사양
| 속성 | 가치 |
| Package / Case | Tray |
| Series | Spartan®-3 |
| Part Status | Active |
| Number of LABs/CLBs | 5120 |
| Number of Logic Elements/Cells | 46080 |
| Total RAM Bits | 737280 |
| Number of I/O | 333 |
| Number of Gates | 2000000 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
개요
Equivalent
The XC3S2000-4FGG456I is a Spartan-3 FPGA. Equivalent alternatives include:
1. Xilinx Spartan-3E (XC3S2000E-4FGG456C) – Similar capacity, lower power.
2. Lattice ECP3 (LFE3-150EA) – Comparable FPGA with modern features.
3. Microsemi (now Microchip) ProASIC3 (A3P2000-FGG456) – Flash-based alternative.
4. Altera (now Intel) Cyclone III (EP3C40F484C8) – Similar logic density.
For exact replacements, verify specs like I/O, speed, and package.
1. Xilinx Spartan-3E (XC3S2000E-4FGG456C) – Similar capacity, lower power.
2. Lattice ECP3 (LFE3-150EA) – Comparable FPGA with modern features.
3. Microsemi (now Microchip) ProASIC3 (A3P2000-FGG456) – Flash-based alternative.
4. Altera (now Intel) Cyclone III (EP3C40F484C8) – Similar logic density.
For exact replacements, verify specs like I/O, speed, and package.
Features
The XC3S2000-4FGG456I is a Spartan-3 FPGA from Xilinx with these key features:
- Logic Cells: ~2 million (2,000K) gates
- CLB Slices: 4,320
- Max I/O Pins: 391 (456-pin Fine-Pitch BGA package)
- Block RAM: 216 Kb (12 × 18 Kb blocks)
- DSP Slices: 12 (18 × 18 multipliers)
- Speed Grade: -4 (moderate performance)
- Operating Voltage: 1.2V core, 3.3V/2.5V I/O
- Clock Management: 4 DCMs (Digital Clock Managers)
- On-Chip Termination: Yes (supports DDR)
- Temperature Range: Industrial (-40°C to +100°C)
Ideal for embedded systems, DSP, and high-I/O applications. Compact but powerful for its era.
- Logic Cells: ~2 million (2,000K) gates
- CLB Slices: 4,320
- Max I/O Pins: 391 (456-pin Fine-Pitch BGA package)
- Block RAM: 216 Kb (12 × 18 Kb blocks)
- DSP Slices: 12 (18 × 18 multipliers)
- Speed Grade: -4 (moderate performance)
- Operating Voltage: 1.2V core, 3.3V/2.5V I/O
- Clock Management: 4 DCMs (Digital Clock Managers)
- On-Chip Termination: Yes (supports DDR)
- Temperature Range: Industrial (-40°C to +100°C)
Ideal for embedded systems, DSP, and high-I/O applications. Compact but powerful for its era.
Application
The XC3S2000-4FGG456I, a Spartan-3 FPGA by Xilinx, is used in:
- Embedded Systems (industrial control, automation)
- Communications (routers, baseband processing)
- Consumer Electronics (HDTV, gaming)
- Medical Devices (imaging, diagnostics)
- Military/Aerospace (radar, avionics)
- Prototyping & Education (R&D, academic projects)
Its high logic density (2M gates), low power, and 456-pin BGA package make it suitable for cost-sensitive, mid-complexity designs.
- Embedded Systems (industrial control, automation)
- Communications (routers, baseband processing)
- Consumer Electronics (HDTV, gaming)
- Medical Devices (imaging, diagnostics)
- Military/Aerospace (radar, avionics)
- Prototyping & Education (R&D, academic projects)
Its high logic density (2M gates), low power, and 456-pin BGA package make it suitable for cost-sensitive, mid-complexity designs.
Package
The XC3S2000-4FGG456I is a Spartan-3 series FPGA from Xilinx. It comes in a 456-pin Fine-Pitch Ball Grid Array (FBGA) package (FGG456). The "4" indicates its speed grade (-4), and "I" denotes an industrial temperature range (-40°C to +100°C). This package is compact and suitable for high-density, high-performance applications.
