TLSR8269F512ET32

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TLSR8269F512ET32

+BOM

RF System on a Chip - SoC BLE

365 1일 품질 보증

7*24 영업 시간 서비스 보증

90-판매 후 1일 보증

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개요

Description

The TLSR8269F512ET32 is a highly integrated system-on-chip (SoC) designed for Bluetooth Low Energy (BLE) applications. Part of Telink's TLSR8269 series, it targets IoT devices, including smart home products, health monitoring devices, and industrial automation systems. This SoC features a 32-bit RISC-V processor, providing efficient performance and low power consumption, making it ideal for battery-powered applications.
The TLSR8269F512ET32 comes with 512KB of Flash memory and 32KB of SRAM, which support the storage and execution of complex IoT applications. It includes a range of peripherals such as UART, I2C, SPI, PWM, and ADC, which facilitate versatile connectivity options.
Additionally, the chip supports advanced security features, including AES hardware encryption, ensuring secure data transmission. The integrated BLE 5.0 radio offers improved range, speed, and reliability of wireless communication. With its compact design and robust feature set, the TLSR8269F512ET32 is a versatile solution for developers looking to create energy-efficient and secure wireless IoT applications.

Equivalent

The TLSR8269F512ET32 is a Bluetooth Low Energy (BLE) SoC from Telink. Equivalent products include Nordic Semiconductor's nRF52832 and nRF52840, Texas Instruments' CC2640R2F, and Dialog Semiconductor's DA14531 and DA14683. These alternatives also support BLE connectivity, offer low power consumption, and cater to IoT and wearable applications. Be sure to compare specifications such as processing power, memory, and peripheral support to ensure suitability for your specific needs.

Features

The TLSR8269F512ET32 is a highly integrated system-on-chip (SoC) designed for wireless communication applications. Key features include:
1. Processor: It is powered by a 32-bit RISC CPU architecture with a high-performance processing capability.
2. Memory: The chip comes with 512KB of flash memory and 160KB of RAM, allowing for efficient data handling and storage.
3. Wireless Communication: It supports Bluetooth Low Energy (BLE) 5.0, offering improved range and data throughput for IoT applications.
4. Peripheral Interfaces: The SoC includes a range of interfaces such as UART, SPI, I2C, and PWM, facilitating connectivity with various sensors and external devices.
5. Power Efficiency: It features low power consumption, making it suitable for battery-operated devices.
6. Security: The TLSR8269F512ET32 offers hardware-based encryption and decryption capabilities to enhance data security.
7. Analog Features: It includes ADCs for analog signal processing and a DAC for audio applications.
This combination of features makes it ideal for smart home, health monitoring, and wearable technology applications.

Pinout

The TLSR8269F512ET32 is a Bluetooth Low Energy IC from Telink, designed for Internet of Things (IoT) applications. It is part of the TLSR826x family and features a 32-pin QFN package. The IC integrates several functionalities, making it suitable for a variety of applications, including remote controls, health and fitness devices, and smart home products.
Pin Count: 32 pins
Key Functions:
1. Bluetooth Low Energy (BLE): Supports BLE 4.2 for wireless communication.

2. GPIO: General-purpose input/output pins for interfacing with external devices.

3. Analog Interfaces: Includes ADC for analog signal processing.

4. PWM: Pulse Width Modulation outputs for controlling motors or LEDs.

5. I2C and SPI Interfaces: For communication with peripherals like sensors or displays.

6. UART: Universal Asynchronous Receiver/Transmitter for serial communication.

7. Timers and Watchdog: For managing time-based operations and system reliability.
These features make the TLSR8269F512ET32 versatile for various embedded and wireless applications.

Manufacturer

The TLSR8269F512ET32 is manufactured by Telink Semiconductor. Telink Semiconductor is a fabless integrated circuit design company that specializes in the development of low-power wireless connectivity solutions. The company focuses on designing SoCs (System on Chips) that integrate multiple functions for use in various applications such as the Internet of Things (IoT), smart lighting, wearables, home automation, and more.
Telink's products often support multiple standards like Bluetooth, Zigbee, and 6LoWPAN, making them highly versatile for different types of wireless communication. As a fabless company, Telink Semiconductor focuses on research, design, and development, while outsourcing the actual manufacturing of the chips to specialized semiconductor fabrication plants. This business model allows the company to concentrate on innovation and rapid development cycles.

Application

The TLSR8269F512ET32 is a highly integrated SoC designed for Bluetooth applications. Its primary application areas include smart lighting, where it enables wireless control and automation of lighting systems. It is also used in wearable devices, providing low-power wireless connectivity for fitness trackers and smartwatches. In smart home applications, the SoC supports devices like door locks, sensors, and remote controls, enhancing home automation and security. Additionally, the TLSR8269F512ET32 is used in health monitoring devices, offering reliable data transmission for pulse oximeters and blood glucose monitors. Its low energy consumption and robust connectivity make it ideal for battery-powered IoT devices across various industries.

Package

The TLSR8269F512ET32 is a microcontroller from Telink's TLSR826x series, typically found in a QFN (Quad Flat No-leads) package. This package type is compact and suitable for space-constrained applications, featuring a small footprint and enhanced thermal performance, which is ideal for IoT and Bluetooth Low Energy applications.

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