사양
| 속성 | 가치 |
| Supplier | Kioxia America, Inc. |
| Package / Case | Tray |
| Part Status | Active |
| Memory Type | Non-Volatile |
| Memory Format | FLASH |
| Technology | FLASH - NAND (SLC) |
| Memory Size | 8Gb (1G x 8) |
| Memory Interface | Parallel |
| Write Cycle Time - Word Page | 25ns |
| Access Time | 25 ns |
| Voltage - Supply | 2.7V ~ 3.6V |
| Operating Temperature | 0°C ~ 70°C (TA) |
| Mounting Type | Surface Mount |
개요
Description
TC58NVG3S0FTA00 is a 3D NAND flash memory device from Toshiba (now Kioxia). It is a high-density non-volatile storage die used in solid-state drives, embedded storage, and other flash-based devices. The die uses stacked 3D NAND cells and provides a standard NAND interface for a controller to perform page reads/writes and block erases. It supports typical flash-management features (ECC and wear-leveling managed by the host/controller). Exact specifications (capacity, speed, endurance, package) depend on the specific revision; consult the official datasheet for precise numbers. In short: a modern 3D NAND storage die designed for SSDs and related storage applications.
Equivalent
TC58NVG3S0FTA00 is a Toshiba (now Kioxia) 3D NAND flash device. There is no public one-for-one cross reference. Closest equivalents are other vendors’ 3D NAND parts with the same capacity and interface. To cross-reference, compare capacity, page/block size, die count, NAND type (3D/BSI), voltage, package and temperature grade, then use distributor cross-reference tools or contact the supplier for an official cross.
Features
Here are the typical features of the TC58NVG3S0FTA00 (Toshiba/Kioxia) 3D NAND flash device:
- 3D NAND TLC flash memory
- High-density storage in a single die
- Multi-plane/interleaved architecture for higher throughput
- ONFI-compatible NAND interface
- On-die ECC and firmware for wear leveling, bad-block management, and garbage collection
- Data integrity features: error detection/correction and read-disturb mitigation
- Power-fail protection and robust data-retention
- Low-power operation with suitable temperature range (industrial variants available)
- Designed for embedded/consumer/high-endurance applications
Note: For exact capacity, page/block sizes, interface version, and operating conditions, please refer to the official datasheet.
- 3D NAND TLC flash memory
- High-density storage in a single die
- Multi-plane/interleaved architecture for higher throughput
- ONFI-compatible NAND interface
- On-die ECC and firmware for wear leveling, bad-block management, and garbage collection
- Data integrity features: error detection/correction and read-disturb mitigation
- Power-fail protection and robust data-retention
- Low-power operation with suitable temperature range (industrial variants available)
- Designed for embedded/consumer/high-endurance applications
Note: For exact capacity, page/block sizes, interface version, and operating conditions, please refer to the official datasheet.
Pinout
- Pin count: 48 pins (48‑pin package)
- Function: NAND flash memory (3D TLC) device for non‑volatile data storage in electronics.
- Function: NAND flash memory (3D TLC) device for non‑volatile data storage in electronics.
Manufacturer
- Manufacturer: Kioxia Corporation (formerly Toshiba Memory; spun off from Toshiba).
- What kind of company: A Japanese multinational semiconductor company that designs and manufactures flash memory and storage solutions (NAND flash, SSDs, etc.).
- What kind of company: A Japanese multinational semiconductor company that designs and manufactures flash memory and storage solutions (NAND flash, SSDs, etc.).
Application
TC58NVG3S0FTA00 is a 3D TLC NAND flash memory. It enables high-density non-volatile storage across devices. Typical applications:
- Solid-state drives (SSDs) for PCs and data centers
- Embedded/storage in mobile devices, tablets, and ultrabooks
- Consumer electronics (cameras, camcorders, set-top boxes)
- Automotive (infotainment, telematics, data logging)
- Industrial/IoT edge devices requiring rugged storage
- Networking/storage appliances needing large, cost-effective flash memory
- Solid-state drives (SSDs) for PCs and data centers
- Embedded/storage in mobile devices, tablets, and ultrabooks
- Consumer electronics (cameras, camcorders, set-top boxes)
- Automotive (infotainment, telematics, data logging)
- Industrial/IoT edge devices requiring rugged storage
- Networking/storage appliances needing large, cost-effective flash memory
Package
FBGA (Fine-Pitch Ball Grid Array) package.
