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SY89833LMG
+BOMIC CLK BUFFER 1:4 2GHZ 16MLF
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제조업체마이크로칩 기술
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제조업체 부품 #SY89833LMG
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데이터시트 SY89833LMG DataSheet
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패키지 VQFN-16
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재고4585
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사양
| 속성 | 가치 |
| Package | Tube |
| Series | Precision Edge® |
| ProductStatus | Active |
| Type | Fanout Buffer (Distribution), Translator |
| NumberofCircuits | 1 |
| Ratio-Input:Output | 1:4 |
| Differential-Input:Output | Yes/Yes |
| Input | CML, LVDS, LVPECL |
| Output | LVDS |
| Frequency-Max | 2 GHz |
| Voltage-Supply | 3V ~ 3.6V |
| OperatingTemperature | -40°C ~ 85°C |
| MountingType | Surface Mount |
| Package/Case | 16-VFQFN Exposed Pad, 16-MLF® |
개요
Description
The SY89833LMG is known for its low phase noise and high output frequency stability, which are crucial for maintaining data accuracy and reliability. It typically includes phase-locked loops (PLLs) to lock onto an input reference clock and generate a clean, stable output signal. Additionally, the device often offers programmable settings, allowing for customization to meet specific application needs.
Overall, the SY89833LMG is valued for its ability to enhance system performance by providing precise and stable clock signals, which are essential in applications where timing accuracy is critical.
Equivalent
1. ON Semiconductor NB100LVEP224: High-speed LVPECL-to-LVTTL translator.
2. Texas Instruments SN65ELT22: Dual LVPECL-to-LVTTL translator.
3. IDT 5PB1108: LVPECL/LVDS-to-LVTTL translator.
4. Microchip SY100ELT22: LVPECL-to-LVTTL translator.
Always verify specifications and pin compatibility before using an alternative product.
Features
1. Input Compatibility: Supports LVPECL, LVDS, and CML input levels.
2. Output Performance: Provides LVPECL outputs, ensuring fast data transmission with minimal skew.
3. Low Jitter: Designed to minimize phase noise, making it suitable for high-frequency applications.
4. Voltage Range: Operates typically within a 2.5V to 3.3V supply range.
5. Divisibility: Can function as a clock divider with selectable divide ratios to provide clock management flexibility.
6. Temperature Range: Typically supports industrial temperature ranges, ensuring reliability in various environmental conditions.
7. Package: Offered in a space-saving, thermally efficient package suitable for high-density board designs.
This device is commonly used in applications requiring precise timing and low jitter, such as telecommunications infrastructure, data communications, and networking equipment.