W25X05CLUXIG

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W25X05CLUXIG

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사양

속성 가치
EURoHS Compliant
ECCN(US) EAR99
PartStatus Active
HTS 8542.32.00.71
Automotive No
PPAP No
CellType NOR
ChipDensity(bit) 512K
Architecture Sectored
BootBlock Yes
BlockOrganization Symmetrical
LocationofBootBlock Bottom|Top
AddressBusWidth(bit) 24
SectorSize 4Kbyte x 16
PageSize 256byte
NumberofBits/Word(bit) 8
NumberofWords 64K
Programmability Yes
TimingType Synchronous
Max.AccessTime(ns) 8
MaximumEraseTime(S) 2/Chip
MaximumProgrammingTime(ms) 0.8/Page
InterfaceType Serial (SPI, Dual SPI)
MinimumOperatingSupplyVoltage(V) 2.3
TypicalOperatingSupplyVoltage(V) 2.5|3.3
MaximumOperatingSupplyVoltage(V) 3.6
ProgrammingVoltage(V) 2.3 to 3.6
OperatingCurrent(mA) 14
ProgramCurrent(mA) 12
MinimumOperatingTemperature(°C) -40
MaximumOperatingTemperature(°C) 85
SupplierTemperatureGrade Industrial
CommandCompatible Yes
ECCSupport No
SupportofPageMode No
Mounting Surface Mount
PackageHeight 0.53 mm
PackageWidth 3 mm
PackageLength 2 mm
PCBchanged 8
StandardPackageName SON
SupplierPackage USON
PinCount 8

개요

Description

The W25X05CLUXIG is a serial NOR flash memory chip from Winbond, featuring a storage capacity of 5 megabits (or 640 kilobytes). It utilizes the Serial Peripheral Interface (SPI) for communication, which allows for fast data transfer rates and efficient connectivity with microcontrollers and other digital devices. The chip operates on a voltage range of 2.7V to 3.6V, making it suitable for low-power applications.
Key features include a page program time of approximately 0.3 ms, a sector erase time of around 30 ms, and high endurance with up to 100,000 program/erase cycles per sector. The W25X05CLUXIG supports various power-saving modes, contributing to its efficiency in battery-operated devices. It's commonly used in applications such as data logging, firmware storage, and embedded systems where compact, reliable memory is crucial. The device is available in various package types, including SOP and WSON, facilitating integration into diverse designs.

Equivalent

The W25X05CLUXIG chip, a 5V SPI Flash memory, has several equivalent products, including the Winbond W25X05, Micron M25P05, and STMicroelectronics N25Q032. Other alternatives may include the AT25DF041 from Atmel (Microchip) and the SST25WF040 from Microchip Technology. Ensure compatibility with voltage, capacity, and interface specifications when considering substitutes.

Features

The W25X05CLUXIG is a 5 Mbit (640 Kbyte) serial NOR Flash memory chip, based on the SPI (Serial Peripheral Interface) protocol. Key features include:
1. Memory Size: 5 Mbit (640 Kbit, 80 KB) with a single block structure.
2. Data Interface: SPI-compatible, supporting both single and dual I/O modes.
3. Low Power Consumption: Operates at low voltage (2.7V to 3.6V) with low active and standby currents.
4. Fast Read Speed: High-speed read operations with a maximum clock frequency of up to 104 MHz in dual mode.
5. Efficient Programming: Supports page and sector erase, with fast programming times.
6. Endurance: Typically 100,000 program/erase cycles per sector.
7. Data Retention: Retains data for 20 years at 85°C.
8. Package Options: Available in various packages, including 8-pin SOIC and 8-pin WSON.
This chip is suitable for a variety of applications, including embedded systems, consumer electronics, and industrial devices.

Pinout

The W25X05CLUXIG is a 5V serial NOR Flash memory chip with a total of 8 pins. Its primary function is to provide non-volatile storage for firmware and data in embedded applications. The pinout and their functions are as follows:
1. CS (Chip Select): Active low signal to enable the chip.
2. SO (Serial Output): Data output for read operations.
3. WPU (Write Protect): Protects against accidental writes when held high.
4. SCK (Serial Clock): When driven high, this pin clocks data in and out.
5. SI (Serial Input): Data input for write operations.
6. HOLD: Pauses the operation without deselecting the chip (active low).
7. VCC: Power supply pin (typically 5V).
8. GND: Ground connection.
This chip supports various memory operations, including read, write, and erase, making it suitable for a wide range of applications.

Manufacturer

The W25X05CLUXIG is manufactured by Winbond Electronics Corporation, a Taiwanese semiconductor company. Winbond specializes in the design and production of memory solutions, including DRAM, Flash memory, and other storage products. Founded in 1987, the company has established itself as a key player in the global semiconductor industry, focusing on specialized memory applications such as embedded systems, consumer electronics, and industrial applications. Winbond is recognized for its innovation in memory technologies, catering to various sectors, including automotive, telecommunications, and computing. The W25X05CLUXIG is specifically a serial NOR Flash memory device that offers a storage capacity of 512 kilobits, designed for use in a variety of electronic devices and applications that require reliable non-volatile memory solutions.

Application

The W25X05CLUXIG is a 5V serial NOR Flash memory chip, commonly used in various applications including:
1. Embedded Systems: For firmware storage in microcontrollers.
2. Consumer Electronics: In devices like TVs, washing machines, and appliances for program and settings storage.
3. IoT Devices: For storing configuration data and firmware updates.
4. Automotive: Used in infotainment systems and electronic control units (ECUs).
5. Industrial Automation: In programmable logic controllers (PLCs) and industrial devices for data logging and firmware storage.
Its small form factor and reliability make it suitable for a wide range of applications requiring non-volatile memory.

Package

The W25X05CLUXIG is typically available in an 8-pin SOP (Small Outline Package) form factor. This package type is designed for surface-mount applications, providing a compact solution for integrating the memory chip into electronic devices.

Frequently Asked Questions


Q: What is the storage density and architecture of the W25X05CLUXIG?
A: This is a 512Kbit (64K x 8) NOR flash memory with a sectored architecture, featuring 16 sectors of 4Kbyte each and a page size of 256 bytes.


Q: What interface and timing does this component support?
A: It uses a synchronous Serial Peripheral Interface (SPI) and supports Dual SPI, with a maximum access time of 8ns for high-speed read operations.


Q: Is this part suitable for industrial temperature applications?
A: Yes, it has an industrial temperature grade with a wide operating range from -40°C to 85°C, making it suitable for harsh environments.


Q: What are the supply voltage requirements for operation and programming?
A: It operates with a supply voltage of 2.3V to 3.6V, with typical values at 2.5V or 3.3V. The programming voltage is within the same 2.3V to 3.6V range.


Q: What is the programming and erase performance of this chip?
A: It features a page program time of 0.8ms max and a full chip erase time of 2 seconds max, with a typical operating current of 14mA and program current of 12mA.


Q: Does this device support a boot block and ECC?
A: Yes, it includes a symmetrical boot block located at either bottom or top, but it does not support internal ECC, so external error correction may be needed.


Q: What is the package type and mounting method?
A: It comes in an 8-pin USON (SON) surface-mount package with dimensions of 2mm x 3mm and a height of 0.53mm, suitable for compact PCB designs.


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