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XA7A50T-1CSG324Q
+BOMIC FPGA 210 I/O 324CSBGA
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제조업체AMD
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제조업체 부품 #XA7A50T-1CSG324Q
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재고6313
365 1일 품질 보증
7*24 영업 시간 서비스 보증
90-판매 후 1일 보증
정품 보증
사양
| 속성 | 가치 |
| Series | Artix-7 XA |
| PartStatus | Active |
| BaseProductNumber | XA7A50 |
| DigiKeyProgrammable | Not Verified |
| NumberofLABs/CLBs | 4075 |
| NumberofLogicElements/Cells | 52160 |
| TotalRAMBits | 2764800 |
| NumberofI/O | 210 |
| Voltage-Supply | 0.95V ~ 1.05V |
| MountingType | Surface Mount |
| OperatingTemperature | -40°C ~ 125°C (TJ) |
| Grade | Automotive |
| Qualification | AEC-Q100 |
| Package | 324-LFBGA, CSPBGA |
| SupplierDevicePackage | 324-CSPBGA (15x15) |
| Packaging | Tray |
개요
Description
Key features of the XA7A50T-1CSG324Q include:
1. Architecture: Built on a 28nm process technology, it provides a good balance between performance and power efficiency.
2. Logic Cells: It includes around 52,160 logic cells, which are used to implement complex digital circuits.
3. Block RAM: The device features approximately 2,700 Kb of block RAM for data storage and processing.
4. DSP Slices: It contains 120 DSP slices useful for digital signal processing operations.
5. I/O Capability: The FPGA has a wide array of I/O options to interface with other components.
6. Temperature Range: Designed to operate reliably across a range of temperatures, meeting automotive standards.
Overall, the XA7A50T-1CSG324Q is ideal for automotive applications requiring a balance of performance, power, and cost-effectiveness.
Equivalent
1. Intel (Altera) Cyclone V series
2. Lattice ECP5 series
3. Microsemi (Microchip) IGLOO2 series
These alternatives offer similar logic capacity and performance characteristics aimed at cost-sensitive applications. However, specific features, power consumption, and I/O configurations should be compared directly to ensure compatibility with intended applications.
Features
1. Logic Cells: Approximately 52,160 logic cells for implementing complex digital circuits.
2. DSP Slices: 120 DSP slices for high-speed arithmetic operations, suitable for signal processing tasks.
3. Block RAM: 2,700 Kb of block RAM for data storage and buffering requirements.
4. I/O Pins: Offers a variety of high-speed I/O options with a total of 210 I/O pins.
5. Power: Optimized for low power consumption, making it suitable for battery-powered and energy-efficient applications.
6. Advanced I/O Technology: Supports high-speed serial transceivers and protocols for improved data transfer rates.
7. Package: Offered in a compact CSG324 package, improving space efficiency for embedded applications.
The XA7A50T-1CSG324Q is ideal for markets such as automotive, industrial, and communication systems where cost-effectiveness and performance are critical.
Pinout
The device features increased logic density, DSP slices, and high-speed I/O capabilities. It supports various I/O standards and provides flexible configuration options for different application requirements. Key features of the XA7A50T-1CSG324Q include advanced power management and system monitoring functions.
Each pin can serve multiple purposes based on the configuration and design needs, including general-purpose I/O, differential I/O, clock management, and more. The specific function of each pin would depend on the user's design and the configuration set in the development software. Always refer to the specific datasheet and user guide for detailed pin assignments and configuration options.
Manufacturer
Application
1. Automotive Systems: Used in infotainment, driver assistance, and vehicle networking due to its reliability and performance.
2. Industrial Automation: Ideal for machine vision, robotics, and control systems.
3. Communications: Supports wireless and wired communication systems, including base stations and network equipment.
4. Consumer Electronics: Applied in advanced audio/video processing and gaming devices.
5. Aerospace and Defense: Suitable for avionics, radar, and defense communication systems due to its robust architecture.
These applications leverage the FPGA's flexibility, processing power, and energy efficiency.