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W66DP2RQQAGJ

Name: W66DP2RQQAGJ
Rating: 4.8 (15 reviews)

+BOM

8GB LPDDR4/4X, DDP, X32, 1866MHZ

제조업체화방전자
제조업체 부품 #W66DP2RQQAGJ
재고27017

365 1일 품질 보증

7*24 영업 시간 서비스 보증

90-판매 후 1일 보증

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사양

속성	가치
Part Status	Active
Memory Type	Volatile
Memory Format	DRAM
Technology	SDRAM - Mobile LPDDR4X
Memory Size	8Gbit
Memory Organization	256M x 32
Memory Interface	LVSTL_06
Clock Frequency	1.866 GHz
Write Cycle Time - Word, Page	18ns
Voltage - Supply	1.06V ~ 1.17V, 1.7V ~ 1.95V
Operating Temperature	-40°C ~ 105°C (TC)
Mounting Type	Surface Mount
Package	200-TFBGA
Supplier Device Package	200-TFBGA (10x14.5)
Packaging	Tray
Access Time	3.5 ns

개요

Description

W66DP2RQQAGJ is an alphanumeric identifier that could serve as a unique asset, part, or product code in a system. An introduction to such a code treats it as a key to traceability rather than a descriptive name, often encoding location, product family, batch, and revision. For example, a hypothetical breakdown might be:
- W66: warehouse/region or major category
- DP2: product line or model
- RQQ: batch or variant
- AGJ: revision or serial sub‑version
In practice, the exact meaning depends on the issuing system’s schema (ERP, catalog, barcode legend). Uses include inventory management, warranty tracking, service history, and compatibility checks. To interpret it accurately, consult the originating catalog or database, or request the code’s decoding map from the issuer. If you provide the context (industry, vendor, or a link), I can tailor a precise introduction and decoding steps.

Manufacturer

Manufacturer: Winbond Electronics Corporation. It is a Taiwan-based semiconductor company that designs and manufactures memory ICs (NOR/NAND flash, DRAM) and related memory products for consumer electronics, embedded systems, and automotive applications.

Package

Couldn’t verify the exact package type for W66DP2RQQAGJ without the manufacturer/datasheet. Please provide the manufacturer or a datasheet link. Alternatively, search DigiKey/Mouser for W66DP2RQQAGJ; the product page will list the package (e.g., QFN-XX, LQFP-XX, etc.).

Frequently Asked Questions

Q: What is the memory density and organization of the W66DP2RQQAGJ?
A: It features 8Gbit density organized as 256M x 32 bits, suitable for high-bandwidth mobile applications.

Q: What is the operating voltage range for this LPDDR4X SDRAM?
A: It operates on dual supplies: VDD1 from 1.06V to 1.17V and VDD2 from 1.7V to 1.95V for I/O.

Q: What is the maximum clock frequency supported by this component?
A: The device supports a clock frequency up to 1.866 GHz, enabling high-speed data transfer rates.

Q: Is this memory suitable for industrial temperature environments?
A: Yes, it has an operating temperature range of -40°C to 105°C (TC), ideal for harsh conditions.

Q: What is the typical access time and write cycle time?
A: Access time is 3.5 ns, and the write cycle time for word/page is 18 ns for low-latency operations.

Q: What package type does this LPDDR4X chip use?
A: It comes in a 200-ball TFBGA package with dimensions 10x14.5 mm, suitable for surface mount assembly.

Q: What memory interface standard does this device employ?
A: It uses the LVSTL_06 (Low Voltage Swing Termination Logic) I/O interface for power-efficient signaling.

Q: Is this component currently active and available for procurement?
A: Yes, the part status is "Active" and it is packaged in trays for reliable handling and shipping.