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XC2VP20-6FF896C
+BOMIC FPGA 556 I/O 896FCBGA
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제조업체AMD
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제조업체 부품 #XC2VP20-6FF896C
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재고4274
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사양
| 속성 | 가치 |
| Series | Virtex®-II Pro |
| PartStatus | Obsolete |
| DigiKeyProgrammable | Not Verified |
| NumberofLogicElements/Cells | 20880 |
| TotalRAMBits | 1622016 |
| NumberofI/O | 556 |
| Voltage-Supply | 1.425V ~ 1.575V |
| MountingType | Surface Mount |
| OperatingTemperature | 0°C ~ 85°C (TJ) |
| Package/Case | 896-BBGA, FCBGA |
| SupplierDevicePackage | 896-FCBGA (31x31) |
| BaseProductNumber | XC2VP20 |
| NumberofLABs/CLBs | 2320 |
개요
Description
The "6" refers to the speed grade, indicating a specific performance capability, while "FF896" denotes the package type and pin count—896 pins in a fine-pitch flip-chip package. This FPGA supports various interfaces and protocols, including PCI, Ethernet, and others, making it versatile for applications in telecommunications, automotive, and industrial automation.
Additionally, the XC2VP20 includes embedded features such as PowerPC processors, making it useful for embedded system designs. Its programmable nature allows for flexibility in design and implementation, catering to rapid prototyping and iterative development processes.
Equivalent
Features
1. Logic Capacity: Offers approximately 20,000 logic cells, enabling complex design implementations.
2. Speed Grade: Rated at -6, indicating a high-speed operation suitable for demanding applications.
3. Configurable I/O: Supports various I/O standards, allowing flexibility in interfacing with other components.
4. Block RAM: Contains embedded block RAM for efficient data storage and processing.
5. DSP Slices: Equipped with dedicated DSP slices for high-performance digital signal processing tasks.
6. High Bandwidth: Supports high-speed serial interfaces like RocketIO for fast data transfer.
7. Embedded Processors: Compatible with hard and soft processor cores for enhanced functionality.
8. Advanced Features: Includes features like partial reconfiguration and advanced clock management capabilities.
This FPGA is ideal for applications in telecommunications, automotive, and other fields requiring robust performance and flexibility.
Pinout
The primary functions of this FPGA include high-performance digital logic, signal processing, and complex data handling. It is designed for applications requiring substantial logic capacity, including telecommunications, automotive, and military systems. The chip supports various I/O standards and provides capabilities for embedded processing and connectivity.
Key characteristics include a 6-layer metal stack for optimal performance, a wide range of configurable I/O options, and support for PCI interfaces. The "6" in its designation indicates the speed grade, while the "C" signifies the specified temperature range for commercial applications.
Manufacturer
In 2020, Xilinx was acquired by Advanced Micro Devices (AMD), a multinational semiconductor company specializing in CPUs and GPUs. The acquisition has allowed Xilinx to expand its reach and integrate its FPGA technology with AMD's processing solutions, enhancing capabilities in artificial intelligence, machine learning, and high-performance computing.
Overall, Xilinx is recognized for its innovation in reconfigurable computing and continues to play a significant role in advancing digital design and embedded systems.
Application
1. Telecommunications: For high-speed data processing and routing.
2. Networking: In switches, routers, and security appliances for packet processing.
3. Aerospace and Defense: For real-time signal processing and avionics systems.
4. Medical Devices: In imaging systems and diagnostic equipment.
5. Industrial Automation: For control systems and robotics.
6. Video Processing: In video encoding/decoding and high-definition video applications.
This versatility makes it suitable for systems requiring high logic density and performance.