S29GL01GP11TFIR10

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S29GL01GP11TFIR10

+BOM

IC FLASH 1GBIT PARALLEL 56TSOP

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7*24 영업 시간 서비스 보증

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사양

속성 가치
Package / Case Tray,Tray
Series GL-P
Part Status Obsolete
Memory Type Non-Volatile
Memory Format FLASH
Technology FLASH - NOR
Memory Size 1Gb (128M x 8)
Memory Interface Parallel
Write Cycle Time - Word Page 110ns
Access Time 110 ns
Voltage - Supply 3V ~ 3.6V
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount

개요

Description

The S29GL01GP11TFIR10 is a specific model of a NOR Flash memory chip produced by Cypress Semiconductor, which is now part of Infineon Technologies. It belongs to the GL-S family of Flash memory products, known for their high performance, reliability, and extended operating temperature ranges.
This particular model offers a storage capacity of 1 Gigabit and is designed for use in embedded systems where non-volatile memory is required. It features a parallel NOR interface that facilitates fast data access and has a wide voltage range, making it versatile for various applications. The chip is capable of executing code directly from the Flash memory, which is crucial for many embedded applications that require quick boot times and efficient memory usage.
Additionally, the S29GL01GP11TFIR10 includes advanced security features, such as sector protection and password protection, to safeguard data integrity. It is commonly used in automotive, industrial, and networking applications due to its robustness and ability to operate reliably in extreme conditions.

Equivalent

The S29GL01GP11TFIR10 is a 1Gb (Gigabit) NOR Flash memory chip produced by Cypress Semiconductor, now part of Infineon Technologies. Equivalent products would include similar NOR Flash memory chips from manufacturers like Micron Technology (MT28EW series), Winbond (W25Q series), and Macronix (MX29 series). When considering alternatives, ensure compatibility in terms of storage capacity, interface, voltage, package type, and performance specifications to match the specific application requirements.

Features

The S29GL01GP11TFIR10 is a part of the GL-P family of flash memory devices by Cypress Semiconductor (now part of Infineon Technologies). It features a 1 Gb (gigabit) capacity implemented on a floating gate technology. The device operates at a voltage range of 2.7V to 3.6V, making it suitable for a variety of applications, including embedded systems.
Key features include:
1. Architecture: It uses a NOR flash architecture, which is ideal for applications requiring fast random read performance.
2. Interface: Supports a standard asynchronous interface for easy integration.
3. Performance: Offers a read speed of up to 110 ns and supports page programming for enhanced write performance.
4. Security: Includes sector protection features to safeguard data integrity.
5. Endurance and Retention: It provides 100,000 program/erase cycles per sector and data retention of up to 20 years.
6. Packaging: Available in a 64-ball Fine-pitch Ball Grid Array (FBGA) package.
This flash memory is suitable for use in automotive, industrial, and consumer electronics applications where reliable and high-density storage solutions are required.

Pinout

The S29GL01GP11TFIR10 is a NOR Flash memory device from Cypress Semiconductor (now part of Infineon Technologies). It belongs to the GL-P family of parallel NOR Flash products.
This particular model has a 64-ball Fortified BGA (Ball Grid Array) package, which includes 64 connection points or pins. The functions of these pins include address inputs, data inputs/outputs, chip enable (CE#), output enable (OE#), write enable (WE#), reset (RESET#), and other control signals necessary for the operation of the memory device. It also includes power (VCC) and ground (VSS) connections.
The device is used for non-volatile storage and is typically employed in embedded systems where reliable memory retention over power cycles is necessary. Its parallel interface allows for high-speed data access, making it suitable for applications requiring fast read and write operations.

Manufacturer

The S29GL01GP11TFIR10 is a product manufactured by Cypress Semiconductor, which is now part of Infineon Technologies AG. Cypress Semiconductor was known for its expertise in producing a wide range of semiconductor devices, including NOR flash memory, which is the category to which the S29GL01GP11TFIR10 belongs. Cypress Semiconductor was acquired by Infineon Technologies AG, a German semiconductor manufacturer, in 2020.
Infineon Technologies operates as a global semiconductor company that focuses on developing and manufacturing a wide array of semiconductor solutions. These solutions cater to various sectors, including automotive, industrial power control, power management and multimarket, and digital security solutions. Infineon's products are essential components in numerous applications, providing solutions for energy efficiency, mobility, and security. The company's expertise in semiconductors helps drive technological advancements across different industries, supporting innovations in smart cars, secure devices, and efficient energy management systems.

Application

The S29GL01GP11TFIR10 is a high-density flash memory chip commonly used in embedded systems and various electronic applications. Key application areas include:
1. Consumer Electronics: Used in devices like digital cameras, GPS systems, and gaming consoles for firmware storage and data retention.

2. Automotive Systems: Utilized in infotainment systems, navigation, and advanced driver-assistance systems (ADAS).
3. Telecommunications: Employed in networking equipment for storing firmware and operational data.
4. Industrial Applications: Integrated in control systems and automation equipment where reliable data storage is critical.
5. Computing: Used in solid-state drives (SSDs) and other computer peripherals that require high-speed data storage and retrieval.
These areas benefit from its non-volatile storage capabilities and high endurance.

Package

The S29GL01GP11TFIR10 is a flash memory chip from Cypress Semiconductor. It typically comes in a TSOP (Thin Small Outline Package) type, specifically a 56-pin TSOP package. This package type is commonly used for memory devices, offering a compact form factor suitable for various electronic applications.

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