사양
| 속성 | 가치 |
| Supplier | AMD Xilinx |
| Package / Case | Bulk |
| Series | Spartan®-3 |
| Part Status | Active |
| Number of LABs/CLBs | 6912 |
| Number of Logic Elements/Cells | 62208 |
| Total RAM Bits | 1769472 |
| Number of I/O | 489 |
| Number of Gates | 4000000 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
개요
Description
XC3S4000-4FG676C is a Xilinx Spartan-3 FPGA of mid density, suitable for cost‑sensitive digital designs.
Key points
- Density and speed: about 4000 logic cells; speed grade -4.
- Package: FG676C FineLine BGA with 676 balls (I/O availability depends on bank usage).
- Architecture: LUT-based logic fabric with flip-flops, plus block RAM and distributed RAM; clock management via DCM/PLL; multiple I/O banks and standard configuration options (SPI/JTAG).
- Tools and languages: supported by Xilinx ISE design suite; design with Verilog or VHDL; bitstream programmed via JTAG or SPI.
- Applications: mid‑range embedded glue logic, interfaces, and moderate digital logic tasks.
- considerations: is a legacy device; for new designs, consider newer families (e.g., Spartan‑7, Artix) with updated tooling and resources. Always consult the official datasheet for exact I/O counts, RAM, and timing specs.
Key points
- Density and speed: about 4000 logic cells; speed grade -4.
- Package: FG676C FineLine BGA with 676 balls (I/O availability depends on bank usage).
- Architecture: LUT-based logic fabric with flip-flops, plus block RAM and distributed RAM; clock management via DCM/PLL; multiple I/O banks and standard configuration options (SPI/JTAG).
- Tools and languages: supported by Xilinx ISE design suite; design with Verilog or VHDL; bitstream programmed via JTAG or SPI.
- Applications: mid‑range embedded glue logic, interfaces, and moderate digital logic tasks.
- considerations: is a legacy device; for new designs, consider newer families (e.g., Spartan‑7, Artix) with updated tooling and resources. Always consult the official datasheet for exact I/O counts, RAM, and timing specs.
Features
Here are the key features of XC3S4000-4FG676C (Spartan-3S, 676-ball BGA):
- FPGA family: Spartan-3S
- Logic resources: about 4,000 logic cells
- Package: FG676C (676-pin Fine-Grain BGA)
- Speed grade: -4
- Temperature: Commercial range
- I/O: High-density 3.3V I/O with multiple standards (LVTTL/LVCMOS, etc.)
- Clocking: Digital Clock Manager (DCM) and PLL support for flexible clocking
- Memory: On-chip RAM resources (distributed RAM) for flexible data storage
- Configuration/Debug: JTAG boundary-scan support for programming and debugging
- Power/Cost: Low-cost, suitable for mid-density, cost-sensitive designs
Note: For exact I/O counts, RAM sizes, and timing details, consult the Xilinx datasheet for XC3S4000-4FG676C.
- FPGA family: Spartan-3S
- Logic resources: about 4,000 logic cells
- Package: FG676C (676-pin Fine-Grain BGA)
- Speed grade: -4
- Temperature: Commercial range
- I/O: High-density 3.3V I/O with multiple standards (LVTTL/LVCMOS, etc.)
- Clocking: Digital Clock Manager (DCM) and PLL support for flexible clocking
- Memory: On-chip RAM resources (distributed RAM) for flexible data storage
- Configuration/Debug: JTAG boundary-scan support for programming and debugging
- Power/Cost: Low-cost, suitable for mid-density, cost-sensitive designs
Note: For exact I/O counts, RAM sizes, and timing details, consult the Xilinx datasheet for XC3S4000-4FG676C.
Pinout
- Pin count: 676 pins (FG676 package)
- Function: Xilinx Spartan-3 FPGA device (XC3S4000) with about 4000 logic cells, a reconfigurable digital logic FPGA.
- Function: Xilinx Spartan-3 FPGA device (XC3S4000) with about 4000 logic cells, a reconfigurable digital logic FPGA.
Manufacturer
Manufacturer: Xilinx, Inc. (now a wholly owned subsidiary of AMD).
What kind of company: A semiconductor company that designs and manufactures programmable logic devices, primarily FPGAs and CPLDs, plus related products and solutions.
What kind of company: A semiconductor company that designs and manufactures programmable logic devices, primarily FPGAs and CPLDs, plus related products and solutions.
Application
XC3S4000-4FG676C is a Spartan-3 FPGA suitable for cost-effective, moderate‑density digital designs. Typical application areas include:
- Digital signal processing and DSP accelerators
- Embedded systems and peripheral interfaces (memory/controllers, glue logic)
- Networking and communications hardware
- Data acquisition, instrumentation and test equipment
- Industrial automation and motor control
- Automotive electronics and sensor processing
- Consumer electronics, multimedia, and display controllers
- Prototyping, education, research, and HDL development
These boards benefit from reconfigurability, I/O flexibility, and midrange logic capacity.
- Digital signal processing and DSP accelerators
- Embedded systems and peripheral interfaces (memory/controllers, glue logic)
- Networking and communications hardware
- Data acquisition, instrumentation and test equipment
- Industrial automation and motor control
- Automotive electronics and sensor processing
- Consumer electronics, multimedia, and display controllers
- Prototyping, education, research, and HDL development
These boards benefit from reconfigurability, I/O flexibility, and midrange logic capacity.
Package
XC3S4000-4FG676C uses the FG676 FineLine BGA package (676 balls), commercial temperature grade.
