TFP401APZP

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TFP401APZP

+BOM

IC RECEIVER DVI 100HTQFP

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  • 패키지 HTQFP (PZP)-100

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사양

속성 가치
Package Tray
ProductStatus Active
Type Receiver
Voltage-Supply 3V ~ 3.6V
OperatingTemperature 0°C ~ 70°C
MountingType Surface Mount
Package/Case 100-TQFP Exposed Pad

개요

Description

The TFP401APZP is a digital receiver IC from Texas Instruments, designed to decode LVDS (Low-Voltage Differential Signaling) video data from sources like DVI or HDMI interfaces. It supports 24-bit RGB color depth (up to 165 MHz pixel clock) and converts LVDS signals into parallel digital outputs for display controllers.
Key features:
- Single-chip DVI 1.0 compliant receiver
- Supports UXGA (1600×1200 @ 60Hz) resolution
- Integrated phase-locked loop (PLL) for clock recovery
- 5V tolerant DDC (Display Data Channel) interface
- 4:1 input mux for multiple source switching
Applications include LCD monitors, projectors, and embedded display systems. The TFP401APZP operates on 3.3V power and comes in a 100-pin TQFP package.
For more details, refer to the datasheet or TI’s official documentation.

Equivalent

The TFP401APZP (TI) is a DVI/HDMI receiver. Equivalent alternatives include:
- TFP401A (same series, minor variations)
- SiI1930 (Silicon Image)
- ADV7611 (Analog Devices)
- IT66121FN (ITE Tech)
These chips handle similar digital video signal decoding but may differ in features like HDMI support or integrated audio. Verify pinout and specs for compatibility.

Features

The TFP401APZP is a 165 MHz TMDS DVI receiver with key features:
- Supports resolutions up to UXGA (1600x1200 @ 60Hz)
- Single-link DVI 1.0 compliant
- Integrated 50 MHz PLL for clock recovery
- 4:2:2 or 4:4:4 digital output modes
- Supports 24-bit RGB or YCbCr (4:4:4) formats
- Low power consumption (<500 mW typical)
- 3.3V supply voltage, 5V tolerant I/O
- On-chip termination resistors for reduced BOM cost
- I²C interface for configuration
- 48-pin TQFP package
Ideal for digital displays, projectors, and video interfaces.

Package

The TFP401APZP is packaged in a 100-pin HTQFP (Thermal Enhanced Thin Quad Flat Package). This package type features a low profile, fine pitch, and improved thermal performance, making it suitable for high-density and heat-sensitive applications. The HTQFP measures 14mm x 14mm with a 0.5mm lead pitch.

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