사양
| 속성 | 가치 |
| Package / Case | Tray |
| Series | Spartan®-3 |
| Part Status | Active |
| Number of LABs/CLBs | 896 |
| Number of Logic Elements/Cells | 8064 |
| Total RAM Bits | 294912 |
| Number of I/O | 264 |
| Number of Gates | 400000 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
개요
Description
The XC3S400-4FGG456C is a model from the Xilinx Spartan-3 family of FPGAs (Field Programmable Gate Arrays), designed for low-cost and high-performance applications. Key features include 400,000 system gates, a 90 nm manufacturing process, and an array of configurable logic blocks (CLBs) that allow for flexible digital circuit design. The "-4" denotes its speed grade, providing a balance between performance and power consumption. The "FGG456" refers to the package type and pin count, indicating a fine-pitch BGA (Ball Grid Array) with 456 pins, suitable for complex routing requirements. The "C" at the end specifies the commercial temperature range, ensuring reliable operation within 0°C to 85°C. This FPGA model supports a wide range of I/O standards and includes features like block RAM, digital clock managers (DCMs), and support for embedded multipliers, making it suitable for applications in communications, consumer electronics, and industrial control. It is also compatible with Xilinx's ISE (Integrated Software Environment) for programming and development.
Equivalent
The XC3S400-4FGG456C is a member of the Xilinx Spartan-3 FPGA family. Equivalent products from other manufacturers include the Altera (now Intel) Cyclone II family, specifically the EP2C35 series, and the Lattice Semiconductor ECP2 series such as the LFE2-35 series. These alternatives offer similar logic capacity and performance characteristics suitable for various digital design applications. Always verify pin compatibility and specific feature requirements when considering alternatives.
Features
The XC3S400-4FGG456C is part of the Xilinx Spartan-3 FPGA family. Key features include:
1. Logic Resources: It has approximately 400,000 system gates and 8,064 logic cells.
2. Configurable Logic Blocks (CLBs): Contains 896 CLBs, each with four slices, to implement logic.
3. Memory: 360Kb of Block RAM for data storage.
4. I/O: It provides 264 user I/O pins with a variety of I/O standards, including LVTTL, LVCMOS, and more.
5. Clock Management: Includes four Digital Clock Managers (DCMs) for clock signal management.
6. Performance: Operates with a speed grade of -4.
7. Package: Comes in a 456-pin Fine Pitch Ball Grid Array (FBGA) package.
8. Power: Designed for low power consumption, suitable for cost-sensitive applications.
These features make the XC3S400-4FGG456C ideal for a range of applications including consumer electronics, automotive, and industrial systems, providing a balance of performance, capacity, and cost.
1. Logic Resources: It has approximately 400,000 system gates and 8,064 logic cells.
2. Configurable Logic Blocks (CLBs): Contains 896 CLBs, each with four slices, to implement logic.
3. Memory: 360Kb of Block RAM for data storage.
4. I/O: It provides 264 user I/O pins with a variety of I/O standards, including LVTTL, LVCMOS, and more.
5. Clock Management: Includes four Digital Clock Managers (DCMs) for clock signal management.
6. Performance: Operates with a speed grade of -4.
7. Package: Comes in a 456-pin Fine Pitch Ball Grid Array (FBGA) package.
8. Power: Designed for low power consumption, suitable for cost-sensitive applications.
These features make the XC3S400-4FGG456C ideal for a range of applications including consumer electronics, automotive, and industrial systems, providing a balance of performance, capacity, and cost.
Pinout
The XC3S400-4FGG456C is a part of Xilinx's Spartan-3 FPGA family. This particular model comes in an FGG456 package, which is a Fine-Pitch Ball Grid Array (FBGA) with 456 pins. The main function of the XC3S400 is to provide a flexible and reconfigurable logic platform suitable for a wide range of applications, including digital signal processing, communications, and embedded systems.
Key features of the XC3S400 include:
1. Logic Gates: It contains approximately 400,000 system gates.
2. Configurable Logic Blocks (CLBs): These are used to implement logic functions and are the building blocks of the FPGA.
3. I/O Blocks: The device supports a wide variety of I/O standards and features multiple I/O banks for flexibility.
4. Distributed RAM: Provides storage resources that can be configured as RAM, ROM, or FIFOs.
5. Block RAM: Larger memory blocks available for more extensive storage requirements.
6. Digital Clock Managers (DCMs): Used for precise control of clock management and distribution.
The XC3S400-4FGG456C is optimized for low cost and power consumption while providing the performance needed for a wide range of applications.
Key features of the XC3S400 include:
1. Logic Gates: It contains approximately 400,000 system gates.
2. Configurable Logic Blocks (CLBs): These are used to implement logic functions and are the building blocks of the FPGA.
3. I/O Blocks: The device supports a wide variety of I/O standards and features multiple I/O banks for flexibility.
4. Distributed RAM: Provides storage resources that can be configured as RAM, ROM, or FIFOs.
5. Block RAM: Larger memory blocks available for more extensive storage requirements.
6. Digital Clock Managers (DCMs): Used for precise control of clock management and distribution.
The XC3S400-4FGG456C is optimized for low cost and power consumption while providing the performance needed for a wide range of applications.
Manufacturer
The XC3S400-4FGG456C is manufactured by Xilinx, Inc. Xilinx is a leading technology company specializing in the design and production of programmable logic devices, notably Field Programmable Gate Arrays (FPGAs), which are used in a wide range of electronic applications. FPGAs like those made by Xilinx are known for their flexibility and adaptability, allowing designers to configure them for specific tasks after manufacturing. Xilinx was a pioneer in the FPGA industry and is recognized for its innovation in developing high-performance, cost-effective programmable logic solutions. In 2020, Xilinx was acquired by Advanced Micro Devices, Inc. (AMD), a major player in the semiconductor industry known for its CPUs and GPUs, further enhancing its capabilities in providing comprehensive solutions for various computing and processing needs.
Application
The XC3S400-4FGG456C is a member of the Xilinx Spartan-3 FPGA family, designed for cost-sensitive applications. It is commonly used in areas such as consumer electronics, automotive systems, telecommunications, industrial automation, and medical devices. These FPGAs are often chosen for applications requiring moderate logic density, low power consumption, and high processing speed. They are ideal for prototyping, digital signal processing, and embedded system design, as well as for implementing custom digital circuits that demand flexibility and swift reconfiguration. Their use in educational and research settings for teaching and developing digital systems is also notable.
Package
The XC3S400-4FGG456C is a Field Programmable Gate Array (FPGA) from Xilinx's Spartan-3 family. Its package type is FGG456, which refers to a Fine-Pitch Ball Grid Array (FBGA) with 456 pins. This package is designed for high-density and compact applications.