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SLVU2.8-4BTG
+BOMTVS DIODE 2.8VWM 15VC 8-SOIC
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제조업체리틀퓨즈(주)
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제조업체 부품 #SLVU2.8-4BTG
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데이터시트 SLVU2.8-4BTG DataSheet
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패키지 8-SOIC
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재고6372
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사양
| 속성 | 가치 |
| Package | Tape & Reel (TR),Cut Tape (CT) |
| Series | SLVU2.8-4, SPA® |
| ProductStatus | Active |
| Type | Zener |
| BidirectionalChannels | 4 |
| Voltage-ReverseStandoff(Typ) | 2.8V (Max) |
| Voltage-Breakdown(Min) | 3V |
| Voltage-Clamping(Max)@Ipp | 15V |
| Current-PeakPulse(10/1000µs) | 40A (8/20µs) |
| Power-PeakPulse | 600W |
| PowerLineProtection | No |
| Applications | General Purpose |
| Capacitance@Frequency | 2pF @ 1MHz |
| OperatingTemperature | -40°C ~ 125°C (TJ) |
| MountingType | Surface Mount |
| Package/Case | 8-SOIC (0.154, 3.90mm Width) |
개요
Description
### Key Features:
- Low capacitance (0.5pF typical) to minimize signal distortion.
- Bidirectional clamping (±28V) for surge protection up to IEC 61000-4-5 (20A, 8/20µs).
- Compact DFN-10 package, ideal for space-constrained designs.
- IEC 61000-4-2 ESD protection (±30kV contact, ±30kV air).
### Applications:
- USB 2.0, HDMI, Ethernet ports
- Consumer electronics, industrial systems
- Automotive infotainment & communication interfaces
This device ensures robust transient protection while maintaining signal integrity in high-speed applications.
Pinout
- Pin Count: 8-pin (DFN package).
- Function:
- Protects four I/O lines (up to ±20kV ESD, per IEC 61000-4-2).
- Low clamping voltage (<10V at 5A).
- Ultra-low capacitance (0.5pF typical per line) for minimal signal distortion.
- Bidirectional protection (handles both positive/negative transients).
Commonly used in USB 2.0, HDMI, and other high-speed interfaces.
Manufacturer
STMicroelectronics specializes in designing and producing a wide range of semiconductor solutions, including microcontrollers, sensors, power management ICs, and protection devices like the SLVU2.8-4BTG, which is a transient voltage suppressor (TVS) diode array for ESD protection.
The company serves industries such as automotive, industrial, consumer electronics, and IoT, known for its innovation and high-performance components.