사양
| 속성 | 가치 |
| Package / Case | Tray |
| Series | Spartan®-3AN |
| Part Status | Active |
| Number of LABs/CLBs | 896 |
| Number of Logic Elements/Cells | 8064 |
| Total RAM Bits | 368640 |
| Number of I/O | 311 |
| Number of Gates | 400000 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
개요
Description
The XC3S400AN-4FGG400C is a Spartan-3AN FPGA from Xilinx, featuring 400,000 system gates, 8064 logic cells, and 288 KB block RAM. It operates at a -4 speed grade (moderate performance) and comes in a 400-pin Fine-Pitch Ball Grid Array (FBGA) package (FGG400).
Key features:
- Non-volatile, flash-based (no external configuration memory needed).
- Low-power, suitable for embedded systems.
- On-chip clock management (DCM blocks).
- 216 user I/Os supporting multiple standards (LVCMOS, LVTTL, etc.).
- Industrial temperature range (-40°C to +100°C).
Common applications: Industrial control, automotive, communications, and consumer electronics.
The -4FGG400C suffix indicates speed grade, package, and lead-free (Pb-free) compliance.
Key features:
- Non-volatile, flash-based (no external configuration memory needed).
- Low-power, suitable for embedded systems.
- On-chip clock management (DCM blocks).
- 216 user I/Os supporting multiple standards (LVCMOS, LVTTL, etc.).
- Industrial temperature range (-40°C to +100°C).
Common applications: Industrial control, automotive, communications, and consumer electronics.
The -4FGG400C suffix indicates speed grade, package, and lead-free (Pb-free) compliance.
Equivalent
The XC3S400AN-4FGG400C is a Spartan-3 FPGA. Equivalent alternatives include:
1. Xilinx Spartan-3E (XC3S400E) – Similar capacity, lower power.
2. Lattice ECP3 (LFE3-40EA) – Comparable FPGA family.
3. Microsemi (now Microchip) ProASIC3 (A3P400) – Flash-based alternative.
4. Altera (now Intel) Cyclone III (EP3C40) – Competing FPGA series.
Check pin compatibility and features before substitution. For exact replacements, consult Xilinx (AMD) documentation or distributors.
1. Xilinx Spartan-3E (XC3S400E) – Similar capacity, lower power.
2. Lattice ECP3 (LFE3-40EA) – Comparable FPGA family.
3. Microsemi (now Microchip) ProASIC3 (A3P400) – Flash-based alternative.
4. Altera (now Intel) Cyclone III (EP3C40) – Competing FPGA series.
Check pin compatibility and features before substitution. For exact replacements, consult Xilinx (AMD) documentation or distributors.
Pinout
The XC3S400AN-4FGG400C is a Spartan-3AN FPGA from Xilinx with 400,000 system gates.
- Pin Count: 400 pins (FGG400 package, Fine-Pitch Ball Grid Array).
- Key Functions:
- I/O Pins: 311 user I/Os (supports multiple standards: LVCMOS, LVTTL, HSTL, SSTL).
- Configuration: Onboard flash memory for configuration storage (supports SPI, BPI, or JTAG programming).
- Logic Resources: 8,064 logic cells, 56Kb block RAM, 16 multipliers.
- Clock Management: 4 digital clock managers (DCMs) for clock synthesis/delay.
Designed for embedded applications requiring non-volatile storage and low power.
- Pin Count: 400 pins (FGG400 package, Fine-Pitch Ball Grid Array).
- Key Functions:
- I/O Pins: 311 user I/Os (supports multiple standards: LVCMOS, LVTTL, HSTL, SSTL).
- Configuration: Onboard flash memory for configuration storage (supports SPI, BPI, or JTAG programming).
- Logic Resources: 8,064 logic cells, 56Kb block RAM, 16 multipliers.
- Clock Management: 4 digital clock managers (DCMs) for clock synthesis/delay.
Designed for embedded applications requiring non-volatile storage and low power.
Package
The XC3S400AN-4FGG400C is a Spartan-3AN FPGA from Xilinx. It comes in a 400-pin Fine-Pitch Ball Grid Array (FBGA) package (FGG400). This package is surface-mount, offers high-density interconnects, and is suitable for compact, high-performance designs. The "AN" suffix indicates it has integrated flash memory for configuration. The "4" denotes a speed grade of -4.
