사양
| 속성 | 가치 |
| Supplier | AMD Xilinx |
| Package / Case | Bulk |
| Series | Automotive, AEC-Q100, Artix-7 XA |
| Part Status | Active |
| Number of LABs/CLBs | 5900 |
| Number of Logic Elements/Cells | 75520 |
| Total RAM Bits | 3870720 |
| Number of I/O | 285 |
| Voltage - Supply | 0.95V ~ 1.05V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 125°C (TJ) |
개요
Description
XA7A75T-1FGG484Q is a Xilinx Artix-7 FPGA device (XA7A75T) optimized for low cost and mid‑density designs. It offers roughly 75k logic cells, DSP slices, block RAM, and I/O resources in a 484‑pin FG‑G484 flip‑chip package. The -1 speed grade indicates a faster member of the family, and the trailing Q denotes RoHS-compliant lead‑free packaging. Built on the 28nm Artix‑7 process, it targets power‑sensitive, high‑volume applications needing moderate logic density, DSP capability, and flexible I/O. Common uses include embedded control, motor/drive interfaces, communications, and consumer electronics. For exact specs (logic cell count, LUTs/FFs, BRAM, DSP slice count, I/O banks, transceivers), consult the official datasheet and package overview, and use Vivado for design implementation.
Equivalent
Direct equivalent: XC7A75T-1FGG484Q (Xilinx). Another common cross-reference in the same device family is XC7A75T-1FGG484I (industrial temperature). In practice, ensure same FPGA model (A75T), speed (-1), package (FGG484), and temperature/RoHS suffix when cross-referencing. For exact distributor cross-refs, check Digi-Key, Mouser, etc.
Features
XA7A75T-1FGG484Q is a Xilinx Artix-7 FPGA in a 484-ball FG-G484 package. Key features:
- 28 nm, low-power Artix-7 device
- Approximately 75K logic cells
- Rich resources: Block RAM, distributed RAM, DSP48E1 slices
- Flexible clocking with multiple PLLs/MMCMs
- High-density I/O across multiple banks (multi-voltage options)
- High-speed SERDES/tight timing for data paths
- On-chip memory, DSP for signal processing
- Configuration via SPI/JTAG options
- Package: FG G484, -1 speed grade
- RoHS compliant (suffix Q)
Ideal for cost-sensitive, high-performance embedded applications requiring a good balance of logic density, I/O, and DSP capability.
- 28 nm, low-power Artix-7 device
- Approximately 75K logic cells
- Rich resources: Block RAM, distributed RAM, DSP48E1 slices
- Flexible clocking with multiple PLLs/MMCMs
- High-density I/O across multiple banks (multi-voltage options)
- High-speed SERDES/tight timing for data paths
- On-chip memory, DSP for signal processing
- Configuration via SPI/JTAG options
- Package: FG G484, -1 speed grade
- RoHS compliant (suffix Q)
Ideal for cost-sensitive, high-performance embedded applications requiring a good balance of logic density, I/O, and DSP capability.
Pinout
- Pin count: 484 pins (FGG484 package)
- Function: Xilinx Artix-7 FPGA device (XC7A75T) in a 484-ball package, providing programmable logic, DSP, memory interfaces, and I/O for digital designs.
- Function: Xilinx Artix-7 FPGA device (XC7A75T) in a 484-ball package, providing programmable logic, DSP, memory interfaces, and I/O for digital designs.
Manufacturer
- Manufacturer: Xilinx, Inc. (now part of AMD as AMD Xilinx).
- What kind of company: A global semiconductor company that designs and manufactures programmable logic devices, primarily FPGAs (e.g., Artix-7), plus related IP and SoC products.
- What kind of company: A global semiconductor company that designs and manufactures programmable logic devices, primarily FPGAs (e.g., Artix-7), plus related IP and SoC products.
Application
XA7A75T-1FGG484Q is a 75K‑logic‑cell Artix‑7 FPGA in FG484 (speed grade -1). Common application areas:
- Industrial automation: PLCs, motor control, sensors/actuators interfaces
- Automotive electronics: gateways, body/infotainment interfaces, sensor fusion
- Communications and data processing: protocol bridging, network interfaces, SERDES/FEC control
- Embedded vision and video processing: image pre/post-processing, FPGA accelerators
- Prototyping and custom DSP/offload hardware for embedded systems
- Instrumentation, test & measurement equipment
- Medical devices and compact imaging front-ends (low power, small form factor)
- Industrial automation: PLCs, motor control, sensors/actuators interfaces
- Automotive electronics: gateways, body/infotainment interfaces, sensor fusion
- Communications and data processing: protocol bridging, network interfaces, SERDES/FEC control
- Embedded vision and video processing: image pre/post-processing, FPGA accelerators
- Prototyping and custom DSP/offload hardware for embedded systems
- Instrumentation, test & measurement equipment
- Medical devices and compact imaging front-ends (low power, small form factor)
Package
Package type: FGG484 (Flip-Chip Ball Grid Array) — 484-ball, RoHS-compliant.
