사양
| 속성 | 가치 |
| Package / Case | Bulk,Tray |
| Series | TMS320C66x |
| Part Status | Active |
| Type | Fixed/Floating Point |
| Interface | EBI/EMI, I²C, PCIe, SPI, TSIP, UART, 10/100/1000 Ethernet |
| Clock Rate | 1.25GHz |
| Non - Volatile Memory | ROM (128kB) |
| On - Chip RAM | 8.5MB |
| Voltage - I / O | 1.0V, 1.5V, 1.8V |
| Voltage - Core | 1.00V |
| Operating Temperature | -40°C ~ 100°C (TC) |
| Mounting Type | Surface Mount |
개요
Description
The TMS320C6678ACYPA25 is a high-performance, multicore DSP from Texas Instruments, part of the TMS320C6000 family. It features eight C66x DSP cores, each running at 1.25 GHz, delivering up to 320 GMACs and 160 GFLOPs performance.
Key features:
- Multicore Shared Memory Architecture (MSMC) for efficient data sharing.
- DDR3 Memory Controller (up to 8 GB support).
- High-speed interfaces: SRIO, HyperLink, PCIe, Ethernet.
- Fixed- and floating-point processing for versatile applications.
Applications include wireless base stations, medical imaging, radar, and high-performance computing. The ACYPA25 suffix denotes its industrial temperature range (-40°C to 105°C) and 25x25mm FCBGA package.
This DSP is ideal for real-time, compute-intensive tasks requiring low latency and high throughput.
Key features:
- Multicore Shared Memory Architecture (MSMC) for efficient data sharing.
- DDR3 Memory Controller (up to 8 GB support).
- High-speed interfaces: SRIO, HyperLink, PCIe, Ethernet.
- Fixed- and floating-point processing for versatile applications.
Applications include wireless base stations, medical imaging, radar, and high-performance computing. The ACYPA25 suffix denotes its industrial temperature range (-40°C to 105°C) and 25x25mm FCBGA package.
This DSP is ideal for real-time, compute-intensive tasks requiring low latency and high throughput.
Equivalent
The TMS320C6678ACYPA25 is a multicore DSP from Texas Instruments. Equivalent or similar products include:
- TMS320C6678ACYPA: Same chip, different speed grade (1.25 GHz vs. 1.0 GHz).
- TMS320C6674: Fewer cores (4 vs. 8) but similar architecture.
- TMS320C6657: Lower-cost, dual-core alternative.
- TMS320C6672: Dual-core variant of the same family.
For exact replacements, check TI’s KeyStone I DSP portfolio or newer KeyStone II devices like the 66AK2Hx series.
- TMS320C6678ACYPA: Same chip, different speed grade (1.25 GHz vs. 1.0 GHz).
- TMS320C6674: Fewer cores (4 vs. 8) but similar architecture.
- TMS320C6657: Lower-cost, dual-core alternative.
- TMS320C6672: Dual-core variant of the same family.
For exact replacements, check TI’s KeyStone I DSP portfolio or newer KeyStone II devices like the 66AK2Hx series.
Features
The TMS320C6678ACYPA25 is a high-performance DSP from Texas Instruments, part of the TMS320C6000 family. Key features:
- Cores: 8x C66x DSP cores, each running at 1.25 GHz (25 GFLOPS/core, 160 GFLOPS total).
- Memory: 4 MB shared L2 cache, 512 KB/core L2, 32 KB L1P/L1D per core.
- Interconnect: TeraNet for high-speed core-to-core communication.
- Multicore Navigator: Manages data flow between cores/hardware accelerators.
- I/O: HyperLink (50 Gbps), PCIe Gen2 (5 Gbps/lane), SGMII Ethernet (1 Gbps), DDR3-1600 (8 GB support).
- Power: ~10 W typical, 1.0V core voltage.
- Applications: Radar, wireless base stations, medical imaging, and high-performance computing.
Packaged in a 25×25 mm FCBGA (ACYPA). Optimized for parallel processing and real-time signal processing.
- Cores: 8x C66x DSP cores, each running at 1.25 GHz (25 GFLOPS/core, 160 GFLOPS total).
- Memory: 4 MB shared L2 cache, 512 KB/core L2, 32 KB L1P/L1D per core.
- Interconnect: TeraNet for high-speed core-to-core communication.
- Multicore Navigator: Manages data flow between cores/hardware accelerators.
- I/O: HyperLink (50 Gbps), PCIe Gen2 (5 Gbps/lane), SGMII Ethernet (1 Gbps), DDR3-1600 (8 GB support).
- Power: ~10 W typical, 1.0V core voltage.
- Applications: Radar, wireless base stations, medical imaging, and high-performance computing.
Packaged in a 25×25 mm FCBGA (ACYPA). Optimized for parallel processing and real-time signal processing.
Pinout
The TMS320C6678ACYPA25 is a 25mm x 25mm, 841-pin (FCBGA package) multicore DSP from Texas Instruments.
### Key Functions:
- 8x C66x DSP cores (1.25 GHz each) for high-performance processing.
- Shared memory (4MB L2, 512KB L1 per core) and DDR3 memory controller.
- High-speed interfaces:
- Serial RapidIO (SRIO), Ethernet (2x 10GbE, 1x 1GbE), PCIe Gen2.
- HyperLink for multi-chip interconnect.
- Peripherals: UART, SPI, I²C, GPIO, Timers.
Designed for wireless, medical imaging, and high-performance computing.
### Key Functions:
- 8x C66x DSP cores (1.25 GHz each) for high-performance processing.
- Shared memory (4MB L2, 512KB L1 per core) and DDR3 memory controller.
- High-speed interfaces:
- Serial RapidIO (SRIO), Ethernet (2x 10GbE, 1x 1GbE), PCIe Gen2.
- HyperLink for multi-chip interconnect.
- Peripherals: UART, SPI, I²C, GPIO, Timers.
Designed for wireless, medical imaging, and high-performance computing.
Application
The TMS320C6678ACYPA25, a multicore DSP from Texas Instruments, is widely used in:
1. Telecommunications – Base stations, wireless infrastructure (LTE, 5G).
2. Radar & Defense – Signal processing in radar, sonar, and electronic warfare.
3. Medical Imaging – Ultrasound, MRI, and CT scan processing.
4. Industrial Automation – High-speed control and machine vision.
5. Video Processing – Real-time video analytics and surveillance.
6. Aerospace – Avionics and satellite communication systems.
Its 8-core C66x DSP architecture delivers high performance for compute-intensive tasks.
1. Telecommunications – Base stations, wireless infrastructure (LTE, 5G).
2. Radar & Defense – Signal processing in radar, sonar, and electronic warfare.
3. Medical Imaging – Ultrasound, MRI, and CT scan processing.
4. Industrial Automation – High-speed control and machine vision.
5. Video Processing – Real-time video analytics and surveillance.
6. Aerospace – Avionics and satellite communication systems.
Its 8-core C66x DSP architecture delivers high performance for compute-intensive tasks.
Package
The TMS320C6678ACYPA25 is packaged in a 25×25 mm, 841-ball Flip-Chip Ball Grid Array (FCBGA) with a 1.0 mm ball pitch. This package is designed for high-performance DSP applications, offering robust thermal and electrical performance. The FCBGA ensures efficient heat dissipation and reliable connectivity for the multicore processor.
