사양
| 속성 | 가치 |
| Package | Bulk |
| Series | Spartan®-3 |
| ProductStatus | Active |
| NumberofLABs/CLBs | 896 |
| NumberofLogicElements/Cells | 8064 |
| TotalRAMBits | 294912 |
| NumberofI/O | 264 |
| NumberofGates | 400000 |
| Voltage-Supply | 1.14V ~ 1.26V |
| MountingType | Surface Mount |
| OperatingTemperature | 0°C ~ 85°C (TJ) |
| Package/Case | 456-BBGA |
개요
Description
The XC3S400-4FG456C is a member of the Xilinx Spartan-3 FPGA family, specifically designed for cost-sensitive applications. It offers a balance of performance and price, suitable for use in consumer electronics, telecommunications, and networking. Key features include 400,000 system gates, a -4 speed grade, and a 456-pin fine-pitch ball grid array (FG456) package. It supports a range of I/O standards, including LVTTL, LVCMOS, PCI, and others, providing versatility in interfacing with various components. The FPGA architecture is built on a 90 nm process technology, which ensures efficient power usage and performance. It also includes features like block RAM, distributed RAM, and Digital Clock Managers (DCMs) for clock management. The Spartan-3 series emphasizes low power consumption and cost efficiency while providing robust performance, making the XC3S400-4FG456C an ideal choice for developing flexible and scalable digital designs. Additionally, it is compatible with Xilinx's development tools like ISE Design Suite, which aids in the efficient design and deployment of projects using this FPGA.
Equivalent
The XC3S400-4FG456C is a Xilinx Spartan-3 FPGA. Equivalent products could include similar FPGA models from other manufacturers that match its specifications, such as Altera's Cyclone II or Cyclone III series, Lattice Semiconductor's ECP2 series, and Microsemi's IGLOO series. These alternatives vary in terms of logic elements, I/O pins, and power consumption, so it is crucial to compare specific requirements when selecting an equivalent part.
Features
The XC3S400-4FG456C is part of the Xilinx Spartan-3 FPGA family. Key features include:
1. Logic Cells: It contains approximately 400,000 system gates with 8,064 logic cells.
2. Configurable Logic Blocks (CLBs): The device includes CLBs for implementing combinatorial and sequential circuits.
3. Block RAM: Offers 360 Kbits of block RAM for data storage.
4. I/O Pins: Provides up to 264 user I/O pins for interfacing with external components.
5. Speed Grade: The "-4" denotes the speed grade, indicating its operational speed capabilities.
6. Package: The FG456 package specifies a fine-pitch ball grid array with 456 pins.
7. Voltage: Operates on a core voltage of 1.2V and I/O voltage standards from 1.2V to 3.3V.
8. Performance: Designed for high-performance and cost-sensitive applications, with efficient power consumption.
These features make the XC3S400-4FG456C suitable for a variety of digital system designs, including consumer electronics, telecommunications, and industrial applications.
1. Logic Cells: It contains approximately 400,000 system gates with 8,064 logic cells.
2. Configurable Logic Blocks (CLBs): The device includes CLBs for implementing combinatorial and sequential circuits.
3. Block RAM: Offers 360 Kbits of block RAM for data storage.
4. I/O Pins: Provides up to 264 user I/O pins for interfacing with external components.
5. Speed Grade: The "-4" denotes the speed grade, indicating its operational speed capabilities.
6. Package: The FG456 package specifies a fine-pitch ball grid array with 456 pins.
7. Voltage: Operates on a core voltage of 1.2V and I/O voltage standards from 1.2V to 3.3V.
8. Performance: Designed for high-performance and cost-sensitive applications, with efficient power consumption.
These features make the XC3S400-4FG456C suitable for a variety of digital system designs, including consumer electronics, telecommunications, and industrial applications.
Pinout
The XC3S400-4FG456C is a member of the Xilinx Spartan-3 FPGA family. This particular model features a Fine-Pitch Ball Grid Array (FBGA) package. The "FG456" designation indicates that the package has 456 pins. These pins are used for a variety of functions including power supplies, ground connections, configuration, clock inputs, input/output blocks (IOBs), and other specialized functions. The FPGA itself contains 400,000 system gates and is designed for a range of applications that demand cost-effective performance. It supports up to 264 user I/O pins, depending on how the I/O banks are configured and used. Spartan-3 family FPGAs are generally used in applications such as consumer electronics, automotive, industrial control, and telecommunications, where they provide a good balance of performance, power, and cost.
Manufacturer
The XC3S400-4FG456C is manufactured by Xilinx, Inc., which is a company that specializes in the development and production of programmable logic devices. Xilinx is well-known for its field-programmable gate arrays (FPGAs), which are integrated circuits that can be configured by the customer or designer after manufacturing—hence the term "field-programmable." These FPGAs are widely used in various industries, including telecommunications, automotive, consumer electronics, and data centers, for their versatility and capability to be programmed for specific applications.
As of October 2020, Xilinx was acquired by Advanced Micro Devices, Inc. (AMD), a major player in the semiconductor industry, known for its processors and graphics technologies. The acquisition aimed to strengthen AMD’s position in the data center market and enhance its product offerings with Xilinx’s FPGA technology.
As of October 2020, Xilinx was acquired by Advanced Micro Devices, Inc. (AMD), a major player in the semiconductor industry, known for its processors and graphics technologies. The acquisition aimed to strengthen AMD’s position in the data center market and enhance its product offerings with Xilinx’s FPGA technology.
Application
The XC3S400-4FG456C is a Spartan-3 FPGA from Xilinx, commonly used in various applications due to its flexibility and cost-effectiveness. Key application areas include:
1. Embedded Systems: For developing custom logic and control functions.
2. Digital Signal Processing (DSP): Used in audio, video, and communications for real-time processing.
3. Communications: Enables protocol implementation and data handling in networking equipment.
4. Industrial Automation: Used in control systems for robotics and machinery.
5. Consumer Electronics: Powers digital devices requiring custom interfacing and processing.
6. Prototyping and Development: Facilitates the design and testing of new digital circuits.
Its adaptability makes it suitable for a wide range of electronic applications.
1. Embedded Systems: For developing custom logic and control functions.
2. Digital Signal Processing (DSP): Used in audio, video, and communications for real-time processing.
3. Communications: Enables protocol implementation and data handling in networking equipment.
4. Industrial Automation: Used in control systems for robotics and machinery.
5. Consumer Electronics: Powers digital devices requiring custom interfacing and processing.
6. Prototyping and Development: Facilitates the design and testing of new digital circuits.
Its adaptability makes it suitable for a wide range of electronic applications.
Package
The XC3S400-4FG456C is a part of Xilinx's Spartan-3 FPGA family. The package type "FG456" refers to a Fine-Pitch Ball Grid Array (FBGA) with 456 pins. This packaging is typically compact, supporting high-density interconnections suitable for various electronic applications.