사양
| 속성 | 가치 |
| Package | Tray |
| Series | e•MMC™ |
| ProductStatus | Last Time Buy |
| MemoryType | Non-Volatile |
| MemoryFormat | FLASH |
| Technology | FLASH - NAND |
| MemorySize | 128Gb (16G x 8) |
| MemoryInterface | eMMC |
| OperatingTemperature | -25°C ~ 85°C (TA) |
| MountingType | Surface Mount |
| Package/Case | 153-WFBGA |
개요
Description
The THGBMJG7C1LBAIL is a part number referring to a specific type of NAND flash memory chip produced by Toshiba (now Kioxia). This component is typically used in various electronic devices for data storage purposes, such as smartphones, tablets, and other portable gadgets. It belongs to the family of e-MMC (embedded MultiMediaCard) solutions that integrate NAND flash memory with a controller in a single package, simplifying the design and development process for device manufacturers.
The key features of the THGBMJG7C1LBAIL include its compact size, efficient power consumption, and reliable performance. It typically supports high-speed data transfer rates, making it suitable for applications requiring quick read and write capabilities. Additionally, e-MMC chips like this one often incorporate error correction technologies and wear leveling to enhance data integrity and prolong the lifespan of the memory.
Overall, the THGBMJG7C1LBAIL is designed to meet the demands of modern electronic devices that require efficient and reliable data storage solutions, contributing to improved functionality and user experience.
The key features of the THGBMJG7C1LBAIL include its compact size, efficient power consumption, and reliable performance. It typically supports high-speed data transfer rates, making it suitable for applications requiring quick read and write capabilities. Additionally, e-MMC chips like this one often incorporate error correction technologies and wear leveling to enhance data integrity and prolong the lifespan of the memory.
Overall, the THGBMJG7C1LBAIL is designed to meet the demands of modern electronic devices that require efficient and reliable data storage solutions, contributing to improved functionality and user experience.
Equivalent
The THGBMJG7C1LBAIL is a NAND flash memory chip manufactured by Toshiba (now Kioxia). Equivalent products from other manufacturers might include:
1. Samsung: K9xx series NAND chips
2. Micron: MT29 series
3. Hynix: H27 series
4. SanDisk/Western Digital: SDINBxxx series
These equivalents can vary based on specific configurations like capacity and interface, so it's essential to verify compatibility with your particular application requirements.
1. Samsung: K9xx series NAND chips
2. Micron: MT29 series
3. Hynix: H27 series
4. SanDisk/Western Digital: SDINBxxx series
These equivalents can vary based on specific configurations like capacity and interface, so it's essential to verify compatibility with your particular application requirements.
Features
The THGBMJG7C1LBAIL is a NAND Flash memory chip developed by Toshiba, typically used in mobile devices and various electronics for data storage. Below are its key features:
1. Type: e-MMC (embedded MultiMediaCard), which integrates NAND flash memory with a controller.
2. Capacity: Available in multiple storage capacities, often ranging from 8GB to 128GB or more.
3. Performance: Offers high-speed data transfer rates, which are crucial for efficient mobile device performance.
4. Interface: Uses the MMC interface, compatible with a wide range of processors and platforms.
5. Reliability: Incorporates advanced error correction and management features for data integrity and longevity.
6. Power Efficiency: Designed to minimize power consumption, prolonging battery life in portable devices.
7. Form Factor: Compact and suitable for space-constrained applications like smartphones, tablets, and IoT devices.
8. Temperature Range: Operates effectively within a typical commercial temperature range, making it suitable for various environments.
These features make the THGBMJG7C1LBAIL a versatile and reliable option for embedded storage solutions.
1. Type: e-MMC (embedded MultiMediaCard), which integrates NAND flash memory with a controller.
2. Capacity: Available in multiple storage capacities, often ranging from 8GB to 128GB or more.
3. Performance: Offers high-speed data transfer rates, which are crucial for efficient mobile device performance.
4. Interface: Uses the MMC interface, compatible with a wide range of processors and platforms.
5. Reliability: Incorporates advanced error correction and management features for data integrity and longevity.
6. Power Efficiency: Designed to minimize power consumption, prolonging battery life in portable devices.
7. Form Factor: Compact and suitable for space-constrained applications like smartphones, tablets, and IoT devices.
8. Temperature Range: Operates effectively within a typical commercial temperature range, making it suitable for various environments.
These features make the THGBMJG7C1LBAIL a versatile and reliable option for embedded storage solutions.
Pinout
The THGBMJG7C1LBAIL is a NAND Flash memory chip manufactured by Toshiba (now Kioxia). It typically comes in a Ball Grid Array (BGA) package. This specific chip is part of the e-MMC (embedded MultiMediaCard) storage solution lineup.
The pin count for the THGBMJG7C1LBAIL is usually around 153 balls in its BGA package, although the exact number can vary slightly based on specific package variations.
The primary function of this chip is to provide non-volatile storage for a variety of applications, such as smartphones, tablets, and other consumer electronics. It integrates NAND flash memory and a flash memory controller into a single package, streamlining storage solutions with features like wear leveling, bad block management, and error correction. This integration aids in simplifying the design process of various devices by providing a ready-to-use storage solution.
The pin count for the THGBMJG7C1LBAIL is usually around 153 balls in its BGA package, although the exact number can vary slightly based on specific package variations.
The primary function of this chip is to provide non-volatile storage for a variety of applications, such as smartphones, tablets, and other consumer electronics. It integrates NAND flash memory and a flash memory controller into a single package, streamlining storage solutions with features like wear leveling, bad block management, and error correction. This integration aids in simplifying the design process of various devices by providing a ready-to-use storage solution.
Manufacturer
The THGBMJG7C1LBAIL is a product manufactured by Kioxia Corporation. Kioxia is a Japanese company that specializes in the production and development of flash memory and solid-state drive (SSD) technology. Originally part of Toshiba, Kioxia was spun off in 2018 when the storage division of Toshiba was rebranded. The company focuses on providing advanced memory solutions for various applications, including consumer electronics, data centers, and enterprise storage systems. Kioxia is known for its innovation and leadership in the flash memory industry, contributing significantly to the advancement of NAND flash technology.
Application
The THGBMJG7C1LBAIL is a type of eMMC (embedded MultiMediaCard) memory module, commonly used in various electronic devices for data storage. Its application areas include:
1. Smartphones and Tablets: Provides reliable and efficient storage for operating systems, apps, and user data.
2. Laptops and Notebooks: Utilized in budget and mid-range devices for storage solutions.
3. Digital Cameras and Camcorders: Stores high-resolution photos and videos.
4. IoT Devices: Used in smart devices for consistent performance and durability.
5. Automotive Systems: Supports infotainment systems and navigation in vehicles.
6. Industrial Equipment: Offers robust storage for various industrial applications requiring durable memory solutions.
1. Smartphones and Tablets: Provides reliable and efficient storage for operating systems, apps, and user data.
2. Laptops and Notebooks: Utilized in budget and mid-range devices for storage solutions.
3. Digital Cameras and Camcorders: Stores high-resolution photos and videos.
4. IoT Devices: Used in smart devices for consistent performance and durability.
5. Automotive Systems: Supports infotainment systems and navigation in vehicles.
6. Industrial Equipment: Offers robust storage for various industrial applications requiring durable memory solutions.
Package
The THGBMJG7C1LBAIL is a BGA (Ball Grid Array) package type. BGA is used for mounting devices such as microprocessors and memory chips, providing a high-density connection method by placing balls of solder between the device and the PCB.
