SPC563M64L5COAY

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SPC563M64L5COAY

+BOM

IC MCU 32BIT 1.5MB FLASH 144LQFP

365 1일 품질 보증

7*24 영업 시간 서비스 보증

90-판매 후 1일 보증

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사양

속성 가치
Package / Case Tray
Series Automotive, AEC-Q100, SPC56
Part Status Active
Core Processor e200z3
Core Size 32-Bit Single-Core
Speed 80MHz
Connectivity CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART
Peripherals DMA, POR, PWM, WDT
Number of I/O 80
Program Memory Size 1.5MB (1.5M x 8)
Program Memory Type FLASH
RAM Size 94K x 8
Voltage - Supply (Vcc/Vdd) 1.14V ~ 1.32V
Data Converters A/D 32x12b
Oscillator Type Internal
Operating Temperature -40°C ~ 125°C (TA)
Mounting Type Surface Mount

개요

Description

The SPC563M64L5COAY is a microcontroller from NXP Semiconductors, designed for automotive and industrial applications. It belongs to the MPC5600 family, known for balancing performance, power efficiency, and cost-effectiveness. The microcontroller is based on a Power Architecture® e200z core, offering robust processing capabilities suitable for complex control tasks.
Key features of the SPC563M64L5COAY include a high level of integration with peripherals such as multiple communication interfaces (CAN, LIN, and FlexRay), advanced timer modules, and Analog-to-Digital Converters (ADCs). It supports up to 1 MB of Flash memory and 94 KB of RAM, allowing for efficient storage and execution of code and data.
The microcontroller is designed to enhance system reliability with features like Error Correction Code (ECC) and a comprehensive safety architecture, making it suitable for safety-critical applications. Additionally, it offers low power consumption modes, which are crucial for automotive industry standards focusing on energy efficiency. Its versatility and robustness make it an ideal choice for various automotive control systems and industrial applications.

Equivalent

The SPC563M64L5COAY is a microcontroller from STMicroelectronics, part of the SPC56 family based on the Power Architecture. Equivalent products could include other models within the SPC56 series with similar specifications, or similar microcontrollers from NXP's MPC5600 series, such as the MPC563 or MPC564, which also use Power Architecture. When selecting an equivalent, ensure compatibility in terms of pin configuration, memory, and peripherals. Always check the specific application needs and consult datasheets for precise matching.

Features

The SPC563M64L5COAY is a microcontroller from the STMicroelectronics' Power Architecture-based SPC56 family. It is designed for automotive and industrial applications, offering robust performance and safety features. Key features of this microcontroller include:
1. CPU and Performance: It features a 32-bit Power Architecture core, delivering efficient processing capabilities for complex applications.
2. Memory: It includes a substantial amount of Flash memory and RAM to accommodate various data and code storage requirements.
3. Connectivity: The microcontroller supports multiple communication interfaces such as CAN, LIN, and SPI, facilitating seamless integration into automotive networks.
4. Timers and PWM: Equipped with multiple timers and PWM channels, it supports precise control in motor control and other timing-dependent applications.
5. Analog Features: It includes ADCs for analog signal processing, enabling the microcontroller to handle sensory data efficiently.
6. Safety and Reliability: Designed with enhanced safety features, it meets stringent automotive standards for functional safety.
7. Power Management: Offers low-power modes to optimize power consumption in energy-sensitive applications.
These features make the SPC563M64L5COAY suitable for demanding automotive and industrial environments.

Pinout

The SPC563M64L5COAY is a microcontroller from STMicroelectronics, part of the SPC563M family, which is based on the Power Architecture. This particular microcontroller is designed for automotive applications and is known for its high performance and reliability.
The device is housed in a 144-pin LQFP (Low-Profile Quad Flat Package). The pin count, therefore, is 144. The pins are configured to support various functionalities typical of automotive and industrial applications, which include:
- Multiple communication interfaces such as CAN (Controller Area Network), LIN (Local Interconnect Network), and FlexRay for vehicle networking.
- Several I/O ports for interfacing with external components.
- ADCs (Analog-to-Digital Converters) for sensor data acquisition.
- PWM (Pulse Width Modulation) outputs for controlling actuators.
- SPI (Serial Peripheral Interface) and I2C for additional peripheral interfacing options.
The microcontroller is designed to handle complex tasks with real-time constraints, making it suitable for advanced electronic control units (ECUs) in automobiles.

Manufacturer

The SPC563M64L5COAY is manufactured by STMicroelectronics. STMicroelectronics is a multinational electronics and semiconductor manufacturer. It is known for designing and producing a wide range of semiconductor devices, including microcontrollers, sensors, and integrated circuits used in various applications across industries such as automotive, industrial, consumer electronics, and communication equipment. The company is one of the world's leading semiconductor manufacturers and is headquartered in Geneva, Switzerland.

Application

The SPC563M64L5COAY is a microcontroller commonly used in automotive applications. Its primary uses include engine management systems, transmission control, and advanced driver assistance systems (ADAS). The microcontroller supports complex real-time applications due to its high processing power and robust architecture. It is also utilized in electric and hybrid vehicle systems, including battery management and powertrain control. Additionally, it can be found in various automotive safety systems, such as airbag and braking control systems, owing to its reliability and high performance in safety-critical environments.

Package

The SPC563M64L5COAY is a part of the SPC563M family of microcontrollers. It typically comes in a plastic Ball Grid Array (BGA) package, which is designed for high-density interconnections and optimal thermal performance. This type of packaging is well-suited for automotive and industrial applications, offering a compact form factor with reliable electrical connections.

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