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THGBMHG9C4LBAIR

Name: THGBMHG9C4LBAIR
Rating: 4.8 (15 reviews)

+BOM

IC FLASH 512GBIT EMMC 153WFBGA

제조업체Kioxia 미국 주식회사.
제조업체 부품 #THGBMHG9C4LBAIR
재고2129

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사양

속성	가치
Series	e•MMC™
Part Status	Obsolete
Base Product Number	THGBMHG
Digi Key Programmable	Not Verified
Memory Type	Non-Volatile
Memory Format	FLASH
Technology	FLASH - NAND
Memory Size	512Gbit
Memory Organization	64G x 8
Memory Interface	eMMC
Clock Frequency	52 MHz
Voltage - Supply	2.7V ~ 3.6V
Operating Temperature	-25°C ~ 85°C (TA)
Mounting Type	Surface Mount
Package / Case	153-WFBGA
Supplier Device Package	153-WFBGA (11.5x13)
Packaging	Tray

개요

Description

"THGBMHG9C4LBAIR" appears to be a random alphanumeric string and does not correspond to any widely recognized acronym, term, or concept in common knowledge as of my last update in October 2023. If it refers to a specific subject, code, or identifier in a specialized field (such as technology, encryption, or a particular database), please provide additional context for a more precise explanation. If it is an internal reference, further details would help clarify its meaning and relevance.

Equivalent

The THGBMHG9C4LBAIR chip is a NAND flash memory component. Its equivalent products include other Toshiba NAND flash chips, such as those from the THGBMHG series. Additionally, comparable options from manufacturers like Samsung (e.g., K9GAG08U0M), Micron, and SK Hynix may serve similar purposes, but specific compatibility should be verified based on application requirements and specifications. Always consult the datasheets for detailed comparisons.

Features

The THGBMHG9C4LBAIR is a high-performance NAND flash memory chip designed for a variety of applications, including smartphones, tablets, and other portable devices. Key features include:
1. Storage Capacity: Typically offers substantial storage options, often in the range of several gigabytes.
2. Interface: Utilizes a Serial Peripheral Interface (SPI) for efficient data communication.
3. Speed: High read and write speeds suitable for demanding applications, improving overall device performance.
4. Endurance: Designed for endurance and reliability, with a robust architecture that ensures data integrity over time.
5. Form Factor: Compact size, making it ideal for space-constrained electronic devices.
6. Low Power Consumption: Optimized for power efficiency, enhancing battery life in mobile devices.
7. Data Retention: Supports data retention for several years under normal operating conditions.
These features make the THGBMHG9C4LBAIR suitable for a wide range of consumer electronics and industrial applications.

Pinout

The THGBMHG9C4LBAIR is a NAND flash memory chip produced by Toshiba. It typically features a pin count of 48 pins in a BGA (Ball Grid Array) package. The primary function of this chip is to provide non-volatile storage, commonly used in mobile devices, consumer electronics, and embedded systems.
This specific model is designed for high-density storage applications, offering high performance and reliability. It utilizes NAND technology, allowing for a larger capacity and faster read/write speeds compared to traditional storage solutions.
In summary, the THGBMHG9C4LBAIR has 48 pins and serves as a high-capacity NAND flash memory solution for various electronic applications.

Manufacturer

The manufacturer of the THGBMHG9C4LBAIR is Toshiba. Toshiba Corporation is a multinational conglomerate based in Japan, primarily known for its electronics and electrical equipment. Founded in 1875, the company operates in various sectors, including information technology, consumer electronics, and energy systems. Toshiba is particularly recognized for its innovations in semiconductor manufacturing, storage devices, and digital solutions. The THGBMHG9C4LBAIR specifically refers to a NAND flash memory chip, which is part of Toshiba's extensive portfolio in memory storage technology. The company has a significant presence in the global market, contributing to advancements in technology and supporting a wide range of industries, including automotive, healthcare, and telecommunications. Over the years, Toshiba has evolved its business model to focus on high-tech and environmentally friendly solutions, positioning itself as a key player in the modern technological landscape.

Application

THGBMHG9C4LBAIR is a flash memory chip typically used in various electronic devices. Its application areas include:
1. Smartphones and Tablets: Providing storage for apps, media, and system data.
2. Digital Cameras: Storing high-resolution images and videos.
3. Wearable Devices: Enabling data storage for fitness trackers and smartwatches.
4. Consumer Electronics: Used in TVs, gaming consoles, and streaming devices for firmware and media storage.
5. Automotive Systems: Supporting infotainment and navigation systems.
These applications leverage the chip's high capacity, speed, and reliability for efficient data storage and retrieval.

Package

The THGBMHG9C4LBAIR is a NAND flash memory chip from Toshiba, typically packaged in a BGA (Ball Grid Array) format. This package type offers a compact design suitable for high-density applications in mobile devices and other electronic products.

Frequently Asked Questions

Q: What is the memory capacity and organization of this Kioxia eMMC?
A: It has a 512Gbit (64GB) density with a memory organization of 64G x 8 bits, suitable for high-density storage.

Q: What interface does this flash component use?
A: It uses an eMMC (embedded MultiMediaCard) memory interface, providing a simple host interface for embedded systems.

Q: What is the operating voltage range for this part?
A: It requires a supply voltage from 2.7V to 3.6V, compatible with standard 3.3V logic systems.

Q: What is the clock frequency for data transfers?
A: The maximum clock frequency is 52 MHz, enabling high-speed read/write operations for NAND flash.

Q: Can this component be used in industrial temperature environments?
A: Yes, it has a wide operating temperature range of -25°C to 85°C (TA), suitable for demanding applications.

Q: What is the physical package type of this eMMC chip?
A: It comes in a 153-WFBGA (11.5x13 mm) surface-mount package, ideal for space-constrained designs.

Q: Is this part currently available or obsolete?
A: The part status is marked as "Obsolete," so it may be limited to existing stock or replacement designs.