사양
| 속성 | 가치 |
| Package / Case | Tray |
| Series | Spartan®-II |
| Part Status | Active |
| Number of LABs/CLBs | 384 |
| Number of Logic Elements/Cells | 1728 |
| Total RAM Bits | 32768 |
| Number of I/O | 176 |
| Number of Gates | 50000 |
| Voltage - Supply | 2.375V ~ 2.625V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
개요
Description
XC2S50-5FGG256C is a Xilinx Spartan-2 FPGA (field-programmable gate array). It provides a reconfigurable logic fabric suitable for small-to-mid complexity digital designs, glue logic, and embedded controllers. The “XC2S50” denotes Spartan-2 with roughly fifty thousand equivalent logic gates; “-5” is the speed grade; “FGG256” refers to a 256-pin Fine-Grid Package; “C” is the temperature grade. It includes programmable logic blocks, small RAM blocks, and multiple I/O banks for standard logic levels. It is configured at power-up from an external PROM or other nonvolatile source and programmed via Xilinx ISE toolchains. Development is supported by Xilinx ISE; programming interfaces typically include JTAG or PROM configuration. Spartan-2 devices are older technology and have been largely superseded by Spartan-6 and newer families, but XC2S50 can still be used for legacy designs where cost and availability are factors. For exact specifications (I/O counts, RAM, clocking resources), consult the device datasheet.
Equivalent
Equivalent products: None. XC2S50-5FGG256C is a Spartan-2 FPGA; there are no pin-for-pin or functionally equivalent newer parts. It’s obsolete. If replacement is needed, migrate to a newer Xilinx family (Spartan-3/6, Artix-7) in a suitable package, or consider PLDs/FPGA from other vendors, which will require redesign.
Features
Key features of XC2S50-5FGG256C (Xilinx Spartan-II, 50K logic gates):
- Density: about 50K system gates (logic capacity) in a single chip
- Package: 256-pin FineLine BGA (FGG256C)
- Speed: speed grade -5 (fast)
- Logic resources: LUT-based logic cells with fast carry chains for arithmetic
- Memory: distributed RAM and shift registers for small on-chip storage
- I/O: flexible, multiple I/O banks with 3.3V I/O standards (LVTTL/LVCMOS compatible)
- Reprogrammable: FPGA fabric for custom logic, glue logic, and DSP-like functions
- Design flow: supported by Xilinx design tools and flows
Note: exact I/O counts and internal RAM/BRAM quantities vary by device family and package; refer to the datasheet for precise figures.
- Density: about 50K system gates (logic capacity) in a single chip
- Package: 256-pin FineLine BGA (FGG256C)
- Speed: speed grade -5 (fast)
- Logic resources: LUT-based logic cells with fast carry chains for arithmetic
- Memory: distributed RAM and shift registers for small on-chip storage
- I/O: flexible, multiple I/O banks with 3.3V I/O standards (LVTTL/LVCMOS compatible)
- Reprogrammable: FPGA fabric for custom logic, glue logic, and DSP-like functions
- Design flow: supported by Xilinx design tools and flows
Note: exact I/O counts and internal RAM/BRAM quantities vary by device family and package; refer to the datasheet for precise figures.
Pinout
- Pin count: 256 pins (package: FGG256C)
- Function: Xilinx Spartan-2 FPGA (XC2S50), a reconfigurable logic device (about 50K system gates) used to implement digital logic.
- Function: Xilinx Spartan-2 FPGA (XC2S50), a reconfigurable logic device (about 50K system gates) used to implement digital logic.
Manufacturer
Manufacturer: Xilinx, Inc. (now part of AMD).
What kind of company: A U.S.-based semiconductor company that designs and manufactures programmable logic devices (FPGAs and CPLDs) and provides related software tools and IP.
What kind of company: A U.S.-based semiconductor company that designs and manufactures programmable logic devices (FPGAs and CPLDs) and provides related software tools and IP.
Application
XC2S50-5FGG256C is a Spartan-2 FPGA suitable for cost‑sensitive, mid‑density designs needing custom logic, state machines, glue logic, and moderate DSP with substantial I/O. Common applications include:
- Industrial automation and motor/control systems
- Data acquisition, instrumentation, and test equipment
- Communications interfaces and protocol handling
- Embedded control in consumer electronics
- Digital signal processing and audio/video preprocessing
- Automotive and aerospace instrumentation
- Prototyping, education, and low‑volume product development
- Industrial automation and motor/control systems
- Data acquisition, instrumentation, and test equipment
- Communications interfaces and protocol handling
- Embedded control in consumer electronics
- Digital signal processing and audio/video preprocessing
- Automotive and aerospace instrumentation
- Prototyping, education, and low‑volume product development
Package
Package type: FineLine BGA (FGG256) – a 256-ball FineLine Ball Grid Array package (commercial temperature range).