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SRDA3.3-4.TBT
+BOMTVS DIODE 3.3VWM 15VC 8-SO
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제조업체셈텍(주)
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제조업체 부품 #SRDA3.3-4.TBT
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재고6503
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사양
| 속성 | 가치 |
| Series | RailClamp®, SRDA |
| Part Status | Not For New Designs |
| Base Product Number | SRDA3.3 |
| Type | Steering (Rail to Rail) |
| Voltage - Reverse Standoff (Typ) | 3.3V (Max) |
| Voltage - Breakdown (Min) | 3.5V |
| Voltage - Clamping (Max) @ Ipp | 15V |
| Current - Peak Pulse (10 / 1000µs) | 25A (8/20µs) |
| Power - Peak Pulse | 500W |
| Power Line Protection | Yes |
| Applications | General Purpose |
| Capacitance @ Frequency | 8pF @ 1MHz |
| Operating Temperature | -40°C ~ 85°C (TJ) |
| Mounting Type | Surface Mount |
| Package / Case | 8-SOIC (0.154", 3.90mm Width) |
| Supplier Device Package | 8-SO |
| Packaging | Cut Tape (CT), Tape & Reel (TR) |
| Unidirectional Channels | 4 |
개요
Description
SRDA3.3-4.TBT is a technical specification within the SRDA family that defines the requirements, interfaces, and verification criteria for SRDA-based systems. It establishes the scope, intended audience, and baseline processes to ensure consistency, interoperability, and quality across implementations. The document outlines core concepts, terminology, and a structured set of sections, including scope and references, definitions, functional and non-functional requirements, architecture and interfaces, testing and validation, and conformance criteria. It describes the lifecycle activities from design and implementation through verification and certification, and specifies how compliance is demonstrated and documented. Users—engineers, project managers, and QA teams—should follow the requirements to design, develop, integrate, test, and certify SRDA components, and to perform ongoing conformance assessment.
If you share context, I’ll tailor it precisely.
Pinout
Please share:
- Manufacturer or datasheet link
- Package type (e.g., SOP-8, TSSOP-14, DIP, etc.)
With that, I’ll give exact pin count and each pin’s function.
Application
- UV coatings (wood, metal, plastics)
- adhesives and sealants
- inks and varnishes
- electronics encapsulation/potting and composite materials
Please provide the product datasheet or key specs (functional groups, Tg, viscosity) for precise application areas.