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XC2V3000-4FF1152I
+BOMIC FPGA 720 I/O 1152FCBGA
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제조업체AMD
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제조업체 부품 #XC2V3000-4FF1152I
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재고3173
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사양
| 속성 | 가치 |
| Series | Virtex®-II |
| Part Status | Obsolete |
| DigiKey Programmable | Not Verified |
| Total RAM Bits | 1769472 |
| Number of I/O | 720 |
| Number of Gates | 3000000 |
| Voltage - Supply | 1.425V ~ 1.575V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package / Case | 1152-BBGA, FCBGA |
| Supplier Device Package | 1152-FCBGA (35x35) |
| Base Product Number | XC2V3000 |
| Number of LABs/CLBs | 3584 |
개요
Description
This FPGA is housed in a Fine Pitch Ball Grid Array (FBGA) package with 1152 pins, facilitating compact designs and effective thermal management. It supports various I/O standards, enabling compatibility with numerous interfaces. Additionally, the XC2V3000 integrates powerful resources, including configurable logic blocks (CLBs), digital signal processing (DSP) slices, and memory blocks, allowing for versatile design implementations.
Applications range from telecommunications to automotive systems, enabling custom hardware acceleration and real-time processing. Overall, the XC2V3000-4FF1152I provides a flexible platform for engineers to prototype and deploy high-performance digital solutions.
Equivalent
1. XC2V3000-5FF1152I (higher speed grade)
2. XC2V2000-4FF1152I (lower capacity)
3. XC2V4000 series (higher capacity)
4. Lattice ECP2M-70 (alternative manufacturer)
Ensure compatibility with design requirements when selecting an alternative.
Features
1. Logic Cells: 3,000 logic cells with a rich set of configurable options.
2. Configurable I/O: Up to 152 user I/O pins, supporting various I/O standards.
3. High-Speed Performance: Operates at a maximum internal clock frequency of 200 MHz, ensuring rapid processing speeds.
4. Embedded Block RAM: Contains embedded memory blocks for efficient data storage and manipulation.
5. DSP Slices: Equipped with dedicated DSP slices for high-speed digital signal processing.
6. Power Consumption: Designed for low power usage, making it suitable for energy-sensitive applications.
7. Advanced Configuration Options: Supports various programming techniques, including JTAG and serial configurations.
The XC2V3000-4FF1152I is widely used in telecommunications, automotive, and industrial applications due to its versatility and performance.
Pinout
Key functions of the XC2V3000 include programmable logic resources, multiple I/O configurations, embedded block RAM, and support for advanced features like distributed RAM and digital signal processing capabilities. The device operates at a core voltage of 2.5V and can be configured for various I/O standards, making it versatile for different applications.
Overall, it offers significant configurability and performance suitable for a wide range of applications in the field of electronics and digital design.
Manufacturer
Xilinx's products enable engineers and developers to create customizable hardware solutions that can be adapted for specific applications, allowing for flexibility and rapid prototyping. The XC2V3000 series is part of their Virtex family of FPGAs, which are designed for high-performance applications requiring significant logic capacity and processing power. In 2020, Xilinx was acquired by AMD (Advanced Micro Devices), further expanding its capabilities in the semiconductor market.