TH58NVG2S3HTAI0

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TH58NVG2S3HTAI0

+BOM

IC FLASH 4GBIT PARALLEL 48TSOP I

  • 제조업체Kioxia 미국 주식회사.

  • 제조업체 부품 #TH58NVG2S3HTAI0

  • 패키지 TFSOP-48

  • 재고5563

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90-판매 후 1일 보증

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사양

속성 가치
Supplier Kioxia America, Inc.
Package Tray
ProductStatus Active
MemoryType Non-Volatile
MemoryFormat FLASH
Technology FLASH - NAND (SLC)
MemorySize 4Gb (512M x 8)
MemoryInterface Parallel
WriteCycleTime-WordPage 25ns
AccessTime 25 ns
Voltage-Supply 2.7V ~ 3.6V
OperatingTemperature -40°C ~ 85°C (TA)
MountingType Surface Mount
Package/Case 48-TFSOP (0.724, 18.40mm Width)

개요

Description

TH58NVG2S3HTAI0 is a NAND flash memory IC from Toshiba (now Kioxia). It’s a high-density non-volatile storage device used in electronics such as embedded systems and storage subsystems. The part is part of the TH58NVG2S3 family and comes in variants with different packaging, temperature ranges, and capacities. Like other NAND flash devices, it requires a host controller with ECC and wear-leveling to manage data reliability and endurance. The exact capacity, interface (NAND ONFI/Toggle-compatible), page/block size, timing, voltage, and endurance are specified in the datasheet for this specific variant. For precise specs and application notes, refer to the official datasheet or cross-reference with Kioxia/T Toshiba’s product pages.

Pinout

- Pin count: 48 pins (TSOP48 package)
- Function: NAND flash memory IC (non-volatile storage) with an 8-bit data bus and standard NAND control/address interface.

Manufacturer

Manufacturer: Kioxia Corporation (formerly Toshiba Memory/Toshiba).
Kioxia is a Japanese multinational semiconductor company specializing in NAND flash memory and solid-state storage products; one of the world’s leading memory manufacturers.

Application

TH58NVG2S3HTAI0 is a NAND flash memory device. Typical applications include internal storage for mobile devices (phones/tablets), digital cameras and camcorders, embedded storage in consumer electronics (set-top boxes, smart TVs), industrial/automotive use (infotainment, telematics, data logging), USB drives and SSDs, and firmware/data storage for embedded controllers and IoT devices.

Package

FBGA (Fine-pitch Ball Grid Array) package.

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