount
Supplier Device Package 292-FBGA (17x17)
Package / Case 292-FBGA
Base Product Number R7F702301
Grade Automotive
Qualification AEC-Q100

개요

Description

The R7F702301BFABG-C#BC8 is likely a model number for a microcontroller or a semiconductor component. This type of component is commonly used in embedded systems for various applications such as automotive, industrial, or consumer electronics.
Key features of such microcontrollers typically include integrated CPU cores, memory (RAM and Flash), and I/O ports for interfacing with other devices. They may also support various communication protocols and peripheral interfaces like UART, SPI, I2C, and GPIO.
The "R7F" prefix suggests that it could be part of a series developed by Renesas Electronics, a well-known manufacturer of semiconductor products. This series might focus on energy efficiency, high performance, or specific functionalities like automotive control or Internet of Things (IoT) applications.
The part number includes specific identifiers detailing package type, temperature range, and other configuration options. To fully understand the capabilities and applications of this microcontroller, consulting the manufacturer's datasheet and technical documentation would be beneficial.

Equivalent

The R7F702301BFABG-C#BC8 is a microcontroller from the Renesas RH850 family. Equivalent products would typically include similar automotive-grade microcontrollers from other manufacturers. These could be the Infineon AURIX TC2xx/TC3xx series, NXP's S32K or MPC57xx series, and Texas Instruments' Hercules RM series. The exact equivalence would depend on specific application requirements such as performance, peripherals, and safety features. Always consult datasheets and manufacturer resources for precise comparisons.

Features

The R7F702301BFABG-C#BC8 is a microcontroller from Renesas Electronics, part of their RH850 family, which is optimized for automotive and high-performance industrial applications. Key features include:
1. Core Architecture: It uses the RH850/E2x core, designed for high efficiency and real-time performance.

2. Performance: It operates at high frequencies (up to several hundred MHz), enabling fast data processing.
3. Memory: Includes substantial on-chip Flash memory and RAM to support complex applications and data storage.
4. Peripherals: Offers a wide range of integrated peripherals such as timers, ADCs, DACs, and communication interfaces like CAN, LIN, and Ethernet.
5. Safety and Security: Features comprehensive safety and security functions, including error correction codes (ECC) and hardware security modules to meet automotive safety integrity levels (ASIL).
6. Low Power Consumption: Designed to be energy-efficient, suitable for battery-operated devices.
7. Scalability and Flexibility: Supports a variety of interfaces and expansion options, making it adaptable to different application needs.
This microcontroller is commonly used in engine control units, advanced driver-assistance systems, and other automotive applications requiring robust performance and reliability.

Pinout

The R7F702301BFABG-C#BC8 is a microcontroller from Renesas Electronics, part of their RH850 family. It features a low-power, high-performance design suitable for automotive applications. This particular microcontroller comes in a 144-pin package.
The key functions of the R7F702301BFABG-C#BC8 include:
1. CPU Core: It utilizes the RH850 core, which is designed for high efficiency, real-time performance, and safety-critical applications.
2. Memory: It typically includes on-chip Flash memory for program storage and RAM for data storage.
3. Peripherals: The microcontroller is equipped with a range of peripherals such as timers, serial communication interfaces (like UART, SPI, CAN), analog-to-digital converters (ADC), and digital I/O ports.
4. Safety Features: Includes features to support functional safety, crucial for automotive applications.
These features make it well-suited for various automotive control systems, including engine management, braking, and vehicle stability control.

Manufacturer

The R7F702301BFABG-C#BC8 is manufactured by Renesas Electronics Corporation. Renesas is a Japanese semiconductor company that specializes in the development and manufacturing of microcontrollers, system-on-chip (SoC) solutions, and other semiconductor products. They serve a variety of industries, including automotive, industrial, home electronics, and information and communication technology. Renesas is well-known for its innovations in the microcontroller and microprocessor markets, providing solutions that enhance performance, safety, and efficiency in a wide range of electronic devices and systems.

Application

The R7F702301BFABG-C#BC8 is a microcontroller from Renesas Electronics, part of the RH850 family, designed for automotive and industrial applications. Its primary application areas include automotive control systems, such as engine management, transmission control, and body electronics. It is also used in advanced driver-assistance systems (ADAS) due to its high performance and reliability. In industrial settings, it can be applied in automation systems, motor control, and safety monitoring systems. Its capabilities in real-time processing and robust communication make it suitable for complex, safety-critical systems.

Package

The R7F702301BFABG-C#BC8 is a microcontroller from Renesas Electronics, typically housed in a Ball Grid Array (BGA) package. The BGA package offers high-density pin connections and efficient heat distribution, making it suitable for compact and high-performance applications.

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