W632GU6NB12I

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W632GU6NB12I

+BOM

IC DRAM 2GBIT 96-VFBGA

365 1일 품질 보증

7*24 영업 시간 서비스 보증

90-판매 후 1일 보증

정품 보증

사양

속성 가치
Part Status Obsolete
Base Product Number W632GU6
Digi Key Programmable Not Verified
Memory Type Volatile
Memory Format DRAM
Technology SDRAM - DDR3L
Memory Size 2Gbit
Memory Organization 128M x 16
Clock Frequency 800 MHz
Write Cycle Time - Word, Page 15ns
Voltage - Supply 1.283V ~ 1.45V
Operating Temperature -40°C ~ 95°C (TC)
Mounting Type Surface Mount
Package / Case 96-VFBGA
Supplier Device Package 96-VFBGA (7.5x13)
Packaging Tray
Access Time 20 ns

개요

Description

"W632GU6NB12I" appears to be a complex alphanumeric string and could represent a variety of things depending on the context. Without specific context, it is challenging to provide a precise introduction.
It could be a product code, a model number, a serial number, or even an internal project designation used within a company. Such identifiers are typically used for inventory management, tracking, or categorization purposes.
In a technological or industrial context, it might refer to hardware components, software versions, or specific configurations. In data systems, codes like this often ensure unique identification, helping in the organization and retrieval of information.
If this string relates to a specific field or application, additional background information would be necessary to provide a more detailed introduction. In general, these identifiers are crucial for maintaining order in databases and systems across various industries.

Equivalent

The W632GU6NB12I chip is a DDR3 SDRAM module often used in electronic devices for memory applications. Equivalent products would typically be other DDR3 SDRAM modules with similar specifications, such as memory size, speed, and voltage. Some comparable alternatives could include modules from manufacturers like Micron, Samsung, or Hynix, assuming they offer similar DDR3 configurations. It’s important to check the exact specifications to ensure compatibility with your system.

Features

The W632GU6NB12I is a DDR3L SDRAM module known for its efficiency and performance. Key features include:
1. Low Voltage Operation: Operates at 1.35V, making it energy-efficient and suitable for devices where power consumption is critical.

2. High-Speed Data Transfer: Supports data rates up to 1600 MT/s, enabling fast access and data processing.
3. Density and Capacity: Typically available in high-density configurations, which are ideal for systems requiring large memory footprints.
4. Burst Length Options: Supports burst lengths of 8 and 4, providing flexibility in data handling and transfer operations.
5. Latency Options: Offers various CAS latency settings to optimize performance based on system needs.
6. Compatibility: Designed to be compatible with a wide range of computing devices, including laptops, desktops, and servers, that support DDR3L memory.
7. Reliability: Includes features like on-die termination and error correction to ensure data integrity and reliability.
These features make the W632GU6NB12I a versatile and reliable choice for enhancing system performance while maintaining efficient power usage.

Pinout

The W632GU6NB12I is a DRAM chip produced by Winbond. It is a 2Gb DDR3 SDRAM device, typically used in applications requiring fast data processing and storage capabilities. The chip is commonly packaged in a 78-ball FBGA (Fine-pitch Ball Grid Array) configuration.
The primary functions of the W632GU6NB12I include:
1. Data Storage: Provides 2 gigabits of storage capacity.
2. High-Speed Data Transfer: Operates at various clock speeds, typically supporting DDR3 data rates.
3. Low Power Consumption: Designed to operate efficiently to extend battery life in portable devices.
4. Burst Operation: Supports burst lengths of 8 and 4 with a burst chop option.
5. Auto Refresh and Self-Refresh: Includes features for auto and self-refresh to maintain data integrity.
This chip is typically used in computing and consumer electronics requiring efficient and reliable memory solutions. For detailed pin configurations and electrical characteristics, referring to the manufacturer's datasheet would be essential.

Manufacturer

The W632GU6NB12I is a product manufactured by Winbond Electronics Corporation. Winbond is a Taiwanese company that specializes in the design and production of semiconductor products, particularly integrated circuits and memory products. They are a prominent player in the global semiconductor industry, focusing on the development of dynamic random-access memory (DRAM) and non-volatile memory (NAND Flash and NOR Flash). Winbond's products are widely used in various applications, including consumer electronics, automotive, industrial, and networking equipment. The company is known for its innovation and commitment to providing high-quality memory solutions to meet the diverse needs of its customers.

Application

The W632GU6NB12I is a 2Gb low-power DDR3 SDRAM chip commonly used in applications that require efficient memory performance with low power consumption. Its primary application areas include:
1. Mobile Devices: Smartphones and tablets where energy efficiency is crucial for battery life.
2. Embedded Systems: Utilized in a variety of devices, from automotive electronics to industrial equipment, where reliability and performance are needed.
3. Consumer Electronics: Such as smart TVs, gaming consoles, and set-top boxes for improved speed and multitasking capabilities.
4. Networking Equipment: Routers and switches benefit from its fast data access speeds.
5. IoT Devices: Enhances performance while maintaining low power usage, essential for connected devices.

Package

The package type of "W632GU6NB12I" refers to a specific configuration for memory chips, likely indicating a part number for a semiconductor component such as DRAM. Typically, the package type would describe the physical form factor and dimensions of the chip, such as BGA (Ball Grid Array) or TSOP (Thin Small Outline Package), but specific details would require checking the manufacturer's datasheet for this exact part number.

Frequently Asked Questions


Q: Is the W632GU6NB12I suitable for DDR3L applications requiring low voltage?
A: Yes, it supports a supply voltage range of 1.283V to 1.45V, compliant with DDR3L standard (1.35V nominal).


Q: What is the maximum operating frequency of this DRAM?
A: The memory operates at a maximum clock frequency of 800 MHz, corresponding to DDR3-1600 data rate.


Q: Can this component be used in extended temperature range environments?
A: Yes, it is rated for industrial temperature range from -40°C to 95°C (TC).


Q: What is the memory organization and density of this part?
A: It has a 2Gbit density organized as 128M words by 16 bits per word (128M x 16).


Q: What is the typical access time and write cycle time?
A: Access time is 20 ns, and write cycle time (word, page) is 15 ns.


Q: Is this component still in active production or obsolete?
A: The part status is listed as Obsolete, so it is not recommended for new designs.


Q: What package type does the W632GU6NB12I use?
A: It comes in a 96-ball VFBGA package (7.5x13 mm), surface mount, supplied in tray packaging.


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