RT2872GSP

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RT2872GSP

+BOM

IC REG BUCK ADJUSTABLE 3A 8SOP

  • 제조업체Richtek 미국 주식회사.

  • 제조업체 부품 #RT2872GSP

  • 패키지 SOIC-8

  • 재고3441

365 1일 품질 보증

7*24 영업 시간 서비스 보증

90-판매 후 1일 보증

정품 보증

사양

속성 가치
Package / Case Tape & Reel (TR),Cut Tape (CT)
Series Automotive, AEC-Q100
Part Status Active
Function Step-Down
Output Configuration Positive
Topology Buck
Output Type Adjustable
Number of Outputs 1
Voltage - Input (Min) 4.5V
Voltage - Input (Max) 36V
Voltage - Output (Min/Fixed) 0.8V
Voltage - Output (Max) 30V
Current - Output 3A
Frequency - Switching 300kHz ~ 1MHz
Synchronous Rectifier Yes
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount

개요

Description

The RT2872GSP is a specific model of a semiconductor chip, often used in wireless communication systems. It is typically designed to support advanced networking technologies, including Wi-Fi or other wireless protocols. This chip may incorporate features such as multiple-input and multiple-output (MIMO) technology, high-speed data processing, and enhanced signal reliability, making it suitable for both consumer and industrial applications.
Key features might include integrated security protocols, power management capabilities, and support for various frequency bands, ensuring robust performance in diverse environments. The RT2872GSP is likely engineered to deliver efficient power consumption and high throughput, which are crucial for mobile devices, routers, and IoT devices, where maintaining a balance between performance and energy efficiency is essential.
This chip is part of a product line that can be used in various applications, including smart home devices, automotive systems, and industrial automation, reflecting its versatility and adaptability to different technological needs. Its implementation in hardware solutions underscores its role in advancing communication technologies.

Equivalent

The RT2872GSP chip is a wireless network chip typically used in Wi-Fi applications. Its equivalent products are other Wi-Fi chips that offer similar functionalities and performance characteristics. These could include chips from manufacturers like Broadcom, Qualcomm, MediaTek, or Realtek such as the Broadcom BCM43xx series, Qualcomm Atheros AR9xxx series, MediaTek MT76xx series, and Realtek RTL88xx series. Exact equivalences depend on the specific features and specifications required for your application.

Pinout

The RT2872GSP is a chip manufactured by Richtek, typically used in power management applications. It is a step-down converter specifically designed to provide high-efficiency power conversion. The RT2872GSP comes in a standard package with a specific pin count, which includes pins for functions such as input voltage, output voltage, ground, enable, feedback, and possibly others like power good indicators or switching frequency controls.
For precise and detailed information regarding the pin count and their specific functions, referring to the datasheet of the RT2872GSP is recommended. The datasheet will provide a comprehensive pin configuration diagram and functional descriptions for each pin. It's important to consult the official documentation or a reliable source for the most accurate and up-to-date information.

Manufacturer

The RT2872GSP is manufactured by Raltech. Raltech is a company known for producing electronic components and semiconductor solutions. They specialize in creating products for various applications, including telecommunications, consumer electronics, and computer networking. Raltech is recognized for its focus on innovation and quality in the semiconductor industry.

Application

The RT2872GSP is a power management integrated circuit (PMIC) commonly used in various electronic applications. It is primarily utilized in consumer electronics, such as smartphones, tablets, and portable devices, to manage power distribution and enhance battery life. The chip supports efficient power conversion and regulation, which is essential for optimizing device performance and energy consumption. Additionally, it is employed in Internet of Things (IoT) devices, wearable technology, and other compact electronics where space and power efficiency are critical. Its versatile functionality makes it suitable for applications requiring precise power control and management.

Package

The RT2872GSP is typically available in a QFN (Quad Flat No-leads) package, which is a compact, surface-mount semiconductor package with no leads, designed for efficient thermal performance and minimal board space usage.

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