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W25Q512NWEIM
+BOMIC FLASH 512MBIT SPI/QUAD 8WSON
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제조업체화방전자
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제조업체 부품 #W25Q512NWEIM
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데이터시트 W25Q512NWEIM DataSheet
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재고9422
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사양
| 속성 | 가치 |
| Series | SpiFlash® |
| Part Status | Active |
| Digi Key Programmable | Not Verified |
| Memory Type | Non-Volatile |
| Memory Format | FLASH |
| Technology | FLASH - NOR |
| Memory Size | 512Mbit |
| Memory Organization | 64M x 8 |
| Memory Interface | SPI - Quad I/O, QPI, DTR |
| Clock Frequency | 133 MHz |
| Write Cycle Time - Word, Page | 3ms |
| Access Time | 6 ns |
| Voltage - Supply | 1.65V ~ 1.95V |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount |
| Package / Case | 8-WDFN Exposed Pad |
| Supplier Device Package | 8-WSON (8x6) |
| Base Product Number | W25Q512 |
개요
Description
Key specifications include a maximum clock frequency of 133 MHz, allowing for high-speed data transfer rates, and it supports the Quad SPI protocol, enhancing performance even further. The W25Q512NWEIM operates with a voltage range of 2.7V to 3.6V, making it suitable for a variety of low-power applications.
Furthermore, it includes features like dual and quad input/output commands, allowing for efficient data read and write operations. The device is encapsulated in a compact 8-pin SOIC package, making it suitable for space-constrained designs. Overall, the W25Q512NWEIM is a versatile and reliable choice for modern electronic applications requiring ample memory storage.
Equivalent
Features
1. Interface: Supports SPI (Serial Peripheral Interface) with Quad SPI (QSPI) for high-speed data transfer.
2. Speed: Offers read speeds up to 104 MHz in QSPI mode, ensuring fast access times.
3. Architecture: Utilizes a standard 3V power supply with a wide operating temperature range (-40°C to 125°C).
4. Memory Density: 512Mb density with a page size of 256 bytes and a sector size of 4KB.
5. Endurance: Supports up to 100,000 program/erase cycles per sector.
6. Data Retention: Offers a data retention period of 20 years.
7. Features: Includes features like dual/quad I/O read, deep power-down mode, and hardware write-protection.
8. Package Options: Available in various packages, including SOP, WSON, and BGA.
This chip is commonly used in applications such as embedded systems, consumer electronics, and automotive devices.
Pinout
1. VCC: Power supply.
2. GND: Ground.
3. SCK: Serial Clock, used to synchronize data transfer.
4. CS# (Chip Select): Activates the chip for communication.
5. SI (Serial Input): Data input pin for commands and data.
6. SO (Serial Output): Data output pin for reading data.
7. WP# (Write Protect): Protects against accidental write operations.
8. HOLD#: Pauses the operation without deselecting the chip.
The device supports SPI (Serial Peripheral Interface) and provides high-speed data transfer, making it suitable for high-performance applications in embedded systems.
Manufacturer
Application
1. Consumer Electronics: For firmware storage in devices like smartphones, tablets, and smart TVs.
2. Automotive: In infotainment systems and electronic control units (ECUs) for firmware updates.
3. Industrial: For data logging and configuration storage in automation and control systems.
4. Networking Equipment: In routers and switches for operating system and configuration data.
5. IoT Devices: To store application code and user data in connected devices.
Its high density and fast read speeds make it suitable for these applications.