사양
| 속성 | 가치 |
| Package | Tape & Reel (TR),Cut Tape (CT) |
| ProductStatus | Active |
| Technology | Internal Switch |
| NumberofCircuits | 4 |
| Applications | USB-C (USB TYPE-C) |
| MountingType | Surface Mount |
| Package/Case | 9-UFBGA, DSBGA |
개요
Description
Key features of the TPD2S300YFFR include:
1. ESD Protection: Provides robust protection for data lines against ESD strikes, compliant with the IEC 61000-4-2 standard.
2. Overvoltage Protection: Limits overvoltage transients by clamping voltage spikes to safe levels, ensuring the downstream circuitry is not exposed to damaging voltages.
3. Low Capacitance: Designed with low capacitance to maintain high-speed data integrity, making it suitable for applications like USB, HDMI, and other high-speed interfaces.
4. Compact Package: Available in compact packages, such as the YFF (DSBGA), which is ideal for space-constrained applications.
5. Versatile Use: It's suitable for a variety of consumer electronics, including smartphones, tablets, and wearables.
Overall, the TPD2S300YFFR is a critical component for enhancing the reliability and longevity of electronic devices by protecting them from common electrical hazards.
Equivalent
- TPD4E05U06 (Texas Instruments)
- ESD7008 (ON Semiconductor)
- IP4234CZ6 (Nexperia)
- SRV05-4 (STMicroelectronics)
These offer similar ESD protection for USB/HDMI lines. Check datasheets for exact specs.
Features
1. Protection: It provides electrostatic discharge (ESD) protection compliant with the IEC 61000-4-2 standard, ensuring robust defense against ESD strikes.
2. Overvoltage Protection: The device offers overvoltage protection up to 22 V on CC1 and CC2 pins, safeguarding the system from voltage spikes.
3. Current Limiting: It includes integrated current limiting, further enhancing safety by preventing excessive current flow.
4. Small Size: The device comes in a compact 12-ball DSBGA package (1.348 mm x 1.848 mm), making it suitable for space-constrained applications.
5. Low Capacitance: It features low capacitance, which is essential for maintaining signal integrity, particularly in high-speed data lines.
6. Operating Temperature: The TPD2S300YFFR supports a wide operating temperature range from -40°C to 85°C, ensuring reliability in various environmental conditions.
These features make it an excellent choice for protecting USB ports and ensuring reliable connectivity in consumer electronics, portable devices, and other related applications.
Pinout
The key functions of the TPD2S300YFFR include providing overvoltage protection, IEC ESD protection, and a current-limited load switch for USB Type-C ports. This helps in safeguarding the downstream devices from overvoltage conditions and electrostatic discharge events. The device is specifically optimized for use in applications where a compact footprint and robust protection are critical, such as in smartphones, tablets, and other portable electronics.
For accurate and specific pin functions, it is recommended to consult the official datasheet from Texas Instruments, as the pin assignments can provide detailed information on each pin's role in the circuit.
Manufacturer
Application
Package
FAQ
Q: What is the primary application for the TPD2S300YFFR?
A: It is specifically designed for USB Type-C (USB-C) port protection, safeguarding against overvoltage and electrostatic discharge (ESD) events.
Q: What type of package does this component use, and how is it supplied?
A: It comes in a compact 9-ball DSBGA (UFBGA) package and is available for automated assembly on Tape & Reel (TR) or in smaller quantities as Cut Tape (CT).
Q: Is the TPD2S300YFFR a discrete solution or an integrated circuit?
A: It is an integrated circuit (IC) that incorporates internal switches, providing a consolidated protection solution in a single, small-footprint device.
Q: How many independent protection circuits are integrated into this device?
A: The device integrates four separate protection circuits, allowing it to protect multiple signal or power lines within a USB-C interface.
Q: What is the recommended mounting method for this component?
A: It is designed for Surface Mount Technology (SMT), making it suitable for high-volume, automated PCB assembly processes.